JPH05221200A - Duplicating method of relief pattern - Google Patents
Duplicating method of relief patternInfo
- Publication number
- JPH05221200A JPH05221200A JP3064292A JP3064292A JPH05221200A JP H05221200 A JPH05221200 A JP H05221200A JP 3064292 A JP3064292 A JP 3064292A JP 3064292 A JP3064292 A JP 3064292A JP H05221200 A JPH05221200 A JP H05221200A
- Authority
- JP
- Japan
- Prior art keywords
- relief pattern
- embossed
- resin
- pressure
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000010076 replication Effects 0.000 claims description 4
- 230000003362 replicative effect Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000004049 embossing Methods 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- -1 Neopentyl glycol modified trimethylolpropane diacrylate Chemical class 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、レリーフパターンの複
製方法に関するものであり、具体的には表面レリーフ型
ホログラムのようなレリーフパターンを複製する方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a relief pattern duplication method, and more particularly to a method for duplicating a relief pattern such as a surface relief hologram.
【０００２】ホログラムは、三次元立体像を再生するこ
とからその優れた意匠性が好まれ、書籍等の表紙、ＰＯ
Ｐディスプレイ、ギフト等に利用されている。また、サ
ブミクロンオーダーの情報を記録していることと等価で
あるため、有価証券、クレジットカード等の偽造防止に
利用されている。Holograms are preferred for their excellent design because they reproduce a three-dimensional stereoscopic image, and they are used for the cover of books, POs, and so on.
Used for P displays, gifts, etc. Further, since it is equivalent to recording information of submicron order, it is used for preventing forgery of securities, credit cards and the like.
【０００３】本発明によるレリーフパターンを複製する
技術、特に多面付けされた複製型を得る技術を応用する
ことによって、そのようなレリーフパターンを、包装
紙、カートン等の包装材料、化粧板、特殊用途の壁紙等
の建築材料として使用することができる。By applying the technique for reproducing a relief pattern according to the present invention, in particular, the technique for obtaining a multi-faced reproduction mold, such a relief pattern is applied to a wrapping paper, a packaging material such as a carton, a decorative plate, and a special purpose. It can be used as a building material such as wallpaper.
【０００４】[0004]
【従来の技術】従来、レリーフパターンをエンボス複製
するには以下に示す方法がある。まず、レリーフパター
ンが形成されたホトレジスト等の原版から、金属メッキ
等により型どりした金型もしくは（熱圧エンボス耐性を
有する）樹脂型と、被エンボス体（本明細書において、
被エンボス体とは、熱可塑性樹脂シートもしくはフィル
ムを言う）を密着させ、平圧プレス機で全面に均一に圧
力を加えると同時に熱を加え、レリーフパターンを被エ
ンボス体上に複製する方法である。しかし、この方法で
は、被エンボス体上のエンボスされた部分とエンボスさ
れていない部分の境界に明確な段差が生じてしまう。2. Description of the Related Art Conventionally, there are the following methods for emboss duplicating a relief pattern. First, from an original plate such as a photoresist on which a relief pattern is formed, a metal mold or a metal mold or a resin mold (having heat and pressure emboss resistance) and an embossed body (in this specification,
The object to be embossed is a method in which a thermoplastic resin sheet or film is adhered, and pressure is uniformly applied to the entire surface by a flat press machine while simultaneously applying heat to reproduce the relief pattern on the object to be embossed. .. However, in this method, a clear step is formed at the boundary between the embossed portion and the non-embossed portion on the embossed body.
【０００５】また、密に多面付けを行う際、平圧プレス
する面全面により加熱・加圧エンボスされるため、すで
にエンボス成形されレリーフパターンが複製されている
部分へも熱と圧力が加えられてレリーフパターンが劣化
し、意匠性が著しく低下するという問題点がある。Further, when densely carrying out multi-sided mounting, since heat and pressure are embossed by the entire surface to be flat-pressed, heat and pressure are also applied to the portion already embossed and the relief pattern is duplicated. There is a problem that the relief pattern is deteriorated and the design is remarkably deteriorated.
【０００６】[0006]
【発明が解決しようとする課題】本発明が解決しようと
する問題点は、上述の従来法において、被エンボス体が
エンボス成形される際、発生するエンボスされた部分と
されてない部分の境界の段差と、密にレリーフパターン
の多面付けを行う時の隣接した部分への熱・圧力の影響
による意匠性の低下とであり、それぞれを低減、防止す
る事を目的とする。The problem to be solved by the present invention is that the boundary between the embossed portion and the non-embossed portion generated when the object to be embossed is embossed in the above-mentioned conventional method. The purpose is to reduce or prevent a step and a decrease in designability due to the influence of heat and pressure on the adjacent portions when densely imposing multiple relief patterns.
【０００７】[0007]
【課題を解決するための手段】本発明では、２つの略か
まぼこ型圧台（本明細書において、略かまぼこ型圧台と
は、直方体で、エンボス成形するための面のエッジが面
取りされており、前記面が微少な凸部を有する加圧台を
いう）を、長手方向が直交するように、凸部を持つ面を
合わせて配置し、前記圧台間に、表面に凹凸状のレリー
フパターンを有する複製型と被エンボス体を密着させた
ものを挟持させ、次いで熱と圧力を加えてエンボス複製
する。In the present invention, two substantially kamaboko type pressure bases (in the present specification, a substantially kamaboko type pressure base is a rectangular parallelepiped, and the edge of the surface for embossing is chamfered. , Said surface having a minute convex portion) is arranged so that the surfaces having the convex portions are aligned so that the longitudinal directions thereof are orthogonal to each other, and a relief pattern having a concave-convex surface on the surface between the pressing bases. The duplication mold having the above and the object to be embossed are sandwiched, and then heat and pressure are applied to perform emboss duplication.
【０００８】前記略かまぼこ型圧台を、長手方向が直交
するように配置し、使用することにより、隣接した部分
への熱の影響が抑えられ、意匠性の低下を防いだ複製レ
リーフパターンが作製できる。By arranging and using the substantially kamaboko type pressure bases so that the longitudinal directions thereof are orthogonal to each other, the influence of heat on adjacent portions is suppressed, and a duplicate relief pattern is produced which prevents deterioration in designability. it can.
【０００９】この工程を、被エンボス体の位置を変え繰
り返すことにより、密に多面付けされた大面積の被エン
ボス体が得られ、前記被エンボス体を原版としてさら
に、金属または樹脂により複製型を作製することによ
り、意匠性の高い、密なレリーフパターンの多面付けさ
れた複製型を作製することができる。By repeating this process by changing the position of the object to be embossed, a dense multi-faced object to be embossed having a large area can be obtained, and the object to be embossed is used as an original plate, and a replica mold is made of metal or resin. By producing it, it is possible to produce a multi-faced replication mold having a dense relief pattern with high designability.
【００１０】[0010]
【実施例】レリーフ原版として、厚さ３ｍｍのガラス板
からなる基板上に、膜厚約１．５μｍの、MICROPOSIT14
00（シプレイ社製）によるホトレジスト層を形成し、ア
ルゴンレーザー（波長４５７．９ｎｍ、強度５０ｍＪ／
ｃｍ2 ）の二光束干渉法によって、正方形で面積が４ｃ
ｍ2 、空間周波数が1300ｌｉｎｅ／ｍｍの干渉稿を約１
分間露光した後、アルカリ現像によってグレーティング
を作製したホトレジストの表面に、厚さ約２００ÅのＡ
ｕ薄膜層を真空蒸着法にて形成した後、これを電極とし
て、厚さ約２００μｍのＮｉメッキ層を形成し、前記Ｎ
ｉメッキ層を剥離するとともにＮｉメッキ層に付着する
余分なＡｕ薄膜層及びホトレジスト層を除去したものを
原版とした。Example As a relief original plate, a MICROPOSIT14 film having a thickness of about 1.5 μm was formed on a substrate made of a glass plate having a thickness of 3 mm.
A photoresist layer is formed using 00 (manufactured by Shipley), and an argon laser (wavelength 457.9 nm, intensity 50 mJ /
cm 2 ) two- beam interferometry, square area of 4c
m 2, the interference fringes of the spatial frequency 1300line / mm to about 1
After exposure for a minute, the surface of the photoresist, on which the grating was made by alkali development, was coated with an A film with a thickness of about 200Å.
After forming the u thin film layer by a vacuum deposition method, using this as an electrode, a Ni plating layer having a thickness of about 200 μm is formed.
The original plate was prepared by peeling off the i-plated layer and removing the excess Au thin film layer and photoresist layer attached to the Ni-plated layer.
【００１１】次いで、厚さが１００μｍのポリアリレー
トフィルム（ユニチカ製エンブレートＵ１−１００）か
ら成る支持体上に、下記組成の紫外線硬化性のアクリレ
ート樹脂を約５μｍの膜厚となるようにワイヤーバーコ
ーティングし樹脂液層を形成した。 ネオペンチルグリコール変性トリメチロールプロパン
ジアクリレート…７０重量部 ジペンタエリスリトールトリアクリレート…３０重量
部 ベンジルジメチルケタール…４重量部Then, a UV-curable acrylate resin having the following composition was wire-bar coated to a thickness of about 5 μm on a support made of a polyarylate film (Emblate U1-100 manufactured by Unitika) having a thickness of 100 μm. Then, a resin liquid layer was formed. Neopentyl glycol modified trimethylolpropane diacrylate ... 70 parts by weight Dipentaerythritol triacrylate ... 30 parts by weight Benzyl dimethyl ketal ... 4 parts by weight
【００１２】次に、前記樹脂液層を前記Ｎｉ製のレリー
フ原版のグレーティングレリーフ面に密着させた後、前
記支持体側より５００ｍＪ／ｃｍ2 の紫外線を照射し、
その後レリーフ原版から剥離することによって支持体と
硬化した樹脂層からなる複製型を作製した。Next, the resin liquid layer is brought into close contact with the grating relief surface of the Ni relief original plate, and then irradiated with ultraviolet rays of 500 mJ / cm 2 from the support side,
After that, by peeling from the relief original plate, a replication mold comprising a support and a cured resin layer was prepared.
【００１３】次に、被エンボス体として厚さ４００μｍ
のポリメチルメタクリレート基材上に下記組成の熱可塑
性樹脂層をワイヤーバーコーティングし、乾燥後の膜厚
が約５μｍとなるように設けた多面付け用シートを作製
した。 アクリル共重合樹脂（三菱レイヨン社製ダイヤナール
ＢＲ−１０１）…２０重量部 イソプロパノール…４０重量部 ２−ブタノン…４５重量部Next, as an object to be embossed, a thickness of 400 μm
A thermoplastic resin layer having the following composition was wire-bar coated on the polymethylmethacrylate base material (1) to prepare a multi-sided sheet having a thickness of about 5 μm after drying. Acrylic copolymer resin (Dianal BR-101 manufactured by Mitsubishi Rayon Co., Ltd.) 20 parts by weight Isopropanol 40 parts by weight 2-butanone 45 parts by weight
【００１４】次いで、前記複製型と前記多面付け用シー
トとを密着させ、シリコンゴム製略かまぼこ型圧台を長
手方向が直交するように配置したものに挟持させ、圧力
１０ｋｇ／ｃｍ2 、温度９０℃、圧着時間１分の条件に
て平圧プレスを行い、レリーフパターンを複製した後剥
離し、多面付け用シートの位置を変えた。この繰り返し
により、３０個のグレーティーングを間隔約０．５ｍｍ
となるように多面付けした。Then, the replica mold and the multi-sided sheet are brought into close contact with each other, and a silicon rubber substantially kamaboko type pressure table is sandwiched between them so that their longitudinal directions are orthogonal to each other, and the pressure is 10 kg / cm 2 and the temperature is 90. Pressing was carried out under the conditions of a temperature of 1 ° C. and a pressure-bonding time of 1 minute, the relief pattern was duplicated and then peeled off, and the position of the multi-sided sheet was changed. By repeating this, 30 gratings are spaced about 0.5 mm apart.
Multifaceted so that
【００１５】前記の多面付けされたシートから、さらに
前述と同様な樹脂型作製工程をへて、多面付けされた樹
脂型を作製した。以上の工程により良好な、密に多面付
けされた複製樹脂型を得ることができた。From the above-mentioned multi-sided sheet, the multi-sided resin mold was manufactured through the resin mold manufacturing process similar to the above. Through the above steps, it was possible to obtain a good replication resin mold that was densely multi-faced.
【００１６】[0016]
【発明の効果】本発明によるレリーフパターンの複製方
法により、被エンボス体がエンボスされる際発生するエ
ンボスされた部分とされてない部分の境界に発生する段
差が低減した。According to the method for replicating a relief pattern according to the present invention, the step generated at the boundary between the non-embossed portion and the non-embossed portion generated when the embossed body is embossed is reduced.
【００１７】また、隣接したすでにエンボス成形が施さ
れた部分への熱や圧力の影響による意匠性の低下の少な
い多面付けされたレリーフパターンの複製が可能とな
り、また多面付けが可能になったことによる大幅な意匠
性の向上が実現できた。このことにより、レリーフパタ
ーンを使用するホログラムの他、包装紙、カートン等の
包装材料、化粧紙等の建装材料などの意匠性の飛躍的向
上を実現できる。In addition, it is possible to duplicate a multi-faced relief pattern in which the design is less likely to be deteriorated by the influence of heat and pressure on the adjacent already embossed portion, and it is possible to carry out the multi-facement. It was possible to realize a great improvement in designability. As a result, not only holograms using relief patterns but also packaging materials such as wrapping paper and cartons, and building materials such as decorative paper can be dramatically improved in design.
【００１８】[0018]
【図１】本発明によるレリーフパターンの多面付け複製
方法を工程順に示す説明図。FIG. 1 is an explanatory view showing a relief pattern multi-positioning duplication method according to the present invention in the order of steps.
【図２】金型の製造工程を示す断面説明図。FIG. 2 is an explanatory sectional view showing a manufacturing process of a mold.
【図３】樹脂型の製造工程を示す断面説明図。FIG. 3 is an explanatory cross-sectional view showing a resin mold manufacturing process.
【図４】略かまぼこ型圧台の側面図。FIG. 4 is a side view of a substantially kamaboko type pressure table.
【００１９】[0019]
１、６、９…レリーフ原版 ２…金型もしくは樹脂型 ３…被エンボス体（多面付け用シートもしくはフィル
ム） ４…略かまぼこ型圧台 ５…多面付けされた樹脂型もしくは金型 ７…金属蒸着層 ８…金型 10…支持体 11…少なくとも電子線硬化性樹脂もしくは紫外線硬化性
樹脂を１成分として含有する樹脂 Ａ…樹脂型1, 6, 9 ... Relief original plate 2 ... Mold or resin mold 3 ... Embossed body (sheet or film for multi-sided mounting) 4 ... Almost kamaboko type pressure table 5 ... Multi-sided resin type or metal mold 7 ... Metal deposition Layer 8 ... Mold 10 ... Support 11 ... Resin containing at least electron beam curable resin or ultraviolet curable resin as one component A ... Resin mold
Claims (4)
交するように、凸部を持つ面を合わせて配置し、前記圧
台間に、金属もしくは樹脂製の、レリーフパターンを有
する複製型と被エンボス体を挟持させ、熱と圧力を加え
ることにより、前記被エンボス体上に前記複製型よりレ
リーフパターンを複製するレリーフパターンの複製方
法。1. A duplication having two substantially kamaboko type pressure bases, with their surfaces having convex portions aligned so that their longitudinal directions are orthogonal to each other, and having a relief pattern made of metal or resin between the pressure bases. A method for replicating a relief pattern, wherein a mold and an object to be embossed are sandwiched and heat and pressure are applied to reproduce a relief pattern on the object to be embossed from the replica mold.
製型より被エンボス体に複製した後、被エンボス体の位
置を変え、さらにエンボス複製を行う工程を繰り返すこ
とにより、レリーフパターンが多面付けされた大面積の
被エンボス体を得ることを特徴とするレリーフパターン
の多面付け複製方法。2. The method according to claim 1, wherein after the relief pattern is duplicated on the embossed body from the replica mold, the step of changing the position of the embossed body and further performing the emboss duplication are repeated, whereby the relief pattern is multi-faced. A multi-faceted replication method of a relief pattern, which comprises obtaining a large-area embossed body.
が多面付けされた大面積の被エンボス体より、金属もし
くは樹脂により型取りし、レリーフパターンが多面付け
された大面積の複製型を得ることを特徴とするレリーフ
パターンの多面付け複製方法。3. A large-area replica mold having multiple relief patterns is obtained by molding a metal or resin from the large-area embossed body having multiple relief patterns provided in claim 2. A multi-faceted duplication method for a relief pattern, which is characterized in that it is obtained.
樹脂を少なくとも１成分含有する樹脂であることを特徴
とする請求項３に記載のレリーフパターンの多面付け複
製方法。4. The relief pattern multi-faced duplication method according to claim 3, wherein the resin used for patterning is a resin containing at least one component of a radiation curable resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3064292A JPH05221200A (en) | 1992-02-18 | 1992-02-18 | Duplicating method of relief pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3064292A JPH05221200A (en) | 1992-02-18 | 1992-02-18 | Duplicating method of relief pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05221200A true JPH05221200A (en) | 1993-08-31 |
Family
ID=12309487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3064292A Pending JPH05221200A (en) | 1992-02-18 | 1992-02-18 | Duplicating method of relief pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05221200A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006516108A (en) * | 2002-11-16 | 2006-06-22 | フェレンベルク シュテファン | Nano-optical color embossing method and apparatus |
| JP2006225004A (en) * | 2005-02-18 | 2006-08-31 | Toppan Printing Co Ltd | Line patterned paper container |
| JP2009523635A (en) * | 2006-01-24 | 2009-06-25 | マイクロラボ ピーティーワイ エルティーディー | Stamping method and apparatus |
| JP5502471B2 (en) | 2007-07-03 | 2014-05-28 | 東洋製罐株式会社 | Method for forming film with hologram pattern and container |
-
1992
- 1992-02-18 JP JP3064292A patent/JPH05221200A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006516108A (en) * | 2002-11-16 | 2006-06-22 | フェレンベルク シュテファン | Nano-optical color embossing method and apparatus |
| JP2006225004A (en) * | 2005-02-18 | 2006-08-31 | Toppan Printing Co Ltd | Line patterned paper container |
| JP2009523635A (en) * | 2006-01-24 | 2009-06-25 | マイクロラボ ピーティーワイ エルティーディー | Stamping method and apparatus |
| JP5502471B2 (en) | 2007-07-03 | 2014-05-28 | 東洋製罐株式会社 | Method for forming film with hologram pattern and container |
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