JPH1076213A - Method and apparatus for coating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To check whether a coating liq. to be jetted is proper or not in advance so as not to decrease yield by mixing impurities such as particles into the coating liq. SOLUTION: A resist liq. receiving device 51 is provided outside of a treating container 21 storing a spin chuck 22 holding a wafer W and a particle counter 52 is connected to its probe 51a. At a stage before the resist liq. is jetted on the wafer W from a resist liq. jetting nozzle N1, it is jetted into the resist liq. receiving device 51 to measure particles in the resist liq. by means of the particle counter 52.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating method and a coating apparatus for forming a predetermined coating film on a substrate to be processed.

[0002]

2. Description of the Related Art For example, in a so-called photoresist processing step in a semiconductor manufacturing process, a process of applying a resist liquid to a surface of a substrate to be processed such as a semiconductor wafer (hereinafter, referred to as "wafer") to form a resist film. When such a process is performed, the wafer is held on a rotary mounting table called a spin chuck, and a resist liquid is discharged from an appropriate discharge member, for example, a nozzle at a position above the center thereof, for example. The resist solution is diffused by centrifugal force to apply the resist solution uniformly over the entire wafer surface.

After applying the resist liquid, the wafer is heated to a predetermined temperature to cure the resist liquid, and then a predetermined pattern is exposed on the resist film by an exposure device. Therefore, if impurities such as particles are mixed in the resist film, a product having expected performance cannot be obtained when the resist film is subjected to predetermined pattern exposure, subsequent development processing, and further etching processing. Therefore, the yield may decrease. Therefore, conventionally, a filter is appropriately provided in a resist liquid supply path between the resist liquid supply source and the nozzle.

[0004]

However, according to the prior art alone, the filter deteriorates as the number of coatings increases, and particles are mixed in the discharged resist liquid, and the desired coating film is formed. May not be formed. Therefore, means for preventing such a situation is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points. In forming a predetermined coating film on a substrate to be processed by discharging a coating liquid such as a resist liquid from a discharge member such as a nozzle as described above, A coating method capable of checking in advance whether or not the discharged coating liquid is appropriate so that impurities such as particles are not mixed into the discharged coating liquid and the yield is reduced, and the coating method is suitably implemented. It is an object of the present invention to provide a coating device that can perform the coating.

[0006]

In order to achieve the above object, according to the present invention, a coating liquid is supplied from a discharge member at a predetermined discharge position to a substrate to be processed held on a rotary mounting table in a container. And forming a predetermined coating film on the substrate to be processed by discharging a simulated discharge (so-called dummy dispense) at a position different from the discharge position before discharging at the predetermined discharge position. A) a step of discharging a coating liquid at a position; and a step of measuring impurities in the coating liquid discharged at the simulated discharge position.

Since the discharge position is usually set above the center of the substrate to be processed, the simulated discharge position may be set, for example, at a position deviated from above the center. The liquid is preferably set in an area excluding the upper part of the substrate to be processed so that the liquid does not reach the substrate. To measure the impurities in the application liquid discharged at the simulated discharge position, for example, collect the discharged application liquid and measure the impurities in the application liquid by a measuring device such as a particle counter at the collecting place. Good.

Thus, according to the coating method of the first aspect,
Before discharging at the predetermined discharge position, the coating liquid is discharged at the simulated discharge position, and the impurities in the discharged coating liquid are measured. Therefore, even if impurities such as particles are mixed in the coating liquid. You can know that in advance. In addition, the impurity measurement by discharging at the simulated discharge position in such a manner is as follows.
It may be performed immediately before the start of discharge at a predetermined application position, or may be performed every predetermined time or every predetermined number of applications.

According to the second aspect, a specific discharge member selected from a plurality of discharge members is used for the substrate to be processed held on the rotary mounting table in the container, and the specific discharge member is provided at a predetermined discharge position. Forming a predetermined coating film on the substrate to be processed by discharging a coating liquid from the plurality of discharging members, wherein a step of selecting a specific discharging member from the plurality of discharging members and a position different from the predetermined discharging position At a simulated discharge position in the step of discharging the application liquid from the selected specific discharge member,
Measuring the impurities in the application liquid ejected at the simulated ejection position, and as a result of the measurement, only when the impurities are smaller than a predetermined reference value, the specific ejection member is moved to a predetermined ejection position. A coating method is provided in which the coating liquid is moved to discharge a coating liquid.

According to the coating method of the present invention, it is possible to cope with a case where there are a plurality of discharge members and a specific discharge member is selected and discharged from the plurality of discharge members when discharging the coating liquid. According to the coating method of the second aspect, the specific discharge member is moved to the predetermined discharge position only when the result of measuring impurities in the coating liquid discharged at the simulated discharge position is less than a predetermined reference value. The coating liquid is discharged by discharging the coating liquid, so that even if impurities such as particles are mixed in the coating liquid, it is possible to know in advance in the same manner as in the coating method of the first aspect. If more impurities than the value are measured, the selected specific discharge member does not move to the predetermined position, so that the coating liquid containing impurities more than the reference value is erroneously discharged onto the substrate to be processed. Never be.

According to the third aspect, a coating liquid is discharged from a discharge member at a predetermined discharge position to a substrate to be processed held on a rotary mounting table in a container, and a predetermined coating liquid is applied to the substrate to be processed. A coating liquid receiving device provided at a position different from the predetermined discharge position for receiving a coating liquid applied from a discharging member; and a coating liquid discharged to the coating liquid receiving device. A coating apparatus, comprising: an impurity measuring device for measuring impurities in the liquid.

As described in the first aspect of the present invention, the coating liquid receiving device is preferably set at a position that does not extend above the substrate to be processed. As a form, for example, a shape with a large opening at the tip can be proposed. And it may be connected to the impurity measuring device via a path constituted by an appropriate tube, pipe or the like. As the impurity measuring device, for example, a particle counter using laser light can be used. According to the coating apparatus of the third aspect, the coating method of the first aspect can be suitably performed.

When there are a plurality of ejection members such as nozzles, it is not always necessary to provide the coating liquid receiving devices for all of them, and if at least one of them is provided and shared, the entire device can be simplified and the space can be saved. Savings, cost reduction, etc. can be achieved.

According to a third aspect of the present invention, as described in the fourth aspect, the path of the coating liquid from at least the receiving portion of the coating liquid receiving device to the impurity measuring device, that is, the portion where the coating liquid is in contact with the impurity measuring device. A configuration including a cleaning mechanism for cleaning may be employed. As a result, the previous coating liquid or a different coating liquid remains attached and the amount of impurities or the like is not erroneously measured, and accurate measurement can always be performed. As an example of the cleaning mechanism, for example, when the coating liquid is a resist liquid, the solvent may be discharged to the coating liquid receiving device by a nozzle or the like in the same manner as the coating liquid.

According to the coating apparatus of the present invention, the coating liquid is discharged from the discharge member at a predetermined discharge position to the substrate to be processed held on the rotary mounting table in the container, and is applied to the substrate to be processed. An apparatus for forming a predetermined coating film, comprising an impurity measuring device for measuring impurities in the coating liquid, a supply system from a coating liquid supply source to a discharge port of a discharge member, the discharge port side or the impurity A coating device is provided, wherein a switching device capable of switching a path to a measuring device side is provided.

The coating apparatus according to the fifth aspect is different from the coating apparatuses according to the third and fourth aspects in that impurities in the coating solution are measured in a so-called in-line manner. Therefore, it is not necessary to perform a simulated discharge, and it is possible to measure impurities in the coating liquid in advance without using a coating liquid receiving device. As the switching device, for example, a switching valve such as a three-way valve can be used. When there are a plurality of ejection members and a plurality of application liquid supply sources corresponding thereto,
If the paths on the side of the impurity measuring device are connected in parallel and integrated into one, the number of paths can be saved and all the coating liquids can be measured by one impurity measuring device.

Further, in the coating apparatus of the fifth aspect,
As described in claim 6, if a cleaning device is provided for cleaning the path of the coating solution from the switching device to the impurity measuring device, that is, a portion that is in contact with the coating solution, a previous coating solution or a different coating solution may be provided. Can be prevented from remaining in the route and causing erroneous measurement. The cleaning mechanism may be configured so that, for example, when the coating liquid is a resist liquid, the solvent is caused to flow through the path on the impurity measuring device side.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG.
Adhesion treatment for improving the fixability of the resist, coating treatment of the resist solution, appropriate heating treatment performed after these treatments, cooling treatment for cooling the wafer to a predetermined temperature after the heating treatment, and development treatment after exposure, FIG. 1 shows an overview of a coating and developing processing system 1 in which various processing apparatuses that individually perform processes such as a heating process are combined as one system;
The coating apparatus according to the first embodiment is incorporated as a unit in the coating and developing processing system 1 as a resist coating apparatus.

The coating and developing system 1 includes a mounting section 2 for arranging a plurality of cassettes C, which are storage bodies for storing a plurality of wafers, and a cassette C mounted on the mounting section 2. And a transfer mechanism 4 for taking out the wafer W and transferring it to the main transfer arm 3.
Conveyance path 5 provided along the direction in which cassettes C are aligned
It is movable on the top. Various processing apparatuses that perform predetermined processing on the wafer W are disposed on both sides of each of the transfer paths 7 and 8 of the two main transfer arms 3 and 6.

Further, in order to clean the surface of the wafer W taken out of the cassette C, a brush cleaning device 9 for brush cleaning while rotating the wafer W, a water cleaning device 10 for high pressure jet cleaning of the wafer W, An adhesion processing device 11 for improving the fixability of the resist by hydrophobizing the surface, a cooling processing device 12 for cooling the wafer W to a predetermined temperature, a resist liquid coating device 13 for coating a resist liquid on the surface of the rotating wafer W, 13 A heat treatment device 14 for heating the wafer W after application of the resist solution or for heating the wafer W after exposure, and a development treatment device for supplying a developing solution to the surface of the exposed wafer W while rotating the wafer W for development. 15 and 15 are arranged. Each of these processing apparatuses is integrated to some extent, and the installation space is reduced and the processing efficiency is improved by collecting the processing apparatuses into appropriate processing apparatuses. Loading and unloading of wafers W into and from these various processing apparatuses are performed by the two main transfer arms 3 and 6 described above. Each of these processing devices and the like is disposed in the casing 16. The coating apparatus according to this embodiment includes the resist liquid coating apparatus 13.
Has been applied to

The resist liquid coating device 13 has the structure shown in FIGS. 2 and 3 in its casing 13a.
That is, a spin chuck 22 for holding a wafer W in a horizontal state by vacuum is provided in a processing container 21 for accommodating the wafer W, and the spin chuck 22 is provided with a pulse mounted below the processing container 21. It is rotatable by a drive mechanism 23 such as a motor. Also, the rotation speed can be arbitrarily controlled. The atmosphere in the processing container 21 is exhausted from the center of the bottom of the processing container 21 by exhaust means (not shown) such as a vacuum pump provided outside. The resist solution and the solvent are discharged from the outside of the spin chuck 22 to a drain tank 25 installed below the processing container 21 through a drain pipe 24 provided at the bottom of the processing container 21.

In the resist liquid applying apparatus 13 according to the first embodiment, the resist liquid discharged onto the wafer W is formed by the resist liquid discharge nozzles N constituting four discharge members.
1 to N4, and each of the resist liquid discharge nozzles N1 to N4 is paired with a solvent nozzle S1 to S4 for discharging a solvent as shown in FIGS. , Nozzle holders 31, 32, 33, 34. These nozzle holders 31 to 34 are
Within 3a, it is held by a suitable holding mechanism 13b at a position outside the processing container 21 at a distance.
In order to prevent the nozzle openings of each nozzle from being dried and solidified, the holding mechanism 13b is designed so that the nozzle openings of each nozzle are inserted into an appropriate insertion opening (not shown) and the nozzle openings are placed in a solvent atmosphere. Have been.

Each of the nozzle holders 31 to 34 has basically the same structure. For example, based on the nozzle holder 31 shown in FIG. A predetermined resist solution is supplied from a resist solution supply source R1 such as a resist solution tank provided through a resist solution supply tube 41, and a filter 42 is provided in the resist solution supply tube 41 on the way. Interposed, impurities such as particles are removed. The supply of the resist liquid itself is performed by a supply mechanism 43 such as a bellows pump, and a predetermined amount of the resist liquid is discharged. Each of the nozzle holders 31 to 34 has a holding member 31a, 32a such as a holding pin for holding a scan arm 37a to be described later,
33a and 34a are provided.

Each of the other nozzle holders 32, 33, and 34 has the same configuration as the nozzle holder 31. Each of the nozzle holders 32, 33, and 34 receives a resist solution from an independent resist solution supply source (not shown), The liquid can be discharged from the liquid discharge nozzles N2 to N4. Therefore, in this embodiment, four different resist solutions can be applied.

The nozzle holder 31 has a forward path 3 formed by a tube for circulating a temperature control fluid.
5a, a return path 35b is provided, and a temperature control fluid supplied from outside through the forward path 35a is circulated from the forward path 35a to the return path 35b, so that the resist liquid flowing in the resist liquid supply tube 41 is maintained at a constant temperature and discharged. Care is taken that the resist solution to be prepared always has a predetermined temperature.

On the other hand, the solvent from the solvent supply source T such as a solvent tank is supplied to the solvent nozzle S1 by a supply mechanism 4 such as a pump.
4, so that the solvent flowing through the solvent tube 45 is maintained at a predetermined temperature in the nozzle holder 31.
A forward path 36a and a return path 36b, each of which is formed by a tube, through which the temperature control fluid flows are provided.

As described above, the nozzle holder 31 holding the resist solution discharge nozzle N1 and the solvent nozzle S1 as a set is taken out of the holding mechanism 13b by the scan arm 37a of the scan mechanism 37, and is placed on the wafer W Moved to the position. The scan arm 37a is configured to be capable of three-dimensional movement, that is, movement in the X, Y, and Z directions. In the present embodiment,
In each of the nozzle holders 31 to 34, a resist liquid discharge nozzle N and a solvent nozzle S were held as a set.
Instead of this, each of the nozzle holders 31 to 34 may hold only the resist liquid discharge nozzle N, and may use a single solvent nozzle as a common type, and may be provided at a predetermined position of the scan arm 37a.

At a simulated discharge position between the holding mechanism 13b and the processing container 21, a resist liquid receiving device 51 serving as a coating liquid receiving device is provided. The resist liquid receiving device 51 has a pipe-like shape with an open upper end, and a probe 51a for obtaining a sample for measuring the resist liquid is provided at the lower end thereof,
The probe 51a is connected to a particle counter 52 as an impurity measuring device. The particle counter 52 uses, for example, a laser beam,
It has a configuration for measuring the number of particles in the resist solution. The resist solution and the like stored in the probe 51a are discharged through the pipe 53 together with the drainage from the drain tank 25.

The main part of the resist liquid coating apparatus 13 according to the first embodiment has the above-described configuration. When the wafer W is placed on the spin chuck 22 in the processing vessel 21, a vacuum is applied. Is held by suction. Next, for example, the spin chuck 22 starts rotating, and at the same time, selects the resist solution discharge nozzle Nx for supplying a predetermined resist solution, and the scan arm 37a takes the nozzle holder having the resist solution discharge nozzle Nx. Go. For example, when the resist liquid discharge nozzle N1 is selected, the scan arm 37a goes to take the nozzle holder 31. Then, usually, the wafer is moved to a predetermined discharge position on the wafer W, first discharges the solvent from the solvent nozzle S1 and diffuses the solvent.
It is discharged from.

However, in the resist liquid coating apparatus 13 according to the first embodiment, for example, the following process can be performed. For example, before the wafer W is placed on the spin chuck 22, the scan arm 37a first picks up the selected resist solution discharge nozzle Nx, for example, the nozzle holder 31 having the resist solution discharge nozzle N1. Then, it is stopped above the resist liquid receiving device 51. Thereafter, a predetermined resist solution is supplied from the resist solution discharge nozzle N1 to the resist solution receiving device 5.
1 is discharged. Then, the particles in the discharged resist liquid are measured by the particle counter 52. When the simulated discharge is completed and the measurement is no longer troublesome, the solvent is discharged from the solvent nozzle S1 to the resist liquid receiving device 51 this time so that the next measurement is not adversely affected, so that the resist liquid adheres. Wash the part that is.

As a result of the measurement, if the amount of the particles is smaller than a predetermined reference value, the above-described normal operation is started. That is, a predetermined discharge process is performed with the wafer W placed thereon. If the result of the measurement indicates that the amount of particles is larger than a predetermined reference value, this is notified to the outside by a warning mechanism such as a warning signal, the nozzle holder 31 is returned to the holding mechanism 13b, and the operation is not continued thereafter. . For example, a normal operation is not performed until some countermeasure or allowance is made.

In this case, or alternatively, a resist solution discharge nozzle capable of supplying the same resist solution is provided in another nozzle holder 3.
2 to 34, for example, the nozzle holder 32
When the same resist liquid can be discharged from the resist liquid discharge nozzle N2 held by the printer, the warning signal is issued and the nozzle arm 31 is returned to the holding mechanism 13b.
The nozzle holder 32 holding 2 is taken out, discharged again to the resist liquid receiving device 51, and the same measurement is performed. Thus, whether or not to perform the subsequent coating process is selected. In the meantime, the worker may perform maintenance or the like of the supply system of the resist liquid discharge nozzle N1 in which the measured particle amount is larger than the reference value. Therefore, the resist liquid application processing can be continued without stopping the apparatus itself. The above processes are all automatically performed by a control mechanism (not shown).

In the case where it takes a long time to discharge the above-described resist solution in a simulated manner and to measure particles in the resist solution, for example, after a predetermined number of application times, a predetermined amount of resist is applied. It may be executed periodically after the application of the liquid or after a predetermined number of days and time has elapsed.

As can be seen from the above process, the first
According to the resist liquid application apparatus 13 according to the embodiment,
Impurities such as particles in the resist solution to be applied can be checked in advance, and an unexpected situation due to a defective resist solution can be prevented.

Further, the resist liquid receiving device 51 for simulated discharge is provided at a position away from the wafer W in the processing container 21.
, The simulated ejection does not contaminate the spin chuck 22 and the like. In view of this point, it is more preferable that the resist liquid receiving device 51 be set at a position below at least the upper surface of the processing container 21. Further, if a mechanism such as the resist liquid receiving device 51 is provided in the holding mechanism 13b itself, the space can be further reduced, and the influence on the processing container 21 and the spin chuck 22 can be further suppressed.

In the case where a mechanism such as the resist liquid receiving device 51 is attached to the holding mechanism 13b itself, the operation of taking out by the scan arm 37a and moving to the simulated discharge position is unnecessary. While the holder is being used, the measurement may be performed by discharging the resist liquid from the resist liquid discharge nozzle held by another nozzle holder that is not being used. For example, if the simulated discharge of the resist liquid from the resist liquid discharge nozzle that is scheduled to be used after the application processing of several wafers is completed and the measurement is performed, the resist coating is performed without interruption while measuring the impurities. Processing can be performed. Needless to say, like the resist liquid application device 13 according to the embodiment,
The resist liquid receiving device 5 is located at a position away from the holding mechanism 13b.
Even if 1 is installed, if there is sufficient time for the operation of the scan arm 37a, the nozzle holder holding the unused resist solution discharge nozzle is moved to the position of the resist solution receiving device 51. The measurement may be appropriately performed.

In order to keep the resist liquid receiving device 51 clean so as not to affect the next measurement, the opening of the resist liquid receiving device 51 can be opened and closed. The resist liquid receiving device 51 may be provided with a self-cleaning mechanism for discharging a solvent or the like into the resist liquid receiving device 51 itself. Note that a pump may be appropriately provided in the pipe 53 in order to improve the drainage of the probe 51a to the drain tank 25.

The resist liquid coating apparatus 13 according to the first embodiment has a structure in which a resist liquid receiving apparatus 51 is provided in the apparatus and a simulated discharge is performed to measure impurities in the resist liquid. As in the resist liquid application apparatus 61 according to the second embodiment shown in FIGS. 4 to 6, the impurities in the resist liquid may be measured by an in-line method. 4 to 6, members denoted by the same reference numerals as those of the resist liquid coating apparatus 13 according to the first embodiment indicate the same members.

The resist liquid application apparatus 61 according to the second embodiment is different from the first embodiment in that the resist liquid supply systems to the resist liquid discharge nozzles N1 to N4 in the nozzle holders 31 to 34 are different. Is that the resist liquid coating apparatus 1 according to the first embodiment
3 and different. Therefore, in other configurations,
All the points mentioned in the resist liquid application device 13 according to the first embodiment apply to the resist liquid application device 61 according to the second embodiment.

The resist liquid supply system to the resist liquid discharge nozzles N1 to N4 in each of the nozzle holders 31 to 34 of the resist liquid coating apparatus 61 according to the second embodiment has a system as shown in FIGS. It has become. That is, for example, the resist liquid from the resist liquid supply source R1 is supplied to the resist liquid discharge nozzle N1 held by the nozzle holder 31 by the supply mechanism 43.
Is supplied through a filter 42 through the filter 42.
For example, a three-way valve V1 is interposed between the nozzle 2 and the resist solution discharge nozzle N1 as a switching device for switching the supply path. Then, a probe 63 is connected to a branch tube 62a branched from the three-way valve V1.
4, a particle counter 52 is connected.
The liquid of the probe 64 is discharged together with the drain tank 25 or the drain liquid from the drain tank 25. In this case, a dedicated drain pump may be separately provided to smoothly drain the probe 63.

As shown in FIG. 6, the other resist solution discharge nozzles N2 to N4 are similarly connected to the corresponding resist solution supply tubes 64, 65 and 66 via the three-way valves V2, V3 and V4, respectively. And the branch tubes 64a, 6
5a, 66a, and further, each branch tube 64a,
65a and 66a are connected to the probe 63. Therefore, these branch tubes 62a, 64a, 65a,
66a is connected to the probe 63 in parallel.

One end of a washing tube 67 is connected to each of the branch tubes 62a, 64a, 65a, 66a connected in parallel, and the other end of the washing tube 67 is connected to a washing liquid, for example, a pump 68 by a pump 68. It is connected to a supply source T0 such as a tank for supplying a solvent for the resist solution. Therefore, when the pump 68 is operated, the solvent from the supply source T0 is supplied to the respective branch tubes 62a, 64a, 65a, 66a and the probe 6 via the washing tube 67.
3 can be washed.

In order to simplify the solvent supply system, the solvent supply source T and the supply source T0 for supplying the solvent nozzles S1 to S4 of the nozzle holders 31 to 34 may be of the same type and may be of a common type. .

The configuration of the resist liquid coating apparatus 61 according to the second embodiment is as described above. Therefore,
By simply switching the three-way valves V1 to V4, the resist liquid to be discharged from the resist liquid discharge nozzles N1 to N4 can be obtained through the corresponding branch tubes 62a, 64a, 65a, 66a. The impurity can be measured by the particle counter 52 without discharging the impurities. Therefore, impurities such as particles in the resist solution to be applied can be checked in advance, and an unexpected situation due to a defective resist solution can be prevented.

As a measurement procedure, for example, when a predetermined resist solution discharge nozzle Nx is selected from the resist solution discharge nozzles N1 to N4, the three-way valve Vx of the supply system of the resist solution discharge nozzle Nx is connected to the branch tube side, that is, The resist solution is supplied by switching to the particle counter 52 side. As a result, if the impurities satisfy a predetermined standard, a normal coating operation is performed. If the standard has not been cleared, the same procedure as in the case of the resist coating apparatus 13 according to the first embodiment may be followed. Also in this case, a series of processes are all automatically performed by a control mechanism (not shown).

As described above, according to the resist liquid application apparatus 61 according to the second embodiment, the resist liquid discharge nozzle N1
Since it is not necessary to actually discharge the resist solution from N4, the inside of the processing container 21 is not contaminated at all. Moreover, it is not necessary to provide a device such as the resist liquid receiving device 51 in the resist liquid coating device 61.

Then, when the above-mentioned measurement is not hindered, the three-way valve Vx is switched again to the resist solution discharge nozzle Nx side, and then the inside of the branch tube is washed with the solvent supplied from the washing tube 67, so that the next time, There is no effect on the measurement. In addition, since measurement can be performed using a closed inline system, the branch tubes 62a, 64a, 65a, 66a
There is no need to worry about drying and solidifying the line.

The measurement timing is the same as in the case of the resist liquid coating device 13 according to the first embodiment. After a predetermined number of times of application, a predetermined amount of resist liquid is supplied, or It can be executed periodically after a predetermined number of days and time has elapsed. Of course, the measurement can be performed irrespective of the operation of the scan arm 37a. Therefore, the measurement of the resist liquid to be supplied to the other unused resist liquid discharge nozzles Nz during the coating process using a specific resist liquid discharge nozzle Ny Can be performed in parallel.

Although each of the above-described embodiments has been embodied as a resist liquid coating apparatus, the present invention is not limited to this and can be applied to other coating apparatuses. The substrate to be processed is not limited to a wafer, but may be a glass substrate for LCD, for example.

[0050]

According to the coating method of the first and second aspects, even if impurities such as particles are mixed in the coating liquid, it is possible to know the fact in advance, and the yield can be improved. In particular, the coating method according to claim 2 can cope with a case where there are a plurality of discharge members, and if more impurities than the reference value are measured, the selected specific discharge member does not move to a predetermined position. The liquid is not erroneously discharged to the substrate to be processed.

According to the coating apparatus of the third and fourth aspects, the coating method of the first aspect can be preferably implemented, and even if impurities such as particles are mixed in the coating liquid, it is known in advance. And the yield can be improved. In particular, according to the coating apparatus of the fourth aspect, the measurement of impurities can always be performed with high accuracy.

According to the coating apparatus of the fifth and sixth aspects, even if impurities such as particles are mixed in the coating liquid, the fact can be known in advance without performing a simulated discharge, thereby improving the yield. be able to. Moreover, a coating liquid receiving device is not required. More particularly, in the coating apparatus of claim 6,
Since the flow path of the coating liquid from the switching device to the impurity measuring device can be washed, accurate measurement of impurities can always be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overview of a coating and developing system incorporating a resist liquid coating apparatus according to a first embodiment of the present invention.

FIG. 2 is an explanatory view schematically showing a configuration of a resist liquid coating apparatus according to the first embodiment.

FIG. 3 is an explanatory diagram of the resist liquid coating apparatus according to the first embodiment as viewed from above.

FIG. 4 is an explanatory view schematically showing a configuration of a resist liquid coating apparatus according to a second embodiment.

FIG. 5 is an explanatory view of a resist liquid coating apparatus according to a second embodiment as viewed from the top.

FIG. 6 is an explanatory diagram showing a supply system of a resist liquid discharge nozzle in a resist liquid coating apparatus according to a second embodiment.

[Explanation of symbols]

 Reference Signs List 13 resist liquid coating device 13a casing 13b holding mechanism 21 processing container 22 spin chuck 23 drive mechanism 31, 32, 33, 34 nozzle holder 37 scan mechanism 37a scan arm 41 resist liquid supply tube 42 filter 43 supply mechanism 45 solvent supply tube 51 resist Liquid receiving device 52 Particle counter 62, 64, 65, 66 Resist liquid supply tube 67 Cleaning tube N1 to N4 Resist liquid discharge nozzle R1 to R4 Resist liquid supply source S1 to S4 Solvent nozzle T Solvent supply source T0 supply source V1 to V4 Three-way Valve W Wafer

Claims (6)

[Claims] 1. A method for forming a predetermined coating film on a substrate to be processed by discharging a coating liquid from a discharge member at a predetermined discharge position to a substrate to be processed held on a rotary mounting table in a container. Before discharging at the predetermined discharging position,
A coating method comprising the steps of: discharging a coating liquid at a simulated discharge position different from the discharge position; and measuring impurities in the coating liquid discharged at the simulated discharge position. . 2. A coating liquid is discharged from a specific discharge member at a predetermined discharge position using a specific discharge member selected from a plurality of discharge members to a substrate to be processed held on a rotary mounting table in a container. And a method of forming a predetermined coating film on the substrate to be processed, wherein a step of selecting a specific discharge member from the plurality of discharge members, and a simulated discharge position at a position different from the predetermined discharge position A step of discharging the coating liquid from the selected specific discharging member, and a step of measuring impurities in the coating liquid discharged at the simulated discharge position, and as a result of the measurement, the impurities are predetermined. An application method, wherein the application liquid is ejected by moving the specific ejection member to a predetermined ejection position only when the amount is smaller than a reference value. 3. An apparatus for discharging a coating liquid from a discharge member at a predetermined discharge position to a substrate to be processed held on a rotary mounting table in a container to form a predetermined coating film on the substrate to be processed. A coating liquid receiving device that is provided at a position different from the predetermined discharging position and receives a coating liquid applied from a discharging member, and removes impurities in the coating liquid discharged to the coating liquid receiving device. An application device, comprising: an impurity measuring device for measuring. 4. The coating apparatus according to claim 3, further comprising a cleaning mechanism for cleaning a path of the coating liquid from at least a receiving portion of the coating liquid receiving apparatus to the impurity measuring device. 5. An apparatus for discharging a coating liquid from a discharge member at a predetermined discharge position to a substrate to be processed held on a rotary mounting table in a container to form a predetermined coating film on the substrate to be processed. Has an impurity measuring device for measuring impurities in the coating liquid, and switches a path from the coating liquid supply source to a supply system from the discharge port of the discharge member to the discharge port side or the impurity measuring device side. A coating device, wherein a free switching device is provided. 6. The coating apparatus according to claim 5, further comprising a cleaning mechanism for cleaning a path of the coating liquid from the switching device to the impurity measuring device.