JPH0521900Y2 - - Google Patents
Info
- Publication number
- JPH0521900Y2 JPH0521900Y2 JP1990055801U JP5580190U JPH0521900Y2 JP H0521900 Y2 JPH0521900 Y2 JP H0521900Y2 JP 1990055801 U JP1990055801 U JP 1990055801U JP 5580190 U JP5580190 U JP 5580190U JP H0521900 Y2 JPH0521900 Y2 JP H0521900Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- hole
- circuit
- ground circuit
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010408 film Substances 0.000 description 28
- 239000010410 layer Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012787 coverlay film Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990055801U JPH0521900Y2 (US06534493-20030318-C00166.png) | 1990-05-28 | 1990-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990055801U JPH0521900Y2 (US06534493-20030318-C00166.png) | 1990-05-28 | 1990-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415256U JPH0415256U (US06534493-20030318-C00166.png) | 1992-02-06 |
| JPH0521900Y2 true JPH0521900Y2 (US06534493-20030318-C00166.png) | 1993-06-04 |
Family
ID=31579076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990055801U Expired - Lifetime JPH0521900Y2 (US06534493-20030318-C00166.png) | 1990-05-28 | 1990-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521900Y2 (US06534493-20030318-C00166.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029344A (ja) * | 2009-07-23 | 2011-02-10 | Molex Inc | フレキシブル配線板 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335455A (ja) * | 2006-06-12 | 2007-12-27 | Fujikura Ltd | フレキシブルプリント配線板 |
| JP4356789B2 (ja) * | 2008-03-25 | 2009-11-04 | 住友ベークライト株式会社 | 回路基板 |
| JP2009290020A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | フレキシブルプリント配線板、同配線板のシールド加工方法および電子機器 |
| JP6202177B1 (ja) * | 2016-01-21 | 2017-09-27 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932151U (ja) * | 1982-08-25 | 1984-02-28 | 日本ラインツ株式会社 | シリンダヘツドガスケツト |
| JPS6243200A (ja) * | 1985-08-20 | 1987-02-25 | 日本シイエムケイ株式会社 | プリント配線板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121063U (US06534493-20030318-C00166.png) * | 1973-02-12 | 1974-10-17 |
-
1990
- 1990-05-28 JP JP1990055801U patent/JPH0521900Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932151U (ja) * | 1982-08-25 | 1984-02-28 | 日本ラインツ株式会社 | シリンダヘツドガスケツト |
| JPS6243200A (ja) * | 1985-08-20 | 1987-02-25 | 日本シイエムケイ株式会社 | プリント配線板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029344A (ja) * | 2009-07-23 | 2011-02-10 | Molex Inc | フレキシブル配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415256U (US06534493-20030318-C00166.png) | 1992-02-06 |
