JPH0522371Y2 - - Google Patents
Info
- Publication number
- JPH0522371Y2 JPH0522371Y2 JP1870490U JP1870490U JPH0522371Y2 JP H0522371 Y2 JPH0522371 Y2 JP H0522371Y2 JP 1870490 U JP1870490 U JP 1870490U JP 1870490 U JP1870490 U JP 1870490U JP H0522371 Y2 JPH0522371 Y2 JP H0522371Y2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- solder
- shaped solder
- shaped
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 125
- 230000004907 flux Effects 0.000 claims description 35
- 239000006071 cream Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000012190 activator Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011297 pine tar Substances 0.000 description 2
- 229940068124 pine tar Drugs 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1870490U JPH0522371Y2 (enrdf_load_stackoverflow) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1870490U JPH0522371Y2 (enrdf_load_stackoverflow) | 1990-02-28 | 1990-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03111488U JPH03111488U (enrdf_load_stackoverflow) | 1991-11-14 |
| JPH0522371Y2 true JPH0522371Y2 (enrdf_load_stackoverflow) | 1993-06-08 |
Family
ID=31521855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1870490U Expired - Lifetime JPH0522371Y2 (enrdf_load_stackoverflow) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0522371Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004344958A (ja) * | 2003-05-23 | 2004-12-09 | Sentan Zairyo:Kk | 炭素アルミニウム複合材料または炭化珪素アルミニウム複合材料に金属を接合したハイブリッド材料および該ハイブリッド材料を用いた熱交換器用部品 |
| JP2013161854A (ja) * | 2012-02-02 | 2013-08-19 | Mitsubishi Electric Corp | 半導体装置の製造方法、半導体装置 |
-
1990
- 1990-02-28 JP JP1870490U patent/JPH0522371Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03111488U (enrdf_load_stackoverflow) | 1991-11-14 |
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