JPH0529298B2 - - Google Patents
Info
- Publication number
- JPH0529298B2 JPH0529298B2 JP25669289A JP25669289A JPH0529298B2 JP H0529298 B2 JPH0529298 B2 JP H0529298B2 JP 25669289 A JP25669289 A JP 25669289A JP 25669289 A JP25669289 A JP 25669289A JP H0529298 B2 JPH0529298 B2 JP H0529298B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- solder
- plating layer
- metal cap
- cylindrical ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 description 46
- 239000002184 metal Substances 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 39
- 239000003985 ceramic capacitor Substances 0.000 description 35
- 238000007747 plating Methods 0.000 description 29
- 230000002093 peripheral effect Effects 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25669289A JPH03116917A (ja) | 1989-09-29 | 1989-09-29 | 筒型セラミックコンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25669289A JPH03116917A (ja) | 1989-09-29 | 1989-09-29 | 筒型セラミックコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03116917A JPH03116917A (ja) | 1991-05-17 |
| JPH0529298B2 true JPH0529298B2 (enrdf_load_stackoverflow) | 1993-04-30 |
Family
ID=17296153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25669289A Granted JPH03116917A (ja) | 1989-09-29 | 1989-09-29 | 筒型セラミックコンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116917A (enrdf_load_stackoverflow) |
-
1989
- 1989-09-29 JP JP25669289A patent/JPH03116917A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03116917A (ja) | 1991-05-17 |