JPH0528758Y2 - - Google Patents

Info

Publication number
JPH0528758Y2
JPH0528758Y2 JP1985028518U JP2851885U JPH0528758Y2 JP H0528758 Y2 JPH0528758 Y2 JP H0528758Y2 JP 1985028518 U JP1985028518 U JP 1985028518U JP 2851885 U JP2851885 U JP 2851885U JP H0528758 Y2 JPH0528758 Y2 JP H0528758Y2
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
nozzle
water
susceptor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985028518U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61144636U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985028518U priority Critical patent/JPH0528758Y2/ja
Publication of JPS61144636U publication Critical patent/JPS61144636U/ja
Application granted granted Critical
Publication of JPH0528758Y2 publication Critical patent/JPH0528758Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP1985028518U 1985-02-28 1985-02-28 Expired - Lifetime JPH0528758Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985028518U JPH0528758Y2 (fr) 1985-02-28 1985-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985028518U JPH0528758Y2 (fr) 1985-02-28 1985-02-28

Publications (2)

Publication Number Publication Date
JPS61144636U JPS61144636U (fr) 1986-09-06
JPH0528758Y2 true JPH0528758Y2 (fr) 1993-07-23

Family

ID=30526465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985028518U Expired - Lifetime JPH0528758Y2 (fr) 1985-02-28 1985-02-28

Country Status (1)

Country Link
JP (1) JPH0528758Y2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (fr) * 1973-01-02 1974-09-19
JPS5493972A (en) * 1978-01-06 1979-07-25 Mitsubishi Electric Corp Etching unit of semiconductor element
JPS5580319A (en) * 1978-12-12 1980-06-17 Nec Corp Manufacture of semiconductor device
JPS5844838B2 (ja) * 1979-08-06 1983-10-05 鈴木シヤツタ−工業株式会社 シャツタ−の随時閉鎖手動操作箱

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844838U (ja) * 1981-09-21 1983-03-25 三菱電機株式会社 ウエ−ハ洗浄乾燥装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (fr) * 1973-01-02 1974-09-19
JPS5493972A (en) * 1978-01-06 1979-07-25 Mitsubishi Electric Corp Etching unit of semiconductor element
JPS5580319A (en) * 1978-12-12 1980-06-17 Nec Corp Manufacture of semiconductor device
JPS5844838B2 (ja) * 1979-08-06 1983-10-05 鈴木シヤツタ−工業株式会社 シャツタ−の随時閉鎖手動操作箱

Also Published As

Publication number Publication date
JPS61144636U (fr) 1986-09-06

Similar Documents

Publication Publication Date Title
US7037853B2 (en) Wafer cleaning apparatus
US7597765B2 (en) Post etch wafer surface cleaning with liquid meniscus
JPH10144650A (ja) 半導体材料の洗浄装置
JP2005183937A (ja) 半導体装置の製造方法およびレジスト除去用洗浄装置
US6100198A (en) Post-planarization, pre-oxide removal ozone treatment
CN110335807A (zh) 一种硅片清洗方法
JP4702920B2 (ja) 基板処理方法および基板処理装置
JPS6325661B2 (fr)
US6360756B1 (en) Wafer rinse tank for metal etching and method for using
JPH0528758Y2 (fr)
JP2009021617A (ja) 基板処理方法
GB2335309A (en) Forming and cleaning semiconductor wafers
KR20110133280A (ko) 반도체 기판의 세정 장치 및 이를 이용한 반도체 기판의 세정 방법
JPH0697136A (ja) 基板洗浄方法およびその装置
JPS61166134A (ja) 処理装置
JPH01140727A (ja) 基板洗浄方法
US20020179112A1 (en) Method of cleaning electronic device
JPH03274722A (ja) 半導体装置の製造方法及び製造装置
US11806767B2 (en) Substrate processing apparatus and substrate processing method
JPH07122530A (ja) 半導体装置の製造方法
JP3000997B1 (ja) 半導体洗浄装置及び半導体装置の洗浄方法
JPH065579A (ja) 半導体ウエハの洗浄方法
JPH07297162A (ja) 半導体基板洗浄装置
KR19980050047U (ko) 웨이퍼 세척 장치
JPH02152232A (ja) 洗浄方法