JPH05267540A - Packaging structure for semiconductor device - Google Patents

Abstract

PURPOSE:To directly interconnect a power supply pattern of a semiconductor device with a substrate without mediating a terminal in the substrate for packaging the semiconductor device by providing a space for accommodating welding a connection part in the substrate. CONSTITUTION:A semiconductor package 7 including a power supply pattern 5 and a connection land 6 is welding and connected with a packaging substrate 1 having a recessed portion 8 for accommodating a welding connection part 3. Thereupon, the welding connection part 3 connects a signal line of a semiconductor package 7 with the substrate and the welding connection part 9 connects a power supply line with the substrate. Hereby, power supply impedance is decreased without the need of providing a power supply terminal and without increasing the number of terminals. Thus, heat radiation effect is improved because a semiconductor device is brought into close contact with the packaging substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting structure.

[0002]

2. Description of the Related Art In the conventional mounting structure, as shown in FIG. 3, a connection land 6a is individually connected to a signal line of an internal semiconductor element and a connection is individually connected to a power line of an internal semiconductor element on an end surface of a semiconductor package 7. The land 6b is provided.

On the other hand, the connection land 6 is provided on the end surface of the mounting substrate 1.
It has connection lands 2a and 2b interconnected to a and 6b.

Then, the semiconductor package 7 and the mounting substrate 1
The connection lands 6a, 2a, 6b, 2b for connection with
Was connected by.

[0005]

In this conventional mounting method, the power supply line of the semiconductor element must be individually provided as a connection land from the semiconductor package like other signal lines, and the processing signal speed of the semiconductor element can be reduced. There has been a problem that the increase in the number of power supply terminals, which increases with the increase, can be dealt with only by increasing the number of connection lands.

Further, there is a problem that the semiconductor package does not adhere to the mounting substrate due to the welded connection portion, and the heat dissipation of the semiconductor package cannot be performed through the mounting substrate.

An object of the present invention is to provide a mounting structure of a semiconductor device which copes with an increase in power supply terminals and improves heat dissipation efficiency without increasing the number of connection lands.

[0008]

In order to achieve the above object, a semiconductor element mounting structure according to the present invention is a semiconductor element mounting structure in which a semiconductor package and a mounting board are combined. A connection land that is electrically connected to the signal line of the internal semiconductor element and a power supply pattern that is commonly connected to the power supply line of the internal semiconductor element, and the mounting board is interconnected to the power supply pattern. And a connection land interconnected with the connection land is recessed from the end surface.

[0009]

Function: The power supply lines of the internal semiconductor elements of the semiconductor package are commonly connected and patterned to make a connection with the mounting board, and the mounting board and the semiconductor package are brought into close contact with each other.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG.
It is a top view which shows the mounting substrate used for one Example of this invention.

In the figure, the semiconductor element mounting structure according to this embodiment is a combination of a semiconductor package 7 and a mounting substrate 1.

The semiconductor package 7 has, on its end face, connection lands 6 that are individually conducted to the signal lines of the internal semiconductor elements and power supply patterns 5 that are commonly connected to the power supply lines of the internal semiconductor elements.

The mounting board 1 has a power supply pattern 4 interconnected with the power supply pattern 5 on an end surface thereof, and the connection land 2 interconnected with the connection land 6 is set back from the end surface to form a recess (hereinafter referred to as an insulating space). It has in 8).

The connection land 6 of the semiconductor package 7 is connected to the connection land 2 of the mounting board 1 through the welding connection portion 3,
At the same time, the power supply pattern 5 of the package 7 is connected to the power supply pattern 4 of the substrate 1 via the welding connection portion 9.

[0015]

As described above, according to the present invention, the power line of the semiconductor element is provided on the package as a power pattern.
Further, since the welded connection portion is housed in the concave portion of the substrate to enable connection between the package power source pattern and the substrate power source pattern on the mounting substrate, the power source impedance of the semiconductor package is not increased and the power source impedance is increased. It can be kept low.

Further, since the semiconductor package and the mounting substrate are adhered to each other via the welded connection portion, there is an effect that the heat dissipation of the semiconductor element can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view of the mounting board shown in FIG.

FIG. 3 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Mounting Substrate 2 Connection Land 3 Weld Connection 4 Power Pattern 5 Power Pattern 6 Connection Land 7 Semiconductor Package 8 Recess 9 Weld Connection

Claims (1)

[Claims] 1. A semiconductor element mounting structure comprising a combination of a semiconductor package and a mounting substrate, wherein the semiconductor package has a connection land electrically connected to a signal line of the internal semiconductor element and a power supply line of the internal semiconductor element. The mounting board has a power supply pattern interconnected with the power supply pattern on the end surface and a connection land interconnected with the connection land from the end surface. A mounting structure for a semiconductor device, characterized in that the mounting structure is provided so as to be retracted and have the recess.