JPH0526743Y2 - - Google Patents
Info
- Publication number
- JPH0526743Y2 JPH0526743Y2 JP17895886U JP17895886U JPH0526743Y2 JP H0526743 Y2 JPH0526743 Y2 JP H0526743Y2 JP 17895886 U JP17895886 U JP 17895886U JP 17895886 U JP17895886 U JP 17895886U JP H0526743 Y2 JPH0526743 Y2 JP H0526743Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- elastic material
- plate
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013013 elastic material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 description 8
- 239000000725 suspension Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 244000273256 Phragmites communis Species 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17895886U JPH0526743Y2 (US08066781-20111129-C00013.png) | 1986-11-20 | 1986-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17895886U JPH0526743Y2 (US08066781-20111129-C00013.png) | 1986-11-20 | 1986-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6384942U JPS6384942U (US08066781-20111129-C00013.png) | 1988-06-03 |
| JPH0526743Y2 true JPH0526743Y2 (US08066781-20111129-C00013.png) | 1993-07-07 |
Family
ID=31121580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17895886U Expired - Lifetime JPH0526743Y2 (US08066781-20111129-C00013.png) | 1986-11-20 | 1986-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526743Y2 (US08066781-20111129-C00013.png) |
-
1986
- 1986-11-20 JP JP17895886U patent/JPH0526743Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6384942U (US08066781-20111129-C00013.png) | 1988-06-03 |
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| JPH0526743Y2 (US08066781-20111129-C00013.png) | ||
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