JP2001077015A - Processing solution supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively remove foams in piping without wasting processing solution. SOLUTION: A circulation path from supply piping 107 to a filter 105 and from the filter 105 to supply piping 107 trough bent piping 108 (108a to 108b) is formed, and the first three way valve 113 are arranged in bent piping 108. On the other hand, a circulation path from supply piping 107 to a discharge pump 106, and from the discharge pump 106 to supply piping 107 again through purge piping 109 (109a to 109b) is formed. The second three way valve 114 are arranged in purge piping 109, and the first three way valve 113 and the second three way valve 114 are switched. Thus, a defoaming operation in piping is executed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor processing apparatus, and more particularly, to a processing liquid supply apparatus for supplying a processing liquid such as a resist liquid onto a substrate to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, in a processing liquid supply apparatus for supplying a processing seat to a substrate to be processed, a supply pipe is connected between a container containing the processing liquid and a nozzle disposed near the substrate to be processed. The processing liquid contained in the container is sent to the nozzle by a pump arranged in the middle of the supply pipe.

FIG. 14 is a schematic view of a processing liquid supply system used in a conventional coating apparatus.

As shown in FIG. 14, in this processing liquid supply system 214, a processing liquid tank 201, a liquid end sensor 203, a supply pump 204, a filter 205, a discharge pump 206, and a nozzle 202 are arranged in this order. These adjacent elements are connected by a supply pipe 207. A vent pipe 208 connected to a waste liquid tank (not shown) is attached to the filter 205.

[0005] A purge pipe 209 is attached downstream of the discharge pump 206 in the processing liquid moving direction. The purge pipe 209 is connected to a T-shaped branch pipe 213 attached to a supply pipe 207b between the processing liquid tank 201 and the liquid end sensor 203.
The processing liquid having passed through the flow path 09 is merged with the supply pipe 207b.

Meanwhile, in the processing liquid supply system 214 having a structure in which the container 207 and the nozzle 202 are connected by a long supply pipe 207 as shown in FIG. 14, bubbles may be formed in the supply pipe 207 in some cases. If this is left as it is, the amount of the processing liquid discharged from the nozzle 202 to the substrate to be processed such as the wafer W may fluctuate, thereby deteriorating the quality of the wafer W. Therefore, as shown in FIG.
In No. 4, a bubble removing mechanism is provided.

That is, when air enters the supply pipe 207, such as when a new processing liquid is introduced into the processing liquid tank 201 or when a new processing liquid is supplied by replacing the filter module in the filter 205. When the supply of the processing liquid is started, the supply pump 204 is operated with the vent valve 211 of the vent pipe 208 opened, and the processing liquid pumped from the processing liquid tank 201 is sent to the filter 205. At first, a processing liquid containing a large amount of bubbles is sent into the filter 205, and the amount of the bubbles gradually decreases, and then a processing liquid containing no bubbles is supplied. Therefore, the processing liquid containing bubbles has been disposed of in a waste liquid tank (not shown) via the vent pipe 208.

However, when the supply pump 204 is operated with the vent valve 211 opened, all the processing liquid is discarded, so that there is a problem that the processing liquid is wasted.

Also, bubbles may be generated in the supply pipe 207 during the normal operation of discharging the processing liquid from the nozzle 202 to the wafer W. In this case, the purge pipe 209 connected to the discharge side of the discharge pump 206 Purge valve 212
Is opened, and the processing solution containing bubbles is sent to the purge pipe 209 side.

However, this purge pipe 209 is connected to a T-shaped branch pipe 213 provided in the supply pipe 207b between the processing liquid tank 201 and the liquid end sensor 203, and the processing liquid containing bubbles is again discharged. There is a problem that the supply of the processing liquid in an accurate amount is prevented by circulating in the supply pipe 207.

[0011]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems.

That is, an object of the present invention is to provide a processing liquid supply apparatus capable of eliminating waste of a processing liquid.

It is another object of the present invention to provide a processing liquid supply apparatus capable of effectively removing bubbles.

[0014]

In order to solve the above-mentioned problems, a processing liquid supply apparatus according to the present invention comprises: a discharge unit for discharging a processing liquid onto a substrate to be processed; a processing liquid supply source for containing the processing liquid; A supply pipe connecting the discharge unit and the processing liquid supply source, a pump disposed in the supply pipe, a means for controlling the operation of the pump, and a pipe between the processing liquid supply source and the pump A branch pipe, a bypass pipe connecting the branch pipe and the pump, and a three-way valve disposed in the bypass pipe and communicating the pump with the branch pipe or the waste pipe. Means for switching the three-way valve.

In the above-mentioned processing liquid supply apparatus, the discharging means is, for example, a nozzle for discharging the processing liquid to the wafer W.
The processing liquid supply source refers to, for example, a processing liquid tank that stores a processing liquid. The supply pipe refers to a pipe for supplying a processing liquid from the processing liquid supply source to the discharge unit, and a liquid end sensor disposed in the middle, a supply pump, a filter, a discharge pump, and the like. Refers to the pipe to connect. The pump refers to, for example, one or both of a supply pump and a discharge pump. The means for controlling the operation of the pump refers to, for example, a control device for controlling the operation of the supply pump and the discharge pump. The branch pipe refers to, for example, a T-shaped branch pipe connecting a supply pipe and a purge pipe, and a cross branch pipe connecting a supply pipe to a purge pipe and a vent pipe. The bypass pipe means a pipe other than the supply pipe, for example, one or both of a purge pipe and a vent pipe.

The three-way valve is, for example, a valve having one input side and two output sides, and capable of switching between one of the two output sides and one input side. The means for switching the three-way valve means, for example, means for switching the three-way valve by a mechanical or electrical method, such as a solenoid.

In the processing liquid supply apparatus of the present invention, the vent pipe and the supply pipe are communicated with each other through a T-shaped branch pipe or a cross branch pipe, and a three-way valve is attached in the middle of the vent pipe to provide a waste liquid tank to the vent pipe. Alternatively, the communication with the supply pipe may be switched.

Further, in the processing liquid supply apparatus of the present invention, the purge pipe and the supply pipe are communicated with each other through a T-shaped branch pipe or a cross branch pipe. The communication with the tank or the supply pipe may be switched.

Further, as described above, the vent pipe, the purge pipe, and the supply pipe are connected through the cross branch pipe, and a three-way valve is attached to each of the vent pipe and the purge pipe.
The processing solution containing bubbles may be disposed in the waste liquid tank from either the vent pipe or the purge pipe.

Further, a means for controlling the three-way valve may be further provided, and the three-way valve may be operated periodically to discard the processing solution containing bubbles from the vent pipe or the purge pipe.

Further, a sensor for detecting the presence or absence of bubbles is provided in the middle of the supply pipe, and when bubbles are generated in the processing liquid supply system, the three-way valve is operated to contain bubbles from the vent pipe or the purge pipe. The processing liquid may be discarded.

In this processing liquid supply apparatus, the vent pipe and the purge pipe are connected to the supply pipe, while the vent pipe and the purge pipe are provided with a three-way valve. Only the processing solution containing bubbles can be discarded. Therefore, useless disposal of the processing liquid can be almost eliminated. Further, since the processing liquid containing bubbles does not recirculate, the discharge amount of the processing liquid can be accurately controlled.

Further, another processing liquid supply device of the present invention comprises:
Discharging means for discharging the processing liquid to the substrate to be processed, a processing liquid supply source for containing the processing liquid, a supply pipe connecting the discharging means and the processing liquid supply source, and a discharging means from the processing liquid supply source to the discharging means. A pump for supplying a processing liquid, a filter interposed in a supply pipe between the pump and the discharge means, a bypass pipe connecting the filter and a supply pipe upstream of the pump, and a branch from the bypass pipe. And a switching valve for switching the processing liquid in the bypass pipe between the upstream side of the pump and the waste liquid pipe.

In the above processing liquid supply apparatus, the bypass pipe may connect the pump and the supply pipe. Further, two bypass pipes may be used, and the filter and the supply pipe may be connected by one bypass pipe, and the pump and the supply pipe may be connected by another bypass pipe.

Further, the switching valve may be driven at a predetermined timing.

In the above-mentioned processing liquid supply apparatus, in addition to the supply pipe, a bypass pipe connecting the supply pipe to the filter or the pump is provided, and a waste liquid pipe is provided in the bypass pipe via a switching valve. Therefore, by switching the switching valve at an appropriate timing, bubbles in the pipe can be efficiently removed.

According to still another aspect of the present invention, there is provided a processing liquid supply apparatus for discharging a processing liquid to a substrate to be processed, a processing liquid supply source for storing the processing liquid, the discharging means and the processing liquid supply source. Supply pipe, a pump disposed in the supply pipe, means for controlling the operation of the pump, a branch pipe disposed in a supply pipe between the processing liquid supply source and the pump, A bypass pipe that connects the pump and the branch pipe, a return pipe that branches from the bypass pipe and connects to the processing liquid supply source, A first three-way valve for communicating with the return pipe, a means for switching the first three-way valve, and a first three-way valve disposed between the first three-way valve and the branch pipe; The bypass pipe or waste liquid for the three-way valve And means for switching the second three-way valve for communicating, said second three-way valve between.

According to still another aspect of the present invention, there is provided a processing liquid supply apparatus for discharging a processing liquid onto a substrate to be processed, a processing liquid supply source for containing the processing liquid, the discharging means and the processing liquid supply source. And a discharge pump disposed in the supply pipe, a supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source, and operation of the discharge pump and the supply pump. And a filter disposed in a supply pipe between the discharge pump and the supply pump, and a branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source. A vent pipe connecting the filter and the branch pipe, a purge pipe connecting the discharge pump and the branch pipe, and branching from the vent pipe and the purge pipe to the processing liquid supply source. Back tying between A tube, disposed in the vent pipe,
A vent-side three-way valve for communicating between the branch pipe or the return pipe to the filter, a means for switching the vent-side three-way valve, and a branch pipe disposed on the purge pipe and branching from the discharge pump. A purge-side three-way valve for communicating between a pipe or a return pipe, means for switching the purge-side three-way valve, and disposed on the vent pipe, for communicating the vent-side three-way valve with the branch pipe, or A vent-side three-way valve communicating with the waste liquid pipe, or a vent-side switching valve for communicating the branch pipe with the waste liquid pipe, a means for switching the vent-side switching valve, and the purge pipe; A purge side switching valve that communicates a purge side three-way valve with the branch pipe, or communicates the purge side three-way valve with the waste liquid pipe, or communicates the branch pipe with the waste liquid pipe, and the purge side And means for switching-way valve is disposed in the branch pipe, the branch pipe, in the supply pipe, the vent in the pipe, comprising a, a processing solution removing means for removing the processing solution in the purge line.

[0029] The treatment liquid supply device may be further provided with a means disposed between the filter and the vent-side three-way valve for detecting bubbles on the vent side.

[0030] The processing liquid supply device may further include means disposed between the discharge pump and the purge side three-way valve for detecting bubbles on the purge side.

Further, the processing liquid supply device is configured to perform the processing at a predetermined timing based on detection of bubbles existing in the vent pipe and the purge pipe by the vent side bubble detecting means and the purge side foam detecting means. Vent side three-way valve,
Control means for switching the purge-side three-way valve, the vent-side switching valve, and the purge-side switching valve may be further provided.

Further, the processing liquid supply device may further include a vent-side vibrator disposed between the filter and the vent-side bubble detecting means.

Further, the processing liquid supply device may further include a purge-side vibrator disposed between the discharge pump and the purge-side bubble detecting means.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a semiconductor wafer provided with a resist coating unit (COT) according to an embodiment of the present invention (hereinafter referred to as a “COT”).
FIG. 1 is a plan view showing an entire W coating and developing processing system 1 (referred to as a “wafer”).

In the coating and developing processing system 1, a plurality of wafers W as objects to be processed are loaded into and unloaded from the system in units of, for example, 25 wafer cassettes CR. A cassette station 10 for loading and unloading, a processing station 11 in which various single-wafer processing units for performing predetermined processing on the wafers W one by one in a coating and developing process are arranged at predetermined positions in multiple stages, and An interface unit 12 for transferring a wafer W to and from an exposure apparatus (not shown) provided adjacent to the processing station 11 is integrally connected.

In the cassette station 10, a plurality of wafer cassettes CR, for example, up to four wafer cassettes CR are arranged at the positions of the positioning projections 20a on the cassette mounting table 20 in the X direction (see FIG. 1, a wafer carrier 21 which is placed in a line and is movable in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction; vertical direction) of the wafers W stored in the wafer cassette CR. Selectively access each wafer cassette CR.

The wafer transfer body 21 is rotatable in the θ direction, and as will be described later, a third
Access to the processing unit group G ₃ of the multi-stage unit section disposed in the alignment unit (ALIM) and an extension unit (EXT).

The processing station 11 is provided with a vertical transfer type main arm 22 having a wafer transfer device.
All the processing units are arranged in multiple stages around one or more sets.

FIG. 2 is a front view of the coating and developing system 1.

[0041] In the first processing unit group G _1, the cup C
Two spinner type processing units, for example, a resist coating unit (COT) and a developing unit (DEV), which perform a predetermined process by placing the wafer W on the spin chuck in the P, are stacked in two stages from the bottom. In the second processing unit group G _2, two spinner-type processing units, for example, the resist coating unit (COT) and a developing unit (D
EV) are stacked in two stages in order from the bottom. These resist coating units (COT) are preferably arranged in the lower stage as described above because drainage of the resist solution is troublesome both mechanically and in terms of maintenance. However, it is of course possible to appropriately arrange the upper stage as needed.

FIG. 3 is a rear view of the coating and developing system 1.

In the main arm 22, a wafer transfer device 46 is provided inside the cylindrical support 49 so as to be able to move up and down in the vertical direction (Z direction). The cylindrical support 49 is connected to a rotation shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 46 about the rotation shaft by the rotation driving force of the motor, whereby the wafer transfer is performed. The device 46 is rotatable in the θ direction. Note that the cylindrical support 49 may be configured to be connected to another rotating shaft (not shown) rotated by the motor.

The wafer transfer device 46 is provided with a plurality of holding members 48 movable in the front-rear direction of the transfer base 47, and these holding members 48 transfer the wafer W between the processing units. Is possible.

Further, as shown in FIG. 1, in this coating and developing processing system 1, five processing unit groups G ₁ , G ₂ , G
₃ , G ₄ , G ₅ can be arranged, and the multi-stage units of the first and second processing unit groups G ₁ , G ₂ are arranged on the system front (front side in FIG. 1) side, and the third processing unit multistage unit group G ₃ are cassette station 10
, And the multi-stage unit of the _fourth processing unit group G ₄ is disposed adjacent to the interface unit 12,
Multistage unit of the fifth processing unit group G ₅ is capable of being disposed on the rear side.

As shown in FIG. 3, in the third processing unit group G ₃ , an oven-type processing unit for performing a predetermined process by placing the wafer W on a holding table (not shown), for example, a cooling process for performing a cooling process Unit (COL), adhesion unit (AD) for performing so-called hydrophobic treatment for improving the fixability of resist, alignment unit (ALIM) for positioning, extension unit (EXT), heat treatment before exposure processing Prebaking unit (PREBAKE) for performing heat treatment and postbaking unit (POBAKE) for performing heat treatment after exposure processing
Are, for example, stacked in eight stages from the bottom. Even the fourth processing unit group G _4, oven-type processing units, for example, a cooling unit (COL), an extension and cooling unit (EXTCOL), extension unit (EXT), a cooling unit Bok (CO
L), a pre-baking unit (PREBAKE) and a post-baking unit (POBAKE) are stacked in order from the bottom, for example, in eight stages.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE) and the adhesion having a high processing temperature are arranged. By arranging the units (AD) in the upper stage, thermal mutual interference between the units can be reduced. Of course, a random multi-stage arrangement may be used.

As shown in FIG. 1, the interface unit 12
In the depth direction (X direction), the processing station 11
But has a smaller size in the width direction (Y direction). A portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages at the front of the interface unit 12, while a peripheral exposure device 23 is arranged at the rear, and a central exposure unit is further arranged at the center. Is provided with a wafer carrier 24. This wafer carrier 24
Moves in the X and Z directions to access both cassettes CR and BR and the peripheral exposure device 23.

The wafer transfer body 24 is also rotatable in the θ direction, and includes an extension unit (EXT) disposed in the multi-stage unit of the fourth processing unit group G ₄ on the processing station 11 side and an adjacent exposure unit. The wafer delivery table (not shown) on the apparatus side can also be accessed.

In the coating and developing system 1, the multi-stage unit of the _fifth processing unit group G5 shown by the broken line in FIG. 1 can be arranged on the back side of the main arm 22 as described above. multistage unit of the processing unit group G ₅ is
It is movable in the Y direction along the guide rail 25. Therefore, even if this is provided fifth as illustrated multistage unit of the processing unit group G ₅ of, by moving along the guide rail 25, the space portion can be secured, behind the main arm 22 Maintenance work can be performed easily.

Next, the resist coating unit (COT) according to this embodiment will be described.

FIG. 4 is a schematic sectional view of a resist coating unit (COT) according to this embodiment.

An annular cup C # is provided at the center of the resist coating unit (COT), and a spin chuck 51 is provided inside the cup C #. The spin chuck 51 is rotationally driven by a drive motor 52 in a state where the wafer W is fixedly held by vacuum suction.

The drive motor 52 is disposed in an opening 50a provided in the unit bottom plate 50 so as to be able to move up and down, and a cap-shaped flange member 53 made of, for example, aluminum.
Lifting drive means 5 comprising, for example, an air cylinder
4 and the lifting guide means 55.

A resist nozzle 60 for discharging a resist liquid as a coating liquid onto the surface of the wafer W is detachably attached to a tip of a resist nozzle scan arm 61 via a nozzle holder 62. The resist nozzle scan arm 61 is attached to the upper end of a vertical support member 64 that can move horizontally on a guide rail 63 laid in one direction (Y direction) on the unit bottom plate 50, and is not shown in the Y direction. Vertical support member 6 by drive mechanism
4 and moves in the Y direction.

FIG. 5 is a schematic plan view of a resist coating unit (COT) according to the present embodiment.

The resist nozzle scan arm 61 can also be moved in the Χ direction perpendicular to the Y direction in order to selectively mount the resist nozzle 60 in the resist nozzle standby section 65, and is moved in the Χ direction by a Χ direction driving mechanism (not shown). Can also move.

Further, in the resist nozzle standby section 65, the discharge port of the resist nozzle 60 is inserted into the port 65a of the solvent atmosphere chamber, and is exposed to the solvent atmosphere, whereby the resist liquid at the tip of the resist nozzle 60 solidifies or deteriorates. Not to be. Further, a plurality of resist nozzles 60,
Are provided, and the resist nozzles 60 can be used properly according to the type and viscosity of the resist solution.

Further, on the guide rail 63, a vertical support member 6 for supporting the resist nozzle scan arm 61 is provided.
In addition to the vertical support member 4, a vertical support member 71 that supports the rinse nozzle scan arm 70 and is movable in the Y direction is also provided.

The rinse nozzle scan arm 70 is moved by the Y-direction drive mechanism (not shown) so that the rinse nozzle standby position (solid line position) set on the side of the cup CP and the semiconductor wafer W mounted on the spin chuck 51. It is configured to translate or linearly move between a rinsing liquid discharge position (a position indicated by a dotted line) set immediately above the peripheral portion.

As shown in FIG. 4, the resist nozzle 60
Is connected via a resist supply pipe 66 to a resist liquid supply mechanism disposed in the lower chamber of the resist coating unit (COT).

Next, the resist supply system of the resist coating unit (COT) according to the present embodiment will be described.

FIG. 6 is a schematic diagram of a resist supply system of the resist coating unit (COT) according to the present embodiment. In the figure, solid lines indicate piping, and dotted lines indicate electrical wiring.

As shown in FIG. 6, in this resist supply system 100, a resist tank 101 as a container, a liquid end sensor 103, a supply pump 104, a filter 105, a discharge pump 106, and a resist nozzle 60 move the resist liquid. The components are arranged in this order, that is, in the direction, and the adjacent elements are connected by a supply pipe 107. Waste liquid tank (not shown) for filter 105
Is connected.

The discharge side of the supply pump 104 and the discharge pump 1
06 is connected to the suction side via a filter 105, and the resist liquid discharged from the supply pump 104 is sent to the discharge pump 106 after passing through the filter 105 once.

Inside the filter 105, the supply pipe 107
a filter module (not shown) for filtering the resist liquid between the connection with the supply pipe 107e and the connection with the supply pipe 107e
The resist solution sent from the supply pump 104 is sent to the discharge pump 106 side after being filtered through the filter module.

A purge pipe 109 is attached downstream of the discharge pump 106 in the processing liquid moving direction. The purge pipe 109 is connected to the container 101 and the liquid end sensor 10.
3 is connected to a cross branch pipe 110 attached to a supply pipe 107b between the supply pipe 107b and the supply pipe 107b.

One end of the above-mentioned vent pipe 108 is also connected to the cross branch pipe 110 so that the resist solution having passed through the vent pipe 108 is joined to the supply pipe 107b.

In the middle of the vent pipe 108, a first three-way valve
That is, the vent-side three-way valve 113 is provided.

The input side of the first three-way valve 113 is connected to the filter 105, and one of the two output sides of the first three-way valve 113 is connected to the cross pipe 110 connected to the supply pipe 117b.
Is connected to a vent pipe 108b which leads to The other output side of the first three-way valve 113 is connected to a waste liquid pipe 116 connected to a waste liquid tank (not shown). Therefore, by switching the first three-way valve 113, communication between the vent pipe 108a and the vent pipe 108b or communication between the vent pipe 108a and the waste liquid pipe 116 can be made. Filter 105 and first three-way valve 11
A vent valve 111 is provided in the middle of the vent pipe 108a connecting the vent pipe 3 and the vent pipe 108 to open and close the vent pipe 108.

Similarly, in the middle of the purge pipe 109, the second
A three-way valve, that is, a purge-side three-way valve 114 is provided.

The input side of the second three-way valve 114 is connected to the discharge side of the discharge pump 106.
One of the two output sides is connected to a purge pipe 109b connected to the cross pipe 110 connected to the supply pipe 117b. The other output side of the second three-way valve 114 is connected to a waste liquid pipe 115 connected to a waste liquid tank (not shown).

Therefore, by switching the second three-way valve 114, the purge pipe 109a and the purge pipe 109
b, or between the purge pipe 109a and the waste liquid pipe 115. Discharge pump 10
A purge valve 112 is provided in the middle of a purge pipe 109a connecting the valve 6 and the second three-way valve 114, and the inside of the purge pipe 109 is opened and closed.

As shown in FIG. 6, the supply pump 104,
Discharge pump 106, vent valve 111, first three-way valve 1
13, the purge valve 112, and the second three-way valve 114 are all electrically connected to the control unit 120, and are controlled by the control unit 120 as a whole.

Next, an operation for removing bubbles from inside the pipe by operating the resist supply device according to the present embodiment will be described.

FIG. 7 shows the bubble removal operation when the resist supply device is temporarily stopped and then restarted, such as when a new resist solution is installed in the resist supply device or when the filter module in the filter 105 is replaced. 6 is a flowchart showing a procedure.

First, necessary preparations such as filling the resist tank 101 with a new resist solution and replacing the filter module are prepared, and then the resist supply device is started (step 1).

The first three-way valve 113 is switched at the same time as the start of the resist supply device to switch the vent pipe 108a and the waste liquid pipe 1
16 (step 2).

Next, the vent valve 111 is opened to bring the inside of the vent pipe 108a into a state in which the resist solution can flow (step 3).

In this state, the supply pump 104 is operated (Step 4).

The resist liquid in the resist liquid tank 101 is pumped up by the operation of the supply pump 104, and flows into the filter 105 via the supply pipes 107a to 107d (step 5).

At this time, since the discharge pump 106 is not operating, the resist liquid flowing into the filter 105 flows into the vent pipe 108a. With the inflow of the resist solution, the supply pipe 107, the filter 105, and the vent pipe 10
8a, the air flows first in the waste liquid piping 116, and then the resist solution containing a large amount of bubbles flows, and the amount of bubbles decreases in an orderly manner. The liquid starts to flow. This situation is monitored with the naked eye or using a foam sensor (not shown) for monitoring the presence or absence of bubbles in the piping (step 6).

When the resist solution containing bubbles no longer flows to the waste liquid piping 116 side, the first three-way valve 113 is switched so that the vent piping 108a and the vent piping 108b communicate with each other (step 7).

By switching the first three-way valve 113, the resist solution flows from the vent pipe 108a to the vent pipe 108b. The resist liquid flows into the supply pipe 107b again through the cross branch pipe 110, and the resist liquid tank 101
The filter 10 is combined with the resist solution pumped up from the
Flow towards 5. At first, since air remains in the vent pipe 108b, bubbles are easily formed. Therefore, for a while, circulating from the supply pipe 107 via the filter 105 and the vent pipe 108 to return to the inside of the supply pipe 107 while continuing to monitor the bubbles in the pipe, and if bubbles are seen, The first three-way valve 116 is switched to remove bubbles from the piping. When no more bubbles are seen, the vent valve 111 is closed to end the bubble removal operation (step 8).

Next, a description will be given of a bubble removing operation in the case where the formation of bubbles in the piping is confirmed during the normal operation of discharging the resist liquid onto the wafer W.

FIG. 8 is a flow chart showing a procedure in a case where a bubble removing operation in the pipe is performed during the normal operation of the resist liquid supply apparatus.

If bubbles are found in the piping during normal operation, the purge valve 112 is first opened to prevent the resist solution from flowing toward the resist nozzle 60 (steps 11 and 12). By this operation, the discharge pump 106
Therefore, the resist liquid flows toward the purge pipe 109a. At the same time when the purge valve 112 is opened, the second
The three-way valve 114 is switched to allow communication between the purge pipe 109a and the waste liquid pipe 115 (step 13).

In this state, the discharge pump 106 is operated to discharge the resist solution containing bubbles from the purge pipe 109a to the waste liquid pipe 115 (step 14).

The state of the resist liquid flowing out to the waste liquid pipe 115 side is monitored by the naked eye or by a bubble sensor (not shown), and the timing at which the resist liquid containing bubbles is switched to the resist liquid not containing bubbles (step). 1
6).

When the resist solution containing no bubbles comes out, the second three-way valve 114 is switched again to communicate between the purge pipe 109a and the purge pipe 109b (step 17).

When the operation of removing bubbles in the pipe is completed,
The purge valve 112 is closed (step 18) to allow the resist solution to flow from the discharge pump 106 to the resist nozzle 60 side.

As described in detail above, in the resist solution supply apparatus of the present embodiment, the first three-way valve 11 is connected to the vent pipe 108.
3 and the waste liquid pipe 1 is connected through the first three-way valve 113.
Since the supply pipe 16 or the supply pipe 107 is selectively connected to the vent pipe 108, only the resist solution containing bubbles in the supply pipe 107 can be discarded by appropriately switching the first three-way valve 113. Therefore, the wasteful disposal of the resist solution can be almost eliminated.

In the resist liquid supply apparatus of the present embodiment, a second three-way valve 114 is provided in the purge pipe 109, and the waste liquid pipe 115 or the supply pipe 107 is connected to the purge pipe 109 through the second three-way valve 114. The bubble can be removed from the purge pipe 109 by appropriately switching the second three-way valve 114. Therefore, the resist solution containing bubbles can be prevented from being recirculated, so that the discharge amount of the resist solution can be accurately controlled.

The present invention is not limited to the contents described in the above embodiment.

That is, in the above embodiment, both the vent pipe and the purge pipe are communicated with the supply pipe, and the three-way valve is provided on both the vent pipe and the purge pipe to form the vent pipe,
A bubble removal operation was performed for bubbles generated in the piping from any of the purge pipes.However, a three-way valve was provided in only one of the vent pipe and the purge pipe, and the bubble removal was performed by switching the three-way valve. Operation may be performed.

Furthermore, in the above-described embodiment, the configuration is such that the confirmation is made with the naked eye whether or not the resist solution containing bubbles remains in the piping. However, whether the resist solution passing through the piping contains bubbles or not. Monitoring may be performed using a foam sensor that detects whether or not the three-way valve is switched based on the detection result of the foam sensor.

In this case, a bubble sensor is provided in the vent pipe, and when the presence of bubbles in the vent pipe is detected by the foam sensor, the vent-side three-way valve is switched to discharge the resist solution containing bubbles into the waste liquid pipe. When the bubbles are no longer detected, the vent side three-way valve is switched to control to join the supply pipe to remove the bubbles in the vent pipe.

On the other hand, when removing bubbles from the purge pipe side, a bubble sensor is provided in the middle of the purge pipe, and when the presence of bubbles in the purge pipe is detected by the bubble sensor, the purge side three-way valve is opened. Switch so that the resist solution containing bubbles is discarded to the waste liquid piping side, and when the bubbles are no longer detected, switch the three-way valve on the purge side to control to join the supply piping to remove the bubbles in the purge piping. Remove.

Also, a bubble sensor is provided in the middle of the supply pipe, and when the generation of bubbles is detected in the supply pipe, the purge valve is closed and the resist solution containing bubbles is moved to the purge pipe side. After that, as described above, the purge side three-way valve may be appropriately switched based on the detection result of the bubble sensor in the purge pipe to discard the resist solution containing bubbles into the waste liquid pipe.

Further, as a method of removing the resist solution containing bubbles in the piping, when a resist solution is newly installed, the amount of the resist solution supplied immediately after the start of the supply of the resist which is likely to contain bubbles is reduced. It is grasped in advance through experiments, etc., and after installation, it is set so that a predetermined amount of resist solution is discarded. For the predetermined amount of resist solution discharged first, it is controlled in advance so that these are unconditionally drained. A method of programming the device is also possible.

In the above embodiment, the resist coating apparatus for the wafer W has been described as an example. However, the present invention is similarly applied to other apparatuses, for example, a resist coating apparatus and a processing apparatus for a glass substrate for a liquid crystal device. It goes without saying that you can do it.

(Second Embodiment) Next, a second embodiment of the present invention will be described below. Note that, in the present embodiment, the description of the same parts as those in the first embodiment will be omitted. FIG. 9 is a diagram schematically illustrating a configuration of a processing liquid supply device according to the present embodiment. As shown in FIG. 9, in this processing liquid supply device, a resist container 130, a pump 140, a filter 150, and a discharge nozzle 160 are arranged in this order. These are connected by a supply pipe 170, and the resist solution in the resist container 130 is sent to a discharge nozzle 160 via a pump 140 and a filter 150, and is discharged from the discharge nozzle 160 to the wafer W. Further, in this processing liquid supply device, the filter 150 and the supply pipe upstream of the pump 140 in the resist moving direction are connected by a bypass pipe 180, and a waste liquid pipe 190 branches in the middle of the bypass pipe. . A three-way valve 200 is provided at a junction between the waste liquid pipe 190 and the bypass pipe 180.

The pump 140 and the three-way valve 200 are electrically connected to a control unit 210. The control unit 210 controls the pump 140 and the three-way valve 200 as a whole.

When operating the processing liquid supply apparatus, the pump 140 and the three-way valve 200 are operated at appropriate timing to remove bubbles from the inside of the pipe 170.

For example, when the apparatus is started or when the resist container 13
When the air in the pipe 170 is exchanged by exchanging the resist liquid in the pipe 0, the three-way valve 200 is first switched to the waste liquid pipe 190 side, and the pump 140 is operated to start supplying the resist. Resist container from 130 to piping, pump 14
0, it flows into the filter 150, but initially bubbles are dominant. While there are many bubbles, the resist flows from the three-way valve 200 to the waste liquid pipe 190 side and is discarded. When the bubbles disappear after a while, the three-way valve 200 is switched so that the resist flows from the filter 150 into the pipe on the upstream side of the pump 140.

As described above, by appropriately switching the three-way valve 200, the bubbles accumulated in the filter 150 can be efficiently removed.

As a modification of this embodiment, FIG.
The filter 150 is disposed between the pump 140 and the resist container 130, and a bypass pipe 180 is provided between the pump 140 and the supply pipe on the upstream side of the filter 150 as shown in FIG.
The waste liquid pipe 190 may be connected to the bypass pipe 180 via the three-way valve 200.

Further, as shown in FIG. 11, separate bypass pipes are connected to both the filter 150 and the pump 140 and connected to a supply pipe upstream of the filter 150 and the pump 140, and a three-way valve is connected to each of the bypass pipes. It is good also as a structure which connects a waste liquid pipe through the intermediary. With such a configuration, bubbles accumulated in each of the filter 150 and the pump 140 can be efficiently removed.

(Third Embodiment) FIG. 12 shows a third embodiment of the present invention.
FIG. 3 is a schematic diagram showing a processing liquid supply device according to the embodiment. In the processing liquid supply device 30, the first
The same components as those of the second embodiment are denoted by the same reference numerals.

A branch pipe 110 is provided between the filter 105 and the branch pipe 110, and a purge pipe 72 provided between the discharge pump 106 and the branch pipe 110. A return pipe 27 is provided, and a downstream portion of the return pipe 27 is
Connected to 1. The vent pipe 71 is provided with a vent-side three-way valve 35 for communicating between the filter 105 and the branch pipe 110 or the return pipe 27. A purge-side three-way valve 36 is provided for communicating with the branch pipe 110 or the return pipe 27. The vent-side three-way valve 35 is located above the filter 105,
Are disposed above the discharge pump 106, respectively, so that bubbles mixed in the filter 105 and the discharge pump 106 can be efficiently flowed to the return pipe 27 side. The return pipe 27 joins from the vent-side three-way valve 35 and the purge-side three-way valve 36 to form one pipe. However, two pipes may be used without being joined.

Between the vent-side three-way valve 35 and the branch pipe 110, the vent-side three-way valve 35 and the branch pipe 110 are communicated, or the vent-side three-way valve 35 and the waste liquid pipe 43 are communicated, or the branch pipe is connected. A vent-side switching valve 41 for communicating the 110 with the waste liquid pipe 43 is provided. Similarly on the purge side,
Between the purge-side three-way valve 36 and the branch pipe 110, the purge-side three-way valve 36 and the branch pipe 110 are connected, or the purge-side three-way valve 36 and the waste liquid pipe 44 are connected, or the branch pipe 1 is connected.
A purge-side switching valve 42 for communicating the waste liquid pipe 44 with the pipe 10 is provided. Further, between the filter 105 and the vent-side three-way valve 35, a vent-side sensor 33 is provided as means for detecting the presence of bubbles passing from the supply pipe 107 to the vent pipe upstream portion 71a. A purge sensor 34 is provided as means for detecting the presence of bubbles passing from the supply pipe 107 to the purge pipe upstream section 72a.

On the upstream side of the vent side sensor 33 and the upstream side of the purge side sensor 34, in order to detect bubbles efficiently by the sensors 33 and 34, the pipe is vibrated minutely so that a large number of minute bubbles are generated. Vent-side vibrator 31, purge-side vibrator 31, and purge-side vibrator 3 for assembling
2 are provided.

A supply pipe valve 57 for stopping the supply of the resist toward the resist nozzle 60 is provided in the supply pipe 107f.

Further, the branch pipe 110 is
A nitrogen gas cylinder 56 is disposed via a valve 58 as processing liquid removing means for removing the processing liquid in the supply pipe 107, the vent pipe 71, and the purge pipe 72.

Each of the three-way valves 35 and 36 and each of the switching valves 4
1 and 42, sensors 33 and 34, vibrators 31 and 32, and a drain valve 38 provided in the waste pipe of the liquid end sensor 103 and a supply pipe valve 57.
Is provided with a control unit 45 that controls the opening and closing of the system.

Next, a method for removing bubbles in the pipe 107 when the operating processing liquid supply device 30 is temporarily stopped and then restarted (during normal operation) will be described with reference to the flowchart shown in FIG.

First, when the processing liquid supply device 30 is operating, the vent-side switching valve 41 is always in a state of communicating the vent-side three-way valve 35 and the branch pipe 110 in accordance with a command from the control unit 45. Since the length of the pipe from the vent side three-way valve 35 to the vent side sensor 33 and the amount of processing liquid flowing through the vent pipe 71 per unit time are set values, the bubbles detected by the vent side sensor 33 Valve 3
The time T1 until reaching 5 is set in advance. Note that the vent-side vibrator 31 is vibrated minutely in order to collect bubbles that are present in the pipe as apart as possible.

When the first bubble of a certain amount of foam is detected by the vent-side sensor 33 (S2), the supply pipe valve 57 is closed according to a command from the control unit 45, and after a lapse of the predetermined time T1, the vent valve is vented. Side three-way valve 35 is return pipe 2
7 (S3). And the vent side sensor 33
The control unit 45 stores the time ΔT from the start of detecting the first bubble to the detection of the last bubble of a large number of bubbles to some extent. And after detecting the last bubble (S
4) A predetermined time, for example, a time T2 is set in advance, and the supply pipe valve 57 is opened after the elapse of the time T2 (S
5). Then, after a lapse of time ΔT + T2 since the vent-side three-way valve 35 is connected to the return pipe 27, the vent-side three-way valve 35 is connected to the branch pipe 110 (S6). As a result, the processing liquid containing bubbles is all returned to the resist tank 101 by the return pipe 27 without being discarded, while the processing liquid containing no bubbles is entirely discharged from the vent pipe 71.
Is returned to the supply pipe 107 again via the branch pipe 110. As a result, useless disposal of the processing liquid can be prevented. Note that these series of operations are fully automatically controlled by the control unit 45.

The bubble removal method described above uses the vent pipe 7
Since the same operation is performed on the first side and the purge pipe 72 side, the description on the purge pipe 72 side is omitted.

Next, after the operating processing liquid supply device 30 is stopped (after the coating process on the wafer is terminated and the processing liquid supply device 30 is stopped), the inside of the pipe is cleaned with a thinner. Will be described. The vent pipe 71
Since the side and the purge pipe 72 side have the same action, only the vent pipe 71 side will be described.

First, the resist tank 101 and the supply pipe 1
07 and disconnect the liquid end sensor 103
Is opened. Then, after the branch pipe 110 side and the waste liquid pipe 43 (44) are communicated by the vent side switching valve 41 (purge side switching valve 42), the valve 58 of the nitrogen gas cylinder 56 is opened, and the supply pipe 107a The processing liquid remaining in the 107b, the branch pipe 110, and the vent pipe 71b (purge pipe 72b) is discarded from the waste liquid pipes 39, 43 (44).

Next, the drain valve 38 of the liquid end sensor 103 is closed, and the vent-side three-way valve 35 (purge-side three-way valve 36) and the waste liquid pipe 43 are connected by the vent-side switching valve 41 (purge-side switching valve 42). Then, the vent-side three-way valve 35 (purge-side three-way valve 36) is switched to the branch pipe 110 side to operate the supply pump 104 and the discharge pump 106. At this time, the nitrogen gas remains jetted. Thereby, the inside of the supply pipe 107, the vent pipe 71a
The processing liquid remaining in the (purge pipe 72a) is
Discard from (44).

Thereafter, the tank (not shown) containing the thinner is connected to the supply pipe 107, the liquid end sensor 103 and the drain valve 38 are closed, and the vent side switching valve 41 (purge side switching valve 42) is used. The branch pipe 110 is communicated with the waste liquid pipe 43 (44), and the vent-side three-way valve 35 (purge-side three-way valve 36) is switched to the return pipe 27 to operate the pumps 104 and 106 and to operate the nitrogen gas cylinder 56. While the thinner flows into the supply pipe 107, the branch pipe 110, and the vent pipe 71b (purge pipe 72b) by the force of the gas, the thinner is discharged into the waste liquid pipe 43 (4).
4) Discard and dry.

Next, the vent-side switching valve 41 connects the vent-side three-way valve 35 to the waste liquid pipe 43, and the vent-side three-way valve 35 is connected to the branch pipe 110 to connect the supply pipe 10.
The thinner is discarded from the waste liquid pipe 43 (44) and dried while flowing the thinner into the vent pipe 71a.

Finally, the vent-side three-way valve 35 (purge-side three-way valve 36) is connected to the return pipe 27, and the thinner in the supply pipe 107 and the return pipe 27 is returned to the thinner tank and dried. These series of operations are fully automatically controlled by the control unit 45.

As a result, all the pipes can be fully automatically washed with thinner and dried with nitrogen gas.
The used processing solution is completely removed. Therefore, when a new resist described later is installed, there is no possibility that the used processing liquid and the new processing liquid are confused.

Next, a case where a new resist (processing liquid) is filled into the pipes of the processing liquid supply device 30 after thinning the inside of each pipe will be described. In this case, as in the case of thinner cleaning, the processing liquid supply device 30 is not operated (the wafer is not coated). Since the vent pipe 71 side and the purge pipe 72 side have the same action, only the vent pipe 71 side will be described.

First, supply a new resist tank to the supply pipe 1
07, the drain valve 38 of the liquid end sensor 103 is closed, and the supply pipe valve 57 is opened.
7 is filled with a processing solution. The processing liquid is filled into each of the vent pipe 71, the purge pipe 72, and the return pipe 27 by appropriately switching the vent-side three-way valve 35 (purge-side three-way valve 36) and the vent-side switching valve 41 (purge-side switching valve 42). I do.

Since the amount of bubbles in each pipe after the new resist is filled is larger than the amount of bubbles during the normal operation described above, the bubbles are manually removed.

[0130] When defoaming, each pump 104,
The supply pipe valve 57 is closed with the operation of the valve 106, and the vent-side switching valve 41 (purge-side switching valve 42) is connected to the vent-side three-way valve 35 (purge-side three-way valve 36) and branch pipe 110.
While the processing liquid is circulated again from the supply pipes 107b to 107e to the supply pipes 107b to 107e via the vent pipe 71 (purge pipe 72) and the branch pipe 110, and the vent side sensor 33 (purge The presence of bubbles in the processing liquid is confirmed by the side sensor 34). At this time, use of the vent-side vibrator 31 (purge-side vibrator 32) is optional. When bubbles are detected, the vent-side switching valve 41 (purge-side switching valve 42) is connected to the waste liquid pipe 43 (4).
Switch to 4) and discard the processing solution containing the foam. Regarding the return pipe 27, even after the device 30 is operated, it is not necessary to remove bubbles because bubbles are mixed.
That is, the return pipe 27 is a pipe for returning only the processing liquid containing bubbles to the resist tank 101 as described above.

Thereafter, the supply pipe valve 57 is opened to start the processing liquid supply device 30, and the coating process on the wafer is started. The defoaming operation is performed in the same sequence as in the normal operation described above.

In the third embodiment described above, the bubble removal may be performed manually by a manual operation during the normal operation and when the inside of the pipe is cleaned with the thinner.

According to the present invention, while a branch pipe is provided in the pipe between the container and the pump, a three-way valve is provided in a bypass pipe connecting the branch pipe and the pump, and the three-way valve is switched. By doing so, the structure is configured to remove bubbles from the piping, so that the processing liquid is not wasted.

According to the present invention, a circulation path returning from the supply pipe to the supply pipe via the filter and the filter to the supply pipe via the vent pipe is formed. Since the bubble removal operation in the pipe is performed by switching the three-way valve, the processing liquid containing no bubbles is not discarded, and the processing liquid can be prevented from being wasted.

Further, according to the present invention, a circulation path returning from the supply pipe to the supply pipe via the discharge pump and the discharge pipe via the purge pipe is formed, and a purge-side three-way valve is provided in the purge pipe. Since the bubble removal operation in the pipe is performed by switching the three-way valve on the purge side, the processing liquid containing no bubbles is not discarded, and the processing liquid can be prevented from being wasted.

Further, according to the present invention, a circulation path returning from the supply pipe to the supply pipe via the filter and the filter via the vent pipe is formed. A circulation path returning from the pipe to the discharge pump via the discharge pump to the supply pipe via the purge pipe is formed, and a purge-side three-way valve is provided in the purge pipe, and the vent-side three-way valve and the purge-side three-way valve are switched. As a result, the bubble removal operation in the piping was performed,
The defoaming operation can be performed from either the vent side or the purge side. Therefore, the bubble removing operation can be appropriately performed not only at the time of installing the processing liquid or replacing the filter, but also at the time of normal operation.

Further, according to the present invention, during the normal operation, the processing liquid containing bubbles in the supply pipe is all returned to the processing liquid supply source by the return pipe without being discarded, while the bubbles are mixed. All the processing liquid not having been returned from the purge pipe to the supply pipe via the branch pipe. As a result, useless disposal of the processing liquid can be prevented.

The embodiments described above are intended to clarify the technical contents of the present invention.
The present invention is not limited to such specific examples and is not construed in a narrow sense. Various modifications are possible within a range based on the same technical idea as the technical idea of the present invention.

[0139]

According to the present invention, while a branch pipe is provided in a pipe between the vessel and the pump, a three-way valve is provided in a bypass pipe connecting the branch pipe and the pump. Is switched to remove bubbles in the piping, thereby preventing wasteful disposal of the processing liquid.

[Brief description of the drawings]

FIG. 1 is a plan view of a coating and developing system including a resist coating unit according to an embodiment of the present invention.

FIG. 2 is a front view of a coating and developing system including a resist coating unit according to an embodiment of the present invention.

FIG. 3 is a rear view of the coating and developing system including the resist coating unit according to the embodiment of the present invention.

FIG. 4 is a schematic sectional view of a resist coating unit according to the embodiment.

FIG. 5 is a schematic plan view of a resist coating unit according to the embodiment.

FIG. 6 is a schematic diagram of a resist supply system of the resist coating unit according to the present embodiment.

FIG. 7 is a flowchart of a bubble removal operation when the resist supply device according to the present embodiment is temporarily stopped and then restarted.

FIG. 8 is a flowchart of a bubble removal operation performed during a normal operation of the resist liquid supply device according to the present embodiment.

FIG. 9 is a diagram schematically showing a configuration of a resist liquid supply device according to a second embodiment of the present invention.

FIG. 10 is a schematic diagram of a resist liquid supply device according to a modification of the second embodiment of the present invention.

FIG. 11 is a schematic diagram of a resist liquid supply device according to a modification of the second embodiment of the present invention.

FIG. 12 is a schematic diagram showing a processing liquid supply device according to a third embodiment of the present invention.

FIG. 13 is a flowchart of a bubble removal operation when the resist supply device according to the third embodiment of the present invention is once stopped and then restarted.

FIG. 14 is a schematic diagram of a resist supply system of a conventional resist coating unit.

[Brief description of reference numerals]

 W: wafer (substrate to be processed); 60: resist nozzle (discharge means); 101: resist liquid tank (container); 107: supply pipe; 104: supply pump (pump); 106: discharge pump (pump), 120: control unit (control means), 110: cross branch pipe (branch pipe), 108: vent pipe (bypass pipe), 109: purge pipe (Bypass piping), 113... First three-way valve (three-way valve), 114... Second three-way valve (three-way valve), 105.

Claims (17)

[Claims] A discharge unit configured to discharge a processing liquid to a substrate to be processed; a processing liquid supply source that stores the processing liquid; a supply pipe connecting the discharge unit and the processing liquid supply source; An arranged pump, means for controlling the operation of the pump, a branch pipe arranged in a pipe between the processing liquid supply source and the pump, and a bypass pipe connecting the branch pipe and the pump. And a three-way valve disposed in the bypass pipe and communicating the pump with the branch pipe or the waste liquid pipe; and a unit for switching the three-way valve. 2. A discharge means for discharging a processing liquid to a substrate to be processed, a processing liquid supply source for containing the processing liquid, a supply pipe connecting the discharge means and the processing liquid supply source, and A discharge pump disposed, a supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source, a unit for controlling operations of the discharge pump and the supply pump, and the discharge pump A filter disposed on a supply pipe between the supply pump, a branch pipe disposed on a supply pipe between the supply pump and the processing liquid supply source, and a filter disposed between the filter and the branch pipe. A vent-side three-way valve disposed in the vent pipe and communicating the filter with the branch pipe or the waste liquid pipe; and means for switching the vent-side three-way valve. Processing liquid supply device. A discharge unit configured to discharge the processing liquid to the substrate to be processed; a processing liquid supply source storing the processing liquid; a supply pipe connecting the discharge unit and the processing liquid supply source; A discharge pump disposed, a supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source, a unit for controlling operations of the discharge pump and the supply pump, and the discharge pump A filter disposed in a supply pipe between the supply pump, a branch pipe disposed in a supply pipe between the supply pump and the processing liquid supply source, and a discharge pipe and the branch pipe. A purge pipe connecting between the two, a purge-side three-way valve disposed in the purge pipe and communicating the discharge pump with the branch pipe or the waste liquid pipe, and means for switching the purge-side three-way valve. Processing liquid supply equipment . 4. A discharge unit for discharging a processing liquid onto a substrate to be processed, a processing liquid supply source for containing the processing liquid, a supply pipe connecting the discharge unit and the processing liquid supply source, and A discharge pump disposed, a supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source, a unit for controlling operations of the discharge pump and the supply pump, and the discharge pump A filter disposed on a supply pipe between the supply pump, a branch pipe disposed on a supply pipe between the supply pump and the processing liquid supply source, and a filter disposed between the filter and the branch pipe. A first three-way valve disposed in the vent pipe for communicating the filter with the branch pipe or the waste pipe; a means for switching the first three-way valve; and the discharge pump. And between the branch pipe A purge pipe, a second three-way valve disposed in the purge pipe and communicating the discharge pump with the branch pipe or the waste liquid pipe, and means for switching the second three-way valve. Processing liquid supply device. 5. A discharge means for discharging a processing liquid onto a substrate to be processed, a processing liquid supply source for storing the processing liquid, a supply pipe connecting the discharging means and the processing liquid supply source, and a processing liquid supply. A pump that supplies a processing liquid from a source to a discharge unit, a filter inserted into a supply pipe between the pump and the discharge unit, a bypass pipe that connects the filter and a supply pipe on an upstream side of the pump, A processing liquid supply device, comprising: a waste liquid pipe branched from the bypass pipe; and a switching valve for switching a processing liquid in the bypass pipe between the pump upstream side and the waste liquid pipe. 6. The processing liquid supply apparatus according to claim 5, further comprising a control unit for controlling operation timings of the pump and the switching valve. 7. A discharge means for discharging a processing liquid onto a substrate to be processed, a processing liquid supply source for storing the processing liquid, a supply pipe connecting the discharging means and the processing liquid supply source, and a processing liquid supply. A pump for supplying a processing liquid from a source to a discharge unit, a filter interposed in a supply pipe between the processing liquid supply source and the pump, and a bypass pipe connecting the pump and a supply pipe on an upstream side of the filter. A waste liquid pipe branched from the bypass pipe; and a switching valve for switching a processing liquid in the bypass pipe between the upstream side of the filter and the waste liquid pipe. 8. The processing liquid supply device according to claim 7, further comprising a control unit for controlling the operation timing of the pump and the switching valve. 9. A discharge means for discharging a processing liquid onto a substrate to be processed, a processing liquid supply source for containing the processing liquid, a supply pipe connecting the discharging means and the processing liquid supply source, and a processing liquid supply. A pump for supplying a processing liquid from a source to a discharge unit, a filter interposed in a supply pipe between the processing liquid supply source and the pump, a first connecting the filter with a supply pipe on an upstream side of the pump. A first waste pipe that branches from the first bypass pipe, and a first waste pipe that switches processing liquid in the first bypass pipe between the pump upstream side and the first waste pipe. A switching valve; a second bypass pipe connecting the pump and a supply pipe upstream of the filter; a second waste pipe branching from the second bypass pipe; and a process in the second bypass pipe. The liquid upstream of the filter Process liquid supply anda second switching valve for switching on and the second waste fluid tube. 10. The processing liquid supply apparatus according to claim 9, further comprising a control unit that controls operation timings of the pump, the first switching valve, and the second switching valve. 11. A discharge unit that discharges a processing liquid onto a substrate to be processed, a processing liquid supply source that stores the processing liquid, a supply pipe that connects the discharge unit and the processing liquid supply source, An arranged pump, means for controlling the operation of the pump, a branch pipe arranged in a supply pipe between the processing liquid supply source and the pump, and a bypass connecting the pump and the branch pipe. A pipe; a return pipe branched from the bypass pipe to connect to the processing liquid supply source; and a return pipe disposed in the bypass pipe to communicate the pump with the bypass pipe or the return pipe. First
A three-way valve for switching the first three-way valve; and a bypass pipe or a waste liquid pipe disposed between the first three-way valve and the branch pipe, with respect to the first three-way valve. And a means for switching the second three-way valve. 12. A discharge means for discharging a processing liquid to a substrate to be processed, a processing liquid supply source for containing the processing liquid, a supply pipe connecting the discharge means and the processing liquid supply source, and A discharge pump disposed, a supply pump disposed in a supply pipe between the discharge pump and the processing liquid supply source, a unit for controlling operations of the discharge pump and the supply pump, and the discharge pump A filter disposed on a supply pipe between the supply pump, a branch pipe disposed on a supply pipe between the supply pump and the processing liquid supply source, and a filter disposed between the filter and the branch pipe. A purge pipe connecting between the discharge pump and the branch pipe; a return pipe branching from the vent pipe and the purge pipe to connect to the processing liquid supply source; and the vent. Distribute to piping A vent-side three-way valve for communicating between the filter and the branch pipe or the return pipe; a means for switching the vent-side three-way valve; A purge-side three-way valve that communicates with the branch pipe or the return pipe; a unit that switches the purge-side three-way valve; and a vent pipe, which is disposed in the vent pipe and communicates the vent-side three-way valve with the branch pipe, A vent-side switching valve for communicating the vent-side three-way valve with the waste liquid pipe, or a communication between the branch pipe and the waste liquid pipe, a unit for switching the vent-side switching valve, and a purge pipe. A purge-side switching valve that communicates the purge-side three-way valve with the branch pipe, or communicates the purge-side three-way valve with the waste liquid pipe, or communicates the branch pipe with the waste liquid pipe, Means for switching the purge side three-way valve; and processing liquid removing means disposed on the branch pipe for removing a processing liquid in the branch pipe, the supply pipe, the vent pipe, and the purge pipe. I do. 13. The processing liquid supply device according to claim 11, further comprising a unit disposed between the filter and the three-way valve on the vent side to detect bubbles on the vent side. A processing liquid supply device characterized by the above-mentioned. 14. The processing liquid supply device according to claim 11, further comprising a means disposed between the discharge pump and the purge-side three-way valve for detecting bubbles on the purge side. A processing liquid supply device characterized by the above-mentioned. 15. The processing liquid supply device according to claim 14, wherein a bubble existing in the vent pipe and the purge pipe is detected by the vent-side foam detecting means and the purge-side foam detecting means. And a control means for switching the vent-side three-way valve, the purge-side three-way valve, the vent-side switching valve, and the purge-side switching valve at a predetermined timing. 16. The processing liquid supply apparatus according to claim 14, further comprising a vent-side vibrator disposed between said filter and said vent-side foam detecting means. Liquid supply device. 17. The processing liquid supply device according to claim 14, further comprising a purge-side vibrator disposed between said discharge pump and said purge-side bubble detecting means. Processing liquid supply device.