JPS63132448U - - Google Patents
Info
- Publication number
- JPS63132448U JPS63132448U JP2436187U JP2436187U JPS63132448U JP S63132448 U JPS63132448 U JP S63132448U JP 2436187 U JP2436187 U JP 2436187U JP 2436187 U JP2436187 U JP 2436187U JP S63132448 U JPS63132448 U JP S63132448U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- positioning portion
- box
- hole
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 3
Landscapes
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2436187U JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2436187U JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63132448U true JPS63132448U (nl) | 1988-08-30 |
| JPH0525246Y2 JPH0525246Y2 (nl) | 1993-06-25 |
Family
ID=30823522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2436187U Expired - Lifetime JPH0525246Y2 (nl) | 1987-02-20 | 1987-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525246Y2 (nl) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204037A (ja) * | 2001-12-24 | 2003-07-18 | Abb Res Ltd | モジュールハウジング及び電力半導体モジュール |
| JP2013048154A (ja) * | 2011-08-29 | 2013-03-07 | Shindengen Electric Mfg Co Ltd | 半導体装置及び配線接続方法 |
| JP2013077688A (ja) * | 2011-09-30 | 2013-04-25 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
| WO2015174158A1 (ja) * | 2014-05-15 | 2015-11-19 | 富士電機株式会社 | パワー半導体モジュールおよび複合モジュール |
-
1987
- 1987-02-20 JP JP2436187U patent/JPH0525246Y2/ja not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204037A (ja) * | 2001-12-24 | 2003-07-18 | Abb Res Ltd | モジュールハウジング及び電力半導体モジュール |
| JP2013048154A (ja) * | 2011-08-29 | 2013-03-07 | Shindengen Electric Mfg Co Ltd | 半導体装置及び配線接続方法 |
| JP2013077688A (ja) * | 2011-09-30 | 2013-04-25 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
| WO2015174158A1 (ja) * | 2014-05-15 | 2015-11-19 | 富士電機株式会社 | パワー半導体モジュールおよび複合モジュール |
| JPWO2015174158A1 (ja) * | 2014-05-15 | 2017-04-20 | 富士電機株式会社 | パワー半導体モジュールおよび複合モジュール |
| US9761567B2 (en) | 2014-05-15 | 2017-09-12 | Fuji Electric Co., Ltd. | Power semiconductor module and composite module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525246Y2 (nl) | 1993-06-25 |