JPH0528037B2 - - Google Patents
Info
- Publication number
- JPH0528037B2 JPH0528037B2 JP59134146A JP13414684A JPH0528037B2 JP H0528037 B2 JPH0528037 B2 JP H0528037B2 JP 59134146 A JP59134146 A JP 59134146A JP 13414684 A JP13414684 A JP 13414684A JP H0528037 B2 JPH0528037 B2 JP H0528037B2
- Authority
- JP
- Japan
- Prior art keywords
- line
- matrix
- photocells
- photocell
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Color Television Image Signal Generators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8310911 | 1983-06-30 | ||
| FR8310911A FR2548505B1 (fr) | 1983-06-30 | 1983-06-30 | Camera de television en couleur, a imageur solide a transfert de lignes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068789A JPS6068789A (ja) | 1985-04-19 |
| JPH0528037B2 true JPH0528037B2 (enrdf_load_html_response) | 1993-04-23 |
Family
ID=9290363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59134146A Granted JPS6068789A (ja) | 1983-06-30 | 1984-06-30 | ライン転送式固体撮像装置を有するカラ−テレビカメラ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6068789A (enrdf_load_html_response) |
| FR (1) | FR2548505B1 (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE44431E1 (en) | 2003-11-10 | 2013-08-13 | Stats Chippac, Ltd. | Bump-on-lead flip chip interconnection |
| USRE44500E1 (en) | 2003-11-10 | 2013-09-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming composite bump-on-lead interconnection |
| US8841779B2 (en) | 2005-03-25 | 2014-09-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate |
| US9064858B2 (en) | 2003-11-10 | 2015-06-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming bump-on-lead interconnection |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853830B2 (ja) * | 1977-07-13 | 1983-12-01 | 株式会社日立製作所 | カラ−固体撮像装置 |
| JPS55179473U (enrdf_load_html_response) * | 1979-06-08 | 1980-12-23 | ||
| JPS5678364U (enrdf_load_html_response) * | 1979-11-14 | 1981-06-25 | ||
| FR2503502B1 (fr) * | 1981-03-31 | 1985-07-05 | Thomson Csf | Dispositif d'analyse d'images en couleur utilisant le transfert de charges electriques et camera de television comportant un tel dispositif |
| JPS5866766U (ja) * | 1981-10-28 | 1983-05-06 | 株式会社日立製作所 | 固体撮像素子 |
-
1983
- 1983-06-30 FR FR8310911A patent/FR2548505B1/fr not_active Expired
-
1984
- 1984-06-30 JP JP59134146A patent/JPS6068789A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE44431E1 (en) | 2003-11-10 | 2013-08-13 | Stats Chippac, Ltd. | Bump-on-lead flip chip interconnection |
| USRE44500E1 (en) | 2003-11-10 | 2013-09-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming composite bump-on-lead interconnection |
| US9064858B2 (en) | 2003-11-10 | 2015-06-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming bump-on-lead interconnection |
| US8841779B2 (en) | 2005-03-25 | 2014-09-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2548505B1 (fr) | 1986-01-24 |
| FR2548505A1 (fr) | 1985-01-04 |
| JPS6068789A (ja) | 1985-04-19 |
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