JPH0526742Y2 - - Google Patents
Info
- Publication number
- JPH0526742Y2 JPH0526742Y2 JP13675989U JP13675989U JPH0526742Y2 JP H0526742 Y2 JPH0526742 Y2 JP H0526742Y2 JP 13675989 U JP13675989 U JP 13675989U JP 13675989 U JP13675989 U JP 13675989U JP H0526742 Y2 JPH0526742 Y2 JP H0526742Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal lead
- lead frame
- mold
- longitudinal direction
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000123 paper Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 12
- 239000011111 cardboard Substances 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 5
- 239000004640 Melamine resin Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000011087 paperboard Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675989U JPH0526742Y2 (ko) | 1989-11-24 | 1989-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675989U JPH0526742Y2 (ko) | 1989-11-24 | 1989-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377443U JPH0377443U (ko) | 1991-08-05 |
| JPH0526742Y2 true JPH0526742Y2 (ko) | 1993-07-07 |
Family
ID=31683952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13675989U Expired - Lifetime JPH0526742Y2 (ko) | 1989-11-24 | 1989-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526742Y2 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5254931B2 (ja) * | 2009-10-29 | 2013-08-07 | 株式会社三井ハイテック | ダミーリードフレーム |
| KR101368321B1 (ko) * | 2013-03-20 | 2014-02-27 | (주) 제이디피이에스 | 산업용 안전매트 |
-
1989
- 1989-11-24 JP JP13675989U patent/JPH0526742Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0377443U (ko) | 1991-08-05 |
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