JPH0525243Y2 - - Google Patents
Info
- Publication number
- JPH0525243Y2 JPH0525243Y2 JP14331289U JP14331289U JPH0525243Y2 JP H0525243 Y2 JPH0525243 Y2 JP H0525243Y2 JP 14331289 U JP14331289 U JP 14331289U JP 14331289 U JP14331289 U JP 14331289U JP H0525243 Y2 JPH0525243 Y2 JP H0525243Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- suction
- suction cup
- cut
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 70
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 90
- 238000005520 cutting process Methods 0.000 description 27
- 239000012535 impurity Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14331289U JPH0525243Y2 (US06633600-20031014-M00021.png) | 1989-12-11 | 1989-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14331289U JPH0525243Y2 (US06633600-20031014-M00021.png) | 1989-12-11 | 1989-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0381638U JPH0381638U (US06633600-20031014-M00021.png) | 1991-08-21 |
| JPH0525243Y2 true JPH0525243Y2 (US06633600-20031014-M00021.png) | 1993-06-25 |
Family
ID=31690089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14331289U Expired - Lifetime JPH0525243Y2 (US06633600-20031014-M00021.png) | 1989-12-11 | 1989-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525243Y2 (US06633600-20031014-M00021.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216891A (ja) * | 2005-02-07 | 2006-08-17 | Tokyo Univ Of Agriculture & Technology | 薄膜素子構造の作製方法、及び薄膜素子構造作製用の機能性基体 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6083749B2 (ja) * | 2013-07-08 | 2017-02-22 | 浜井産業株式会社 | ワーク剥離装置および剥離方法 |
-
1989
- 1989-12-11 JP JP14331289U patent/JPH0525243Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216891A (ja) * | 2005-02-07 | 2006-08-17 | Tokyo Univ Of Agriculture & Technology | 薄膜素子構造の作製方法、及び薄膜素子構造作製用の機能性基体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0381638U (US06633600-20031014-M00021.png) | 1991-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5772092B2 (ja) | 半導体製造方法および半導体製造装置 | |
| KR101787105B1 (ko) | 반도체 웨이퍼 마운트 방법 및 반도체 웨이퍼 마운트 장치 | |
| US6872229B2 (en) | Apparatus for peeling protective sheet | |
| CN1209644A (zh) | 基片处理装置,基片支承装置,基片处理方法和基片制造方法 | |
| KR20070038467A (ko) | 옮겨싣기 장치 | |
| KR101059009B1 (ko) | 기판접합방법 및 그 장치 | |
| JP3433930B2 (ja) | ウェーハの平面加工装置及びその平面加工方法 | |
| JPH0525243Y2 (US06633600-20031014-M00021.png) | ||
| JPS6022500B2 (ja) | 位置合せ載置方法 | |
| US20020005166A1 (en) | Semiconductor manufactring apparatus, and positioning jig used for same | |
| JPH0774143A (ja) | 基板保持装置 | |
| JP2008066522A (ja) | 基板貼合せ方法およびこれを用いた装置 | |
| TWI700148B (zh) | 夾盤台、磨削裝置及磨削品的製造方法 | |
| JPH05160102A (ja) | スピンナ及びそれを用いた半導体装置の製造方法 | |
| JP4162409B2 (ja) | 曲面ウェハー用吸着台 | |
| JP3733091B2 (ja) | 半導体ウエハ分離装置 | |
| KR20090053259A (ko) | 웨이퍼 이송로봇 | |
| JP2564084B2 (ja) | 半導体ウエハの回収方法 | |
| JPH0217480Y2 (US06633600-20031014-M00021.png) | ||
| JP2607923B2 (ja) | ウェハ・ハンドリングチャック構造 | |
| JP2005011748A (ja) | ボタン型電池の製造装置 | |
| JPH01205441A (ja) | 半導体素子ウェハーの切削分割装置用ステージ | |
| KR20170087148A (ko) | 다이 픽업 장치 및 그 구동방법 | |
| JP2596797Y2 (ja) | 半導体ペレット | |
| JPH09254140A (ja) | 柱状体材料の切断方法及び装置 |
