JPH05217984A - Working device and evaluating device for semiconductor - Google Patents

Abstract

PURPOSE:To obtain a semiconductor working device capable of working the surface of a semiconductor substrate inexpensively and speedy. CONSTITUTION:The device is constituted of working probes 7, capable of supplying the surface of a semiconductor substrate 1 which is to be worked with etching solution, pure water for washing and inert gas for drying, a solutions supplying device 5 supplying said solutions to the working probes 7 through a solution pouring pipe 3, a solutions discharging device 6 discharging the solutions through a solution discharging pipe 4, a moving stage 8 capable of moving the semiconductor substrate 1 freely, a driving unit 9 for the moving stage 8 and a controller 10, connecting these units electrically and carrying the series of operations out smoothly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing apparatus and a semiconductor evaluation apparatus for processing the surface of a semiconductor substrate into an arbitrary shape.

[0002]

2. Description of the Related Art FIG. 12 is a view showing a processing state of a semiconductor surface by photolithography using a resist material most commonly used in a semiconductor processing method at present, and FIG. 13 is a sectional view thereof. In these figures, 1 is a semiconductor substrate, and 30 is a resist material which is applied on the semiconductor substrate 1 and punched.

Next, a general process until the surface of the semiconductor substrate 1 is processed will be described with reference to FIGS. 14 (a) to 14 (f). As shown in FIG. 14B, a resist material (which serves as a mask at the time of etching) 30 is formed on the semiconductor substrate (thickness to 500 μm) 1 shown in FIG. After application, the resist material 30 is baked and dried. Next, as shown in FIG. 14C, photolithography, that is, using a mask on which a pattern having a shape to be processed is formed, the resist material 30 is chemically changed by light transmitted through the mask so that the resist material 30 can be removed. Reference numeral 31 is this photosensitive portion. Next, as shown in FIG. 14D, the photosensitive portion 31 is removed by developing and rinsing. Resist material 30 patterned in this way
Is used as a mask for an etching solution (acid or alkali) for processing. Next, as shown in FIG. 14E, the semiconductor substrate 1 is reacted with an arbitrary acid or alkali solution, reactive gas or the like, and removed by etching. At this time, the shape and depth to be dug are determined by the resist mask formed by photolithography and the etching conditions (type of solution, concentration, temperature, time, etc.). Next, as shown in FIG.
The unnecessary resist material 30 on the semiconductor substrate 1 etched into a desired shape is removed by using an organic solvent or a reactive gas. As described above, a desired pattern has a positional accuracy of about ± 1 on the semiconductor substrate 1 through a series of processes.
It is formed with a depth accuracy of ± 0.1 to 0.2 μm (wet etching).

[0004]

In the conventional example, when the surface of the semiconductor substrate is processed, it is formed through the above process, so that even if the positional accuracy does not matter so much (± several hundred μm). However, there has been a problem that the processing requires a lot of time and processing cost. Further, when the quality evaluation of the thin film crystal of the semiconductor substrate in which the thin film crystals are laminated in multiple layers is performed for each layer, the same steps as above are required, and there is a similar problem that it takes time and processing cost.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a semiconductor processing apparatus capable of processing the surface of a semiconductor substrate easily in a short time and at low cost. Furthermore, it aims at providing the semiconductor evaluation apparatus which applied this apparatus.

[0006]

In a semiconductor processing apparatus according to the present invention, a solution that dissolves the surface of a semiconductor substrate can be supplied to and discharged only from a processed portion of the surface of a semiconductor substrate, and the processed portion can be processed after processing. Is designed so that it can be washed and dried, and the portion that should not be processed is not processed. Further, the semiconductor evaluation apparatus according to the present invention is such that an optical fiber for material analysis is inserted into a processed portion of a semiconductor substrate during a cleaning process to irradiate light, and another optical fiber receives the light of the processed portion and receives the light. Is analyzed and evaluated.

[0007]

In the semiconductor processing apparatus according to the present invention, the solution for etching the semiconductor substrate is supplied to a desired position of the semiconductor substrate, and the solution does not seep out to other portions. The surface of the semiconductor substrate can be processed only at the position. In addition to supplying the solution, discharging the solution after etching, cleaning the etching solution,
Drying after washing can be sequentially and automatically performed. Furthermore, the etching process can be performed without using a photographic process, and the minimum necessary etching liquid can be supplied to a necessary place.

Further, in the semiconductor evaluation apparatus according to the present invention, even when a large number of thin film crystals are laminated on the surface of the semiconductor substrate, the measuring terminals sequentially evaluate each layer while etching each layer in the processing probe, so that it takes a single time. It is possible to obtain information on the material quality in the depth direction of a semiconductor substrate having a complicated structure.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a block diagram of a semiconductor processing apparatus showing an embodiment of the present invention, and FIG. 2 is an external perspective view of the processing probe 7 of FIG. In these figures, 1 is a semiconductor substrate, 2 is a solution enclosure, and surrounds the tip of a solution injection pipe 3 for supplying a solution for etching, a cleaning liquid, an inert gas for drying, etc. onto the semiconductor substrate 1. In order to prevent the solution supplied to the surface of the semiconductor substrate 1 from etching other than a desired position, the solution is confined. 4 is a solution discharge pipe which is inserted into the solution enclosure 2 and discharges the solution in the space surrounded by the semiconductor substrate 1 and the solution enclosure 2. 5 is attached to one end of the solution injection pipe 3, A solution supply device for supplying a cleaning liquid, an inert gas, etc. to the solution injection pipe 3, 6 is attached to one end of the solution discharge pipe 4, and the solution enclosure 2
The solution discharge device for discharging the internal solution, the inert gas and the like, 7 is the above-mentioned processing probe, and is composed of the solution enclosure 2, the solution injection pipe 3, and the solution discharge pipe 4. 8 is a moving stage for placing the semiconductor substrate 1 and moving the semiconductor substrate 1 to the position of the processing probe 7, and 9 is this moving stage 8
Drive unit 10 for moving the up, down, left and right
The controller is electrically connected to the solution supply device 5 and the solution discharge device 6, and outputs a control signal for moving these parts in conjunction with each other. Although the solution encapsulator 2 is actually a very small one, it is shown enlarged in order to make the structure easy to understand.

Next, the operation of the present invention will be described with reference to FIG. Note that (1) to (22) indicate each step. First, the semiconductor substrate 1 to be processed is moved by a transfer device or manually (1) and set at a predetermined position on the moving stage 8 (2). Next, the moving stage 8 moves so that the processing probe 7 contacts the processing position on the semiconductor substrate 1 (3). Next, when the processing position on the semiconductor substrate 1 and the tip of the processing probe 7 coincide with each other (4), pure water is supplied from the solution supply device 5 (5). Further, the solution discharge device 6 operates so that the amount of pure water in the solution enclosure 2 becomes constant (6). The set time is processed by the timer (7), and then the pure water supply is stopped (8). When the inside of the solution enclosure 2 becomes empty, the solution discharge device 6 stops (9),
The etching liquid is supplied from the solution supplying device 5 (10),
The solution discharging device 6 operates so that the amount of the etching liquid becomes constant (11). After that, it is processed according to the timer setting time (12), when the etching is finished, the supply of the etching solution is stopped (13), and the solution ejecting device 6 is stopped even if the inside of the solution enclosure 2 is empty (14), Pure water is supplied (15). After cleaning for a set time (1
6), the pure water supply is stopped (17), an inert gas is supplied from the solution supply device 5 (18), and a drying process is performed for a set time (19), and the inert gas fed into the solution enclosure 2 is inactivated. When the processed portion is dried by the gas, the supply of the inert gas is stopped (20), and the processing of one point is completed. After that, it is judged whether the processing at all the set locations is completed (2
1) If there is another processing place, the moving stage 8 moves,
Returning to step (2), similar processing is started. When all the processing points are completed, the semiconductor substrate 1 is returned from the stage 8 to the original position, for example, a wafer basket (2
2) The processing of one semiconductor substrate 1 is completed. When there are many semiconductor substrates 1, this operation is repeated.

In the above embodiment, the tip portion of the solution encapsulator 2 is not devised. However, as shown in FIGS. The effect of preventing leakage to the outside increases. Further, the solution injection pipe 3 and the solution discharge pipe 4 inside the solution encapsulator 2 are arranged such that the solution injection pipe 3 is centered and surrounded by the solution discharge pipe 4 as shown in FIGS. 4 and 5. Thus, the solution can be discharged more effectively.
This is also effective in enhancing the effect of preventing the solution from leaking to the outside of the solution enclosure 2.

Further, in the above embodiment, the moving stage 8 and the processing probe 7 are arranged so as to supply the solution from above the semiconductor substrate 1. However, as shown in FIGS. When the processing probe 7 and the moving stage 8 are arranged so as to face downward, the supply solution is the semiconductor substrate 1
Since the structure is such that it does not accumulate on the surface and flows immediately downward, it is a structure in which the processing accuracy controllability is improved.

Next, an embodiment of the semiconductor evaluation apparatus provided in the semiconductor processing apparatus of the above embodiment will be described. FIG. 8 is a diagram showing the configuration of an embodiment of the semiconductor evaluation device of the present invention.
The same reference numerals as those in FIG. 1 indicate the same components, and 12 is an optical fiber which is inserted into the processing probe 7 and irradiates the surface of the semiconductor substrate 1 to be etched with laser light.
Reference numeral 13 denotes an optical fiber which is inserted into the processing probe 7 to receive light emitted from the semiconductor substrate 1, and 14 is connected to one end of the optical fiber 12 and is a laser light source for introducing laser light into the optical fiber 12. Reference numeral 15 denotes a spectroscope connected to one end of the optical fiber 13 for dispersing the light received by the optical fiber 13, and 16 a driving unit 9 of the moving stage 8, a solution supplying device 5, a solution discharging device 6 , A laser light source 14 and a spectroscope 15 are electrically connected to each other to output a control signal for controlling each device, analyze the measurement data measured by the spectroscope 15, and output the result on a display or a printer. Is a controller computer having. FIG. 9 is a structural cross-sectional view of the processing probe 7 in FIG. FIG. 10 is a schematic perspective view showing how the processing probe 7 evaluates while drawing and processing by precisely moving the semiconductor substrate 1. In addition, an operation flowchart of the semiconductor evaluation device of FIG. 8 is shown in FIG.
Shown in 1. In addition, (1) to (26) in this figure indicate each step. This operation is similar to that of FIG. 3, but the evaluation flow (1
It is characterized by containing 6) to (19).
That is, during the pure water cleaning step (15), the laser light source 14
Laser light is irradiated onto the semiconductor substrate 1 from the optical fiber 12 through the optical fiber 12 (16), the light from the surface of the semiconductor substrate 1 is received by the optical fiber 13 (17), and these data are input to the controller computer 16. Processing (18),
The result is output by a display or a printer (19).

[0014]

As described above, according to the semiconductor processing apparatus of the present invention, the etching liquid can be supplied only to the portion of the surface of the semiconductor substrate to be processed. There is an effect that a small number of semiconductor processing devices that can be processed inexpensively and speedily are obtained.

Further, according to the semiconductor evaluation apparatus of the present invention, it is possible to obtain a semiconductor evaluation apparatus capable of easily and speedily performing quality evaluation in the depth direction from the surface of the semiconductor substrate.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a semiconductor processing apparatus showing an embodiment of the present invention.

FIG. 2 is an external perspective view of the processing probe shown in FIG.

FIG. 3 is a flowchart illustrating the operation of FIG.

FIG. 4 is a configuration diagram showing a cross section of a main part of an embodiment in which a sealing material is provided at the tip of the processing probe in FIG.

5 is an external perspective view of the processing probe of FIG. 4. FIG.

FIG. 6 is a sectional view of a processing probe portion showing another embodiment of the semiconductor processing apparatus of the present invention.

FIG. 7 is an external perspective view of FIG.

FIG. 8 is a schematic configuration diagram showing an embodiment of a semiconductor evaluation device to which the semiconductor processing device of the present invention is applied.

9 is a cross-sectional view of the processing probe portion of FIG.

FIG. 10 is a perspective view of a main part showing an evaluation state of a semiconductor substrate.

FIG. 11 is a flowchart illustrating an operation of the semiconductor evaluation device of the present invention.

FIG. 12 is a perspective view showing a processed state of a conventional semiconductor substrate surface.

13 is a cross-sectional view of FIG.

FIG. 14 is a cross-sectional view showing a conventional process for processing a semiconductor substrate.

[Explanation of symbols]

 1 Semiconductor Substrate 2 Solution Encapsulator 3 Solution Injection Pipe 4 Solution Discharge Pipe 5 Solution Discharge Device 6 Solution Discharge Device 7 Processing Probe 8 Moving Stage 9 Drive Unit 10 Controller 11 Sealing Material 12 Optical Fiber 13 Optical Fiber 14 Laser Light Source 15 Spectroscopy 16 controller computer

Claims (2)

[Claims] 1. A movable stage capable of freely moving a semiconductor substrate; a solution encapsulation containing a solution such as an etching solution, pure water for cleaning, and an inert gas for drying only in a processed portion of the surface of the semiconductor substrate. A container; a solution injection pipe for injecting the etching solution, pure water for cleaning, and an inert gas for drying into the solution enclosure; and a constant amount of the solutions injected into the solution enclosure. A processing probe including a solution discharge pipe for supplying the solution; a solution supply device that supplies the solution through the solution injection pipe; a solution discharge device that discharges the solution through the solution discharge pipe; A semiconductor processing apparatus comprising: a controller that controls a series of these operations. 2. A moving stage capable of freely moving a semiconductor substrate; a solution encapsulation containing a solution such as an etching solution, pure water for cleaning, and an inert gas for drying only in a processed portion of the surface of the semiconductor substrate. A container; a solution injection pipe for injecting the etching solution, pure water for cleaning, and an inert gas for drying into the solution enclosure; and a constant amount of the solutions injected into the solution enclosure. A processing probe including a solution discharge pipe for supplying the solution; a solution supply device that supplies the solution through the solution injection pipe; a solution discharge device that discharges the solution through the solution discharge pipe; A controller for controlling these series of operations; an optical fiber for irradiating the semiconductor substrate with a laser beam during the cleaning process with the pure water in the processing probe; receiving light from the semiconductor substrate An optical fiber, a laser light source that emits the laser light, a spectroscope that disperses the light received by the optical fiber, and a display unit that analyzes the measurement data measured by the spectroscope and displays the result. 2. A semiconductor evaluation device comprising: a controller computer;