JPH0526750Y2 - - Google Patents
Info
- Publication number
- JPH0526750Y2 JPH0526750Y2 JP16346687U JP16346687U JPH0526750Y2 JP H0526750 Y2 JPH0526750 Y2 JP H0526750Y2 JP 16346687 U JP16346687 U JP 16346687U JP 16346687 U JP16346687 U JP 16346687U JP H0526750 Y2 JPH0526750 Y2 JP H0526750Y2
- Authority
- JP
- Japan
- Prior art keywords
- tabic
- board
- amount
- bonding
- positional deviation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16346687U JPH0526750Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16346687U JPH0526750Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-26 | 1987-10-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0167751U JPH0167751U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-01 |
| JPH0526750Y2 true JPH0526750Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-07 |
Family
ID=31448212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16346687U Expired - Lifetime JPH0526750Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526750Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3463579B2 (ja) * | 1998-10-20 | 2003-11-05 | 松下電器産業株式会社 | バンプ付電子部品の実装装置 |
-
1987
- 1987-10-26 JP JP16346687U patent/JPH0526750Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0167751U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-01 |
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