JPH0525241Y2 - - Google Patents

Info

Publication number
JPH0525241Y2
JPH0525241Y2 JP1987195653U JP19565387U JPH0525241Y2 JP H0525241 Y2 JPH0525241 Y2 JP H0525241Y2 JP 1987195653 U JP1987195653 U JP 1987195653U JP 19565387 U JP19565387 U JP 19565387U JP H0525241 Y2 JPH0525241 Y2 JP H0525241Y2
Authority
JP
Japan
Prior art keywords
film carrier
epoxy resin
slit
chip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987195653U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01100444U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195653U priority Critical patent/JPH0525241Y2/ja
Publication of JPH01100444U publication Critical patent/JPH01100444U/ja
Application granted granted Critical
Publication of JPH0525241Y2 publication Critical patent/JPH0525241Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987195653U 1987-12-23 1987-12-23 Expired - Lifetime JPH0525241Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (enrdf_load_html_response) 1987-12-23 1987-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (enrdf_load_html_response) 1987-12-23 1987-12-23

Publications (2)

Publication Number Publication Date
JPH01100444U JPH01100444U (enrdf_load_html_response) 1989-07-05
JPH0525241Y2 true JPH0525241Y2 (enrdf_load_html_response) 1993-06-25

Family

ID=31486322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195653U Expired - Lifetime JPH0525241Y2 (enrdf_load_html_response) 1987-12-23 1987-12-23

Country Status (1)

Country Link
JP (1) JPH0525241Y2 (enrdf_load_html_response)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production
JPS58197758A (ja) * 1982-05-12 1983-11-17 Sharp Corp テ−プキヤリア装置及びその実装方法

Also Published As

Publication number Publication date
JPH01100444U (enrdf_load_html_response) 1989-07-05

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