JPH0521894Y2 - - Google Patents

Info

Publication number
JPH0521894Y2
JPH0521894Y2 JP1987124658U JP12465887U JPH0521894Y2 JP H0521894 Y2 JPH0521894 Y2 JP H0521894Y2 JP 1987124658 U JP1987124658 U JP 1987124658U JP 12465887 U JP12465887 U JP 12465887U JP H0521894 Y2 JPH0521894 Y2 JP H0521894Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
resin
groove
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987124658U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6429862U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987124658U priority Critical patent/JPH0521894Y2/ja
Publication of JPS6429862U publication Critical patent/JPS6429862U/ja
Application granted granted Critical
Publication of JPH0521894Y2 publication Critical patent/JPH0521894Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987124658U 1987-08-14 1987-08-14 Expired - Lifetime JPH0521894Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987124658U JPH0521894Y2 (enExample) 1987-08-14 1987-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987124658U JPH0521894Y2 (enExample) 1987-08-14 1987-08-14

Publications (2)

Publication Number Publication Date
JPS6429862U JPS6429862U (enExample) 1989-02-22
JPH0521894Y2 true JPH0521894Y2 (enExample) 1993-06-04

Family

ID=31374588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987124658U Expired - Lifetime JPH0521894Y2 (enExample) 1987-08-14 1987-08-14

Country Status (1)

Country Link
JP (1) JPH0521894Y2 (enExample)

Also Published As

Publication number Publication date
JPS6429862U (enExample) 1989-02-22

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