JPH0525392B2 - - Google Patents

Info

Publication number
JPH0525392B2
JPH0525392B2 JP23974286A JP23974286A JPH0525392B2 JP H0525392 B2 JPH0525392 B2 JP H0525392B2 JP 23974286 A JP23974286 A JP 23974286A JP 23974286 A JP23974286 A JP 23974286A JP H0525392 B2 JPH0525392 B2 JP H0525392B2
Authority
JP
Japan
Prior art keywords
terminal
semiconductor
pieces
transistor
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23974286A
Other languages
English (en)
Other versions
JPS6393126A (ja
Inventor
Shoichi Furuhata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP61239742A priority Critical patent/JPS6393126A/ja
Priority to US07/104,083 priority patent/US4825279A/en
Priority to DE19873734067 priority patent/DE3734067A1/de
Publication of JPS6393126A publication Critical patent/JPS6393126A/ja
Publication of JPH0525392B2 publication Critical patent/JPH0525392B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48092—Helix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
  • Power Conversion In General (AREA)

Description

【発明の詳細な説明】 【発明の属する技術分野】
本発明は、複数の電極を有する半導体片を複数
個内蔵し、半導体片の各電極に共通外部端子が直
接あるいは間接に接続される半導体装置に関す
る。
【従来技術とその問題点】
上述のような半導体装置の一例としてのトラン
ジスタモジユールを第２図ａ，ｂに示す。２個の
トランジスタ片１がコレクタ端子板２を介して絶
縁板３１の上に固着され、トランジスタ片１上の
エミツタ電極およびベース電極はそれぞれ導線６
のボンデイングにより絶縁板３１上に固着された
エミツタ端子板４、ベース端子板５と接続されて
いる。コレクタ端子板２、エミツタ端子板４、ベ
ース端子板５の端部は垂直に立ち上がつて、それ
ぞれ外部引出し端子２１，４１、接続用端子５１
が形成されている。別にベース駆動用の補助エミ
ツタ端子４２、補助ベース端子５２が接続板３２
の上に固定され、それぞれエミツタ端子板４、ベ
ース接続用端子５１に接続されている。絶縁板３
１，３２は共通の金属基板７の上に固着されてお
り、この基板に鎖線８で示す外囲器を接着し、そ
の中に樹脂を充填することによりトランジスタ片
１が外部雰囲気から遮蔽されている。ところが、
このような半導体装置は、トランジスタ片１から
各端子の接続孔９までにインダクタンスLsを有し
ているため、高周波動作をさせた場合、次の二つ
の問題点があつた。 一つは、前記インダクタンスLsとトランジスタ
片１のスイツチング時間tfで決定されるサージ電
圧Vs＝Ls×Ic／tfによりトランジスタに過大電圧
が加わる。ここで、Icはトランジスタ片１に流れ
る電流値である。他の一つは、複数のトランジス
タ片を並列にて用いた場合、各々のトランジスタ
片１から接続孔９までのインダクタンスが異な
り、トランジスタ片１がターンオンする際に流れ
るターンオン電流の間にずれを生じ、高周波動作
では大きなターンオン損失のずれとなつて現れ
る。
【発明の目的】
本発明は、上述の問題点に鑑み、各半導体片の
電極と端子導体の外部端部との間のインダクタン
スを小さく、かつその値の差も小さくして高速動
作の際に過大なサージ電圧が加わることなく、ま
た各半導体片過渡電流のバランスがとれる半導体
装置を提供することを目的とする。
【発明の要点】
本発明は、一列に配列された複数の半導体片と
面を半導体片の面に平行にして絶縁板を介して互
いにずらして重ねられた複数の端子板とを共通基
板上に固定し、半導体片の電極と端子板の露出面
とを接続する導線を半導体片の配列方向に垂直に
し、各端子板にそれぞれ一つの端子導体を互いに
間隔を介して重なる位置に連結するもので、この
結果、各電極から端子へ流れる電流によつて生ず
る磁界が打消されてインダクタンスが小さくな
り、またその値もほぼ等しくなつて上記の目的が
達成される。さらに二つの補助端子を設ける場合
には、導線によりそれぞれ端子導体と端子板との
連結部近くに接続し、各導線をより合わせること
により上記と同様の効果が生ずる。
【発明の実施例】
第１図ａ，ｂは本発明の一実施例を示し、第２
図と共通の点には同一の符号が付されている。２
個のトランジスタ片１は、第２図の場合と同様絶
縁板３１を介して金属基板７の上に固着されたコ
レクタ端子板２の上に固着されている。しかし、
第２図の場合と異なりコレクタ端子板２はトラン
ジスタ片１の配列方向に垂直に広がつており、端
部の中央から外部引出し端子２１が立上がつてい
る。コレクタ端子板２の露出面には絶縁板３３が
固着され、さらにその上にエミツタ端子板４が固
着されている。エミツタ端子板４の端部中央から
はコレクタ端子２１と間隔を置いて平行にエミツ
タ端子４１が立てられている。エミツタ端子板４
の上には絶縁板３４を介してベース端子板５が固
着され、ベース端子板５の端部中央からはエミツ
タ端子４と間隔を置いて平行にベース接続用端子
５１が立てられている。トランジスタ片１の上の
エミツタ電極およびベース電極は、トランジスタ
片１の配列方向に垂直な平行導線６によつてそれ
ぞれエミツタ端子板４、ベース端子板５と接続さ
れており、基板上に絶縁体３５を介して固定され
た補助エミツタ端子４２はエミツタ端子４１と、
また補助ベース端子５２はベース接続用端子５１
と導線６１，６２で接続されるが、導線６１，６
２は密により合わされている。この結果、コレク
タ端子２１よりエミツタ端子４１に流れる電流あ
るいは補助ベース端子５２から補助エミツタ端子
４２に流れる電流は、トランジスタ片から平行な
経路を通つて逆行することになり、トランジスタ
片１から各端子の接続孔９までのインダクタンス
が小さくなる。また、トランジスタ片１からコレ
クタ端子２１、エミツタ端子４１の接続孔９まで
の経路は平行でほぼ等しくなるため、インダクタ
ンスもほぼ等しくなる。図の実施例ではコレクタ
端子２１、エミツタ端子４１をそれぞれコレクタ
端子板２、エミツタ端子板４の端部の中央から立
ち上げているが、端部の端から立ち上げてもイン
ダクタンスに対する効果は大きく変わらない。
【発明の効果】
本発明によれば、複数の半導体片に対して共通
な端子板を絶縁板を介して重ね合わせ、また端子
板と半導体片の電極を接続する導線を平行にし、
各端子板に接続される端子導体も重なる位置で平
行にすることによつて、各電極から端子に流れる
電流が平行に逆行することによりインダクタンス
が小さくなり、スイツチング時に大きな過電圧が
加わることなく、またインダクタンスの差が少な
くなつてターンオン電流のずれがなくなり、大き
なターンオン損失のずれが生じることがない。本
発明は実施例で述べたバイポーラトランジスタモ
ジユールに限らず、電界効果トランジスタあるい
はサイリスタからなるモジユールにも有効に適用
できることはいうまでもない。
【図面の簡単な説明】
第１図は本発明の一実施例を示し、ａが平面
図、ｂが正面図、第２図は従来のトランジスタモ
ジユールを示し、ａが平面図、ｂが正面図であ
る。 １……トランジスタ片、２……コレクタ端子
板、２１……コレクタ端子、３１，３３，３４…
…絶縁板、４……エミツタ端子板、４１……エミ
ツタ端子、４２……補助エミツタ端子、５……ベ
ース端子板、５１……ベース接続用端子、５２…
…補助ベース端子、６……導線、７……基板、８
……外囲器。

Claims (1)

  1. 【特許請求の範囲】 １ 複数の電極を有する半導体片を複数個内蔵
    し、該半導体片の各電極に共通外部端子が直接あ
    るいは間接に接続されるものにおいて、一列に配
    列された複数の半導体片と面を半導体片の面に平
    行にして絶縁板を介して互いにずらして重ねられ
    た複数の端子板とが共通基板上に固定され、半導
    体片の電極と端子板の露出面とを接続する導線が
    半導体片の配列方向に垂直にされ、各端子板には
    それぞれ一つの端子導体が間隔を介して重なる位
    置に連結されたことを特徴とする半導体装置。 ２ 特許請求の範囲第１項記載の装置において、
    二つの補助端子が互いにより合わされる導線によ
    りそれぞれ端子板と端子導体の連結部近傍に接続
    されたことを特徴とする半導体装置。
JP61239742A 1986-10-08 1986-10-08 半導体装置 Granted JPS6393126A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP61239742A JPS6393126A (ja) 1986-10-08 1986-10-08 半導体装置
US07/104,083 US4825279A (en) 1986-10-08 1987-10-05 Semiconductor device
DE19873734067 DE3734067A1 (de) 1986-10-08 1987-10-08 Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61239742A JPS6393126A (ja) 1986-10-08 1986-10-08 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6080028A Division JPH0783087B2 (ja) 1994-04-19 1994-04-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6393126A JPS6393126A (ja) 1988-04-23
JPH0525392B2 true JPH0525392B2 (ja) 1993-04-12

Family

ID=17049256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61239742A Granted JPS6393126A (ja) 1986-10-08 1986-10-08 半導体装置

Country Status (3)

Country Link
US (1) US4825279A (ja)
JP (1) JPS6393126A (ja)
DE (1) DE3734067A1 (ja)

Cited By (1)

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JP2744675B2 (ja) * 1990-05-16 1998-04-28 オ−クマ株式会社 トランジスタモジュール
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JP3357220B2 (ja) * 1995-07-07 2002-12-16 三菱電機株式会社 半導体装置
JPH09172116A (ja) * 1995-12-21 1997-06-30 Mitsubishi Electric Corp 半導体装置
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Publication number Priority date Publication date Assignee Title
JP2016092283A (ja) * 2014-11-07 2016-05-23 三菱電機株式会社 回路基板

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DE3734067C2 (ja) 1990-05-10
US4825279A (en) 1989-04-25
JPS6393126A (ja) 1988-04-23
DE3734067A1 (de) 1988-05-05

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