JPH0525246Y2 - - Google Patents
Info
- Publication number
- JPH0525246Y2 JPH0525246Y2 JP2436187U JP2436187U JPH0525246Y2 JP H0525246 Y2 JPH0525246 Y2 JP H0525246Y2 JP 2436187 U JP2436187 U JP 2436187U JP 2436187 U JP2436187 U JP 2436187U JP H0525246 Y2 JPH0525246 Y2 JP H0525246Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating partition
- semiconductor device
- partition wall
- electrode terminals
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005192 partition Methods 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 21
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2436187U JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2436187U JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63132448U JPS63132448U (nl) | 1988-08-30 |
JPH0525246Y2 true JPH0525246Y2 (nl) | 1993-06-25 |
Family
ID=30823522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2436187U Expired - Lifetime JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0525246Y2 (nl) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60129146T2 (de) * | 2001-12-24 | 2007-12-13 | Abb Research Ltd. | Modulgehäuse und Leistungshalbleitermodul |
JP5793374B2 (ja) * | 2011-08-29 | 2015-10-14 | 新電元工業株式会社 | 半導体装置及び配線接続方法 |
JP5767932B2 (ja) * | 2011-09-30 | 2015-08-26 | 新電元工業株式会社 | 半導体装置 |
JP6233507B2 (ja) * | 2014-05-15 | 2017-11-22 | 富士電機株式会社 | パワー半導体モジュールおよび複合モジュール |
-
1987
- 1987-02-20 JP JP2436187U patent/JPH0525246Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63132448U (nl) | 1988-08-30 |
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