JP3340394B2 - Chemical supply system, substrate processing system and substrate processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical solution supply system, a substrate processing system, and a substrate processing method for supplying a chemical solution such as a resist solution to each processing unit in a manufacturing process of, for example, a semiconductor device or an LCD substrate. />

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, a photoresist liquid is applied to a semiconductor wafer as a substrate to be processed, a circuit pattern is reduced, a photoresist film is exposed, and a circuit is developed by developing the photoresist film. A so-called photolithography technique for forming a resist pattern corresponding to the pattern is employed.

In such a processing step, after cleaning a semiconductor wafer with a cleaning unit, the semiconductor wafer is subjected to a hydrophobic treatment in an adhesion processing unit, cooled in a cooling processing unit, and then cooled in a resist coating unit. A photoresist film, that is, a photosensitive film is applied and formed. Then, after the photoresist film is heated in a heat treatment unit and subjected to a baking treatment, a predetermined pattern is exposed in an exposure unit, and the exposed semiconductor wafer is coated with a developing solution in a developing unit. After the formation of the resist pattern, a baking treatment is performed to enhance the thermal denaturation for polymerization and the adhesion between the semiconductor wafer and the resist pattern.

In such a coating and developing system, for example, when supplying a resist solution to a resist coating unit, the resist solution is sucked by a pump from a resist solution storage tank via a liquid end tank, It is supplied to the resist coating unit.

[0005]

However, a gas such as N ₂ gas is mixed in the resist solution for various reasons. When the resist solution reaches the coating unit and the pressure drops, the N ₂ gas Bubbling in the resist solution, this N
_The coating unevenness may occur due to bubbles of the _two gases.

[0006] Particularly, when the resist solution is pumped into the resist coating unit is sucked by the pump, as described above, the N ₂ gas or the like is mixed in the resist-liquid,
When the resist solution passes through the pump, bubbles of the N ₂ gas may be further amplified, and application unevenness may be promoted.

The present invention has been made in view of the above circumstances, and has been made in consideration of the above circumstances, and when a chemical solution such as a resist solution is suctioned by a pump and pressure-fed to a processing unit, a chemical solution supply capable of removing bubbles in the chemical solution as much as possible. It is an object to provide a system, a substrate processing system, and a substrate processing method .

[0008]

According to a first aspect of the present invention, there is provided a chemical solution supply system for pressure-feeding and supplying a chemical solution from a chemical tank to a processing unit. A buffer tank for storing a chemical supplied from the chemical tank via a chemical liquid flow path, and a buffer disposed downstream of the buffer tank, which sucks the chemical from the buffer tank and discharges the chemical to the processing unit. And a pump for reducing the pressure in the buffer tank,
A degassing means for discharging gas mixed in the chemical solution, and driving the pump for a predetermined time to discharge a predetermined amount of the chemical solution from the buffer tank to the processing unit, and a predetermined amount of the chemical solution in the buffer tank. And a control means for depressurizing the inside of the buffer tank by the degassing means to degas the gas mixed in the chemical liquid when the chemical liquid is stored.

According to a second aspect of the present invention, there is provided a substrate processing system in which each processing unit processes a substrate by using a chemical supplied from a chemical supply system for pumping a chemical from a chemical tank. The chemical liquid supply system is provided with a buffer tank for storing the chemical liquid supplied from the chemical liquid tank via the chemical liquid flow path, and is disposed downstream of the buffer tank, and sucks the chemical liquid from the buffer tank to form the processing unit. A pump for discharging a chemical solution to the buffer tank; a degassing means for reducing the pressure in the buffer tank to discharge gas mixed in the chemical solution; The chemical solution is discharged from the tank to the processing unit, and when a predetermined amount of the chemical solution is stored in the buffer tank, the degassing means removes the buffer. The substrate processing system characterized by comprising a control means for the inside Fatanku by vacuum to degas the liquid medicine in the mixed gas is provided.

According to the present invention, the pump for discharging the chemical to the processing unit is provided with a gas (for example, N ₂ ) mixed in the chemical.
Gas) is provided on the downstream side of the buffer tank provided with a degassing means for degassing the gas, so that the gas mixed in the chemical solution (for example,
N ₂ gas) has already been sufficiently degassed, and then when the chemical solution is sucked into the pump, the gas mixed in the chemical solution (for example,
Bubbles amplification of N ₂ gas) hardly occurs. Therefore, it is possible to effectively prevent adverse effects caused by the presence of bubbles in the chemical solution, for example, coating unevenness caused by bubbles in the resist solution in, for example, a coating processing unit.

In this case, the apparatus further comprises a chemical liquid passage opening / closing valve interposed in the chemical liquid flow passage, wherein the control means causes the chemical liquid tank to be discharged from the chemical liquid tank every time discharge of a predetermined amount of the chemical liquid is completed. By switching the chemical liquid flow path opening / closing valve to open so that the chemical liquid is introduced into the buffer tank and supplemented, a constant amount of the chemical liquid can be always held in the buffer tank.

The degassing means includes a pipe connected to the buffer tank via a branch pipe, a pipe opening / closing valve interposed in the pipe, and a suction for sucking the inside of the buffer tank through the pipe. The control means, when a predetermined amount of the drug solution is stored in the buffer tank, the pipe opening and closing valve is opened to cause the suction means to suck the inside of the buffer tank, By discharging the mixed gas to the pipe via the branch pipe, the chemical solution can be easily degassed by switching the pipe open / close valve.

[0013] Further, by forming the suction means so that gas flows through the pipe and exerts a suction force on the branch pipe, a gas (for example, N ₂ gas) mixed in a chemical solution can be easily obtained.
Can be discharged.

Furthermore, a special supply system is used by introducing the chemical liquid into the buffer tank by opening the chemical liquid flow path opening / closing valve and reducing the pressure in the buffer tank by the deaeration means. A chemical solution can be supplied to the buffer tank without any need.

Further, the apparatus further comprises a liquid level detector for detecting a liquid level of the chemical in the buffer tank and inputting a detection signal to the control means, so that a predetermined amount of the chemical can be discharged to the processing unit. Every time it is performed, the amount of decrease can be easily grasped, and the buffer tank can be replenished with a chemical solution corresponding to the discharged amount.

Further, after the control means completes the discharge of the predetermined amount of the chemical by the discharge means, the chemical liquid passage opening / closing valve is maintained until the liquid level detector detects the high liquid level of the chemical. Is opened, and a chemical solution is introduced and compensated, whereby a required amount of the chemical solution can be always held in the buffer tank.

Further, when the chemical in the buffer tank overflows beyond a predetermined high liquid level, the apparatus further comprises an overflow detector for detecting the overflow, and the control means comprises: Since the on-off valve is closed and the pump is driven to discharge the overflowing chemical solution to the dummy dispenser of the processing unit, even if a problem occurs in which a buffer solution is supplied with a chemical solution in an amount larger than a necessary amount, As a result, the excess chemical solution is discharged to the dummy dispenser, so that no adverse effect on the processing occurs.

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIGS. 1 to 3 show a semiconductor wafer (hereinafter, referred to as “wafer”) used in the embodiment of the present invention.
FIG. 1 is a plan view, FIG. 2 is a front view, and FIG. 3 is a rear view.

In the coating and developing system 1, as shown in FIG. 1, a plurality of wafers W as substrates to be processed are loaded into the system in a wafer cassette CR, for example, in units of 25 wafers, or unloaded from the system. A cassette station 10 for loading and unloading wafers W into and out of the wafer cassette CR, and various single-wafer processing units for performing predetermined processing on the wafers W one by one in a coating and developing process. A configuration in which a processing station 11 arranged in multiple stages and an interface unit 12 for transferring a wafer W between an exposure apparatus (not shown) provided adjacent to the processing station 11 are integrally connected. have.

In the cassette station 10, FIG.
As shown in FIG.
At a position 0a, a plurality of wafer cassettes CR, for example, up to four,
A wafer carrier mounted in a line in the X direction toward one side and movable in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction: vertical direction) of the wafers stored in the wafer cassette CR. Reference numeral 21 selectively accesses each wafer cassette CR.

The wafer transfer body 21 is rotatable in the θ direction. As will be described later, an alignment unit (ALIM) and an extension unit (ALIM) belonging to a third processing unit group G3 on the processing station 11 side are provided. EXT).

As shown in FIG. 1, the processing station 11 is provided with a vertical transfer type main wafer transfer mechanism 22 equipped with a wafer transfer device, and all the processing units are surrounded by one or more sets. Are arranged in multiple stages.

As shown in FIG. 3, the main wafer transfer mechanism 22 is provided with a wafer transfer device 46 inside a cylindrical support 49 so as to be vertically movable (Z direction). The cylindrical support 49 is connected to a rotation shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 46 about the rotation shaft by the rotation driving force of the motor, whereby the wafer transfer is performed. The device 46 is rotatable in the θ direction. Note that the cylindrical support 49 may be configured to be connected to another rotating shaft (not shown) rotated by the motor.

The wafer transfer device 46 includes a plurality of holding members 48 movable in the front-rear direction of the transfer base 47, and the transfer of the wafer W between the processing units is realized by these holding members 48. .

In this example, as shown in FIG.
One of the processing unit groups G1, G2, G3, G4, and G5 can be arranged. The first and second processing unit groups G1 and G2 are arranged on the system front (front side in FIG. 1) side. The processing unit group G3 is disposed adjacent to the cassette station 10, and the fourth processing unit group G4 is disposed adjacent to the interface unit 12.
Further, the fifth processing unit group G5 can be arranged on the back side.

As shown in FIG. 2, the first processing unit group G1 includes two spinner-type processing units for performing a predetermined processing by placing a wafer W on a spin chuck in a cup CP;
For example, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages from the bottom. Also in the second processing unit group G2, two spinner type processing units, for example, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages from the bottom. These resist coating units (COTs) are preferably arranged in such a lower stage because drainage of the resist solution is troublesome both mechanically and in terms of maintenance.
However, it is of course possible to dispose it on the upper stage as needed.

As shown in FIG. 3, the third processing unit group G3 is an oven-type processing unit for performing a predetermined process by mounting the wafer W on the mounting table SP, for example, a cooling unit (COL) for performing a cooling process, An adhesion unit (AD) for performing a so-called hydrophobizing process for improving the fixability of the resist, an alignment unit (ALIM) for positioning, an extension unit (EXT),
A pre-baking unit (PREBAKE) for performing a heating process before the exposure process and a post-baking unit (POBAKE) for performing a heating process after the exposure process are stacked in, for example, eight stages from the bottom. The fourth processing unit group G4 is also an oven-type processing unit, for example, a cooling unit (COL), an extension cooling unit (EXTCOL), an extension unit (EXT), a cooling unit (COL), and a prebaking unit (PREBAKE). And the post-baking unit (POBAKE) is, for example, 8
It is piled up on the steps.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE) and the adhesion having a high processing temperature are provided. By arranging the units (AD) in the upper stage, thermal mutual interference between the units can be reduced. Of course, other multi-stage arrangements may be used.

As shown in FIG. 1, the interface section 12 has the same size in the depth direction (X direction) as the processing station 11, but is set smaller in the width direction. A portable pickup cassette CR and a stationary buffer cassette BR are provided in front of the interface section 12.
On the other hand, a peripheral exposing device 23 is arranged on the back side, and a wafer carrier 24 is provided on the central part. The wafer carrier 24 moves in the X and Z directions to move the cassettes CR and BR and the peripheral exposure device 2.
3 is accessed. The wafer transfer body 24 is configured to be rotatable also in the θ direction, and includes an extension unit (EXT) belonging to a multi-stage unit of the fourth processing unit group G4 on the processing station 11 side, and further, The wafer delivery table (not shown) on the adjacent exposure apparatus side can also be accessed.

Further, in the coating and developing system 1, as shown in FIG. 1, a fifth processing unit group G5 indicated by a broken line can be arranged on the back side of the main wafer transfer mechanism 22 as described above. However, the fifth processing unit group G5 is configured to be able to shift to the side as viewed from the main wafer transfer mechanism 22 along the guide rail 25. Therefore, the fifth processing unit group G5
Is provided as shown in the figure, a space is secured by sliding along the guide rail 25, so that maintenance work can be easily performed from behind the main wafer transfer mechanism 22. . The fifth processing unit group G5, like the fourth or third processing unit group G3, G4, is configured by stacking open units in multiple stages. In addition, the fifth processing unit group G5 is not limited to the linear slide shift along the guide rail 25 as described above. Even if it is configured to be rotationally shifted to, it is easy to secure a space for maintenance work on the main wafer transfer mechanism 22.

Next, a resist coating unit (CO) mounted in the coating and developing system according to the present embodiment.
T) will be described. 4 and 5 are a schematic cross-sectional view and a schematic plan view showing the entire configuration of the resist coating unit (COT).

This resist coating unit (COT)
An annular cup CP is disposed at the center of
A spin chuck 51 is disposed inside P.
The spin chuck 51 is rotated by a drive motor 52 while holding the wafer W by vacuum suction, and the drive motor 52 is fixed to a flange 53 that is raised and lowered by an air cylinder 54.

A resist liquid discharge nozzle 55 for supplying a resist liquid to the surface of the wafer W is provided with a resist supply pipe 56.
To a resist supply unit (not shown).
The resist liquid discharge nozzle 54 is detachably attached to the tip of a resist liquid discharge nozzle scan arm 57 via a nozzle holder 58. The resist solution discharge nozzle scan arm 57 is attached to the upper end of a vertical support member 60 that can move horizontally on a guide rail 59 laid in one direction (Y direction).
The directional drive mechanism is configured to move in the Y direction integrally with the vertical support member 60.

The resist liquid discharge nozzle scan arm 57 is also moved in the X direction perpendicular to the Y direction, since the resist liquid discharge nozzle 55 is selectively attached to the resist liquid discharge nozzle standby section 61. I have.

Further, the wafer W is
Prior to the supply of the resist solution to the surface, a thinner nozzle 62 for supplying a liquid agent for wetting the surface of the wafer W, for example, a thinner, is attached.

Further, on the guide rail 59, a vertical support member 64 which supports the rinse nozzle scan arm 63 and is movable in the Y direction is also provided. A rinsing nozzle 65 for side rinsing is attached to the tip of the rinsing nozzle scan arm 63.

In the thus configured resist coating unit (COT), first, the spin chuck 5
When the wafer W is rotated by 1 and the thinner nozzle 62 reaches the center of the wafer W, the thinner is supplied to the surface of the rotating wafer W, and the thinner is evenly spread from the center of the wafer W to the entire periphery thereof by centrifugal force. Subsequently, the resist liquid discharge nozzle 55 reaches the center of the spin chuck 51 (the center of the wafer W), and the resist liquid is dropped on the center of the rotating wafer W and is applied to the wafer W. From the entire area around it. Thereby, a resist film is uniformly formed on the wafer W.

Next, a resist liquid supply system for supplying a resist liquid to the coating unit (COT) will be described with reference to FIG. FIG. 6 is a block diagram of the resist liquid supply system according to the embodiment of the present invention.

A resist liquid flow path 72 is provided from the resist liquid tank 71 to the coating processing unit (COT). In the resist liquid flow path 72, a liquid end tank 73 is provided downstream of the resist liquid tank 71, and an open / close control valve 74 for opening and closing the resist liquid flow path 72 is provided downstream of the liquid end tank 73. On the downstream side, a buffer tank 75 for temporarily storing and discharging the resist liquid is provided.

Downstream of the buffer tank 75, a pump 76 for sucking and pumping the resist solution is provided. Downstream of the pump 76, a filter 77 and an opening / closing control valve 7 are provided.
8 are provided. As the pump 76 for pumping the resist solution, a piston type syringe pump, bellows pump, diaphragm pump, or the like can be used.

An upper branch pipe 79 is provided above the buffer tank 75.
9 is connected to the pipe 80. An open / close control valve 81 is interposed in the pipe 80.

Air is passed through the pipe 80 by a drive system (not shown). When the on-off control valve 81 is open, the air flowing through the pipe 80 causes the inside of the branch pipe 79 to have a negative pressure. , Suction force acts. Therefore, the resist solution in the buffer tank 75 can be degassed by the suction force.

On the other hand, the above-mentioned on-off control valves 74, 78, 8
1 and a control unit 90 for sending a control signal to the pump 76 to control the switching control valve and the pump. Note that the control unit 90 may also be used as a controller for controlling the coating processing unit (COT).

On the outside of the side wall of the buffer tank 75, a high liquid level detecting sensor 91 for detecting a high liquid level of the resist liquid in the buffer tank 75, and a low liquid level detecting sensor 91 for detecting a low liquid level of the resist liquid. A liquid level detection sensor 92 is provided. The detection signals of the liquid level detection sensors 91 and 92 are input to the control unit 90. Further, in addition to the liquid level detection sensors 91 and 92, when the resist liquid in the buffer tank 75 overflows beyond a predetermined high liquid level,
An overflow sensor 93 for detecting this is provided.

In the resist liquid supply system configured as described above, when filling the buffer tank 75 with the resist liquid, a control signal is sent from the control unit 90 to the opening / closing control valves 74 and 81 of the resist liquid flow path 72. Then, the opening and closing control valves 74 and 81 are opened, and the branch pipe 79 is opened.
The resist solution tank 7 by the suction force exerted through the
From 1 the buffer liquid is filled in the buffer tank 75.
When the high liquid level detection sensor 91 detects the high liquid level of the resist liquid and a detection signal is sent to the control unit 90, it is determined that the resist liquid has been filled to a predetermined high liquid level. Open / close control valve 7
A control signal is sent to the open / close control valves 74,
81 is closed, and the filling of the buffer solution into the buffer tank 75 is completed.

Next, when supplying the resist solution from the buffer tank 75 to the coating processing unit (COT), a control signal is sent from the control unit 90 to the pump 76 so that the pump 76 is driven for a predetermined time and the control signal is supplied. A control signal is sent from the unit 90 to the open / close control valve 78, and the unit is opened for a predetermined time. Thus, a predetermined amount of the resist solution is supplied from the buffer tank 75 to the coating processing unit (COT). When the supply of the predetermined amount of the resist solution is completed, a control signal is sent from the control unit 90 to the pump 76 to stop the pump 76, and a control signal is sent from the control unit 90 to the opening / closing control valve 78 to be closed.

Each time the discharge of a predetermined amount of the resist liquid is completed, the resist liquid is replenished from the resist liquid tank 71 to the buffer tank 75 by opening and closing the open / close control valves 74 and 81 as described above.

When the discharge of the resist solution for each predetermined amount is completed,
The resist liquid corresponding to the discharged amount is stored in the buffer tank 75.
, The inside of the buffer tank 75 is evacuated. That is, when the buffer solution is filled with the resist solution, the control unit 90
Sends a control signal to the on / off control valve 81 to be opened. As a result, the upper portion of the buffer tank 75 is communicated with the pipe 80 via the branch pipe 79, so that the pressure inside the buffer tank 75 is reduced by the negative pressure generated in the branch pipe 79 by the air flowing through the pipe 80, N ₂ mixed in the liquid
The gas is released to the pipe 80.

As described above, in this embodiment, the pump 7
6, a buffer tank 75 having a function for degassing the N ₂ gas is provided. As described above, before the resist solution is sucked by the pump 76, the opening and closing control valve 81 is switched. Since the N ₂ gas in the resist solution has already been sufficiently degassed, the amplification of the N ₂ gas bubbles in the resist solution hardly occurs when the resist solution is subsequently sucked into the pump 76. Thus, the coating unit (COT), uneven coating due to the air bubbles of the N ₂ gas in the resist that occurs is prevented.

Next, a case where the resist solution in the buffer tank 75 overflows will be described. When the overflow sensor 93 detects the overflow of the resist solution, the control unit 90
Sends control signals to the pump 76 and the open / close control valve 78 to drive the pump 76 and
8 is opened. Thus, the overflowed resist solution is discharged from the buffer tank 75 and discharged to the dummy dispenser of the coating processing unit (COT). Further, an alarm may be activated when such an overflow occurs.

As described above, the overflowed resist solution is discharged, and the buffer tank 75
Even if a trouble occurs in which more resist liquid is supplied than necessary, excess resist liquid is discharged, so that there is no adverse effect on processing.

The present invention is not limited to the above embodiment, but can be variously modified. For example, in the above embodiment, the case where the resist solution is supplied has been described. However, the present invention is not limited to this, and the present invention can be applied to a case where another chemical solution, for example, a thinner, a developing solution or the like is supplied. Furthermore, although a semiconductor wafer is used as an object to be coated, the present invention is not limited to this, and may be, for example, an LCD glass substrate.

[0053]

As described above, according to the present invention,
Since the pump for discharging the chemical to the processing unit is provided downstream of the buffer tank provided with deaeration means for degassing the gas (for example, N ₂ gas) mixed in the chemical, the chemical is pumped. Before being sucked into the gas, the gas (for example, N ₂ gas) mixed in the chemical solution has already been sufficiently degassed by the degassing means, and then when the chemical solution is sucked into the pump, the gas mixed in the chemical solution (for example, N ₂ gas) bubbles amplification of N ₂ gas) hardly occurs. Therefore, it is possible to effectively prevent adverse effects caused by the presence of bubbles in the chemical solution, for example, coating unevenness caused by bubbles in the resist solution in, for example, a coating processing unit.

[Brief description of the drawings]

FIG. 1 is a plan view of the overall configuration of a semiconductor wafer coating / developing system to which a resist liquid supply system according to an embodiment of the present invention is applied.

FIG. 2 is a front view of the coating and developing system shown in FIG.

FIG. 3 is a rear view of the coating and developing system shown in FIG. 1;

FIG. 4 is a sectional view of the overall configuration of a resist coating unit mounted on the coating and developing system shown in FIG. 1;

FIG. 5 is a plan view of the resist coating unit shown in FIG. 4;

FIG. 6 is a block diagram showing a resist solution supply system according to the embodiment of the present invention.

[Explanation of symbols]

 71; resist liquid tank (chemical liquid tank) 72; resist liquid flow path (chemical liquid flow path) 74; open / close control valve (chemical liquid flow path opening / closing valve) 75; buffer tank 76; pump 79; branch pipe 80; pipe 81; Valve (pipe opening / closing valve) 90; control unit (control means) 91; high liquid level detection sensor 92; low liquid level detection sensor 93; overflow sensor COT; resist coating unit W; semiconductor wafer (substrate)

Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H01L 21/306 H01L 21/306 J (56) References JP-A-4-70838 (JP, A) JP-A-7-263335 (JP, A JP-A-9-213605 (JP, A) JP-A-9-45615 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027

Claims (15)

(57) [Claims] 1. A chemical liquid supply system for pumping and supplying a chemical liquid from a chemical liquid tank to a processing unit, comprising: a buffer tank for storing a chemical liquid supplied from the chemical liquid tank via a chemical liquid flow path; A pump arranged downstream of the buffer tank for sucking a chemical from the buffer tank and discharging the chemical to the processing unit; and depressurizing the inside of the buffer tank to discharge gas mixed in the chemical. And a degassing means for driving the pump for a predetermined time to discharge a predetermined amount of the chemical from the buffer tank to the processing unit, and when a predetermined amount of the chemical is stored in the buffer tank. Control means for depressurizing the inside of the buffer tank by the degassing means to degas the gas mixed in the chemical liquid. Stem. 2. The apparatus according to claim 2, further comprising a chemical liquid passage opening / closing valve interposed in the chemical liquid flow passage, wherein the control means is configured to switch from the chemical liquid tank to the buffer tank every time discharge of a predetermined amount of the chemical liquid is completed. The chemical solution supply system according to claim 1, wherein the chemical solution flow path opening / closing valve is switched to open so that the chemical solution is introduced into and compensated for. 3. The degassing means includes: a pipe connected to the buffer tank via a branch pipe; a pipe opening / closing valve provided on the pipe; and suction for suctioning the inside of the buffer tank via the pipe. The control means, when a predetermined amount of the drug solution is stored in the buffer tank, the pipe opening and closing valve is opened, and the suction means sucks the inside of the buffer tank, The chemical solution supply system according to claim 1, wherein the mixed gas is discharged to the pipe via the branch pipe. 4. The chemical solution supply system according to claim 3, wherein said suction means causes a gas to flow through said pipe to exert a suction force on said branch pipe. 5. The method according to claim 2, wherein the introduction of the chemical solution into the buffer tank is performed by opening a chemical solution flow passage opening / closing valve and reducing the pressure in the buffer tank by the degassing means. The chemical solution supply system according to the above. 6. The liquid crystal display according to claim 1, further comprising a liquid level detector for detecting a liquid level of the chemical solution in the buffer tank and inputting a detection signal to the control means. 3. The chemical solution supply system according to claim 1. 7. The control means, after the discharge of the predetermined amount of the chemical by the discharge means is completed, until the liquid level detector detects the high liquid level of the chemical, the chemical liquid flow path opening and closing valve. 7. The chemical solution supply system according to claim 6, wherein the chemical solution supply system is opened, and the chemical solution is introduced to make up for it. 8. When the chemical in the buffer tank overflows beyond a predetermined high liquid level, the apparatus further comprises an overflow detector for detecting the overflow, The chemical supply system according to any one of claims 1 to 7, wherein the valve is closed and the pump is driven to discharge the overflowed chemical to a dummy dispenser of the processing unit. . 9. The method according to claim 9, wherein the chemical in the buffer tank has a predetermined height.
An alarm is generated when the liquid level overflows.
9. The apparatus according to claim 8, wherein
The chemical solution supply system according to the above. 10. The deaeration means is provided in the buffer tank.
Degassing by depressurizing the space above the drug solution inside
The method according to any one of claims 1 to 9, wherein
The chemical solution supply system according to the above. 11. A substrate processing system in which each processing unit processes a substrate using a chemical solution supplied from a chemical solution supply system for pumping a chemical solution from a chemical solution tank, wherein the chemical solution supply system comprises: A buffer tank for storing the chemical solution supplied via the chemical solution flow path; and a pump disposed downstream of the buffer tank, for sucking the chemical solution from the buffer tank and discharging the chemical solution to the processing unit. A degassing means for reducing the pressure in the buffer tank and discharging gas mixed in the chemical; and driving the pump for a predetermined time to discharge a predetermined amount of the chemical from the buffer tank to the processing unit. And when a predetermined amount of the chemical is stored in the buffer tank, the inside of the buffer tank is depressurized by the degassing means. The substrate processing system characterized by comprising a control means for degassing the liquid medicine in the entrained gas Te. 12. A container for storing a processing solution, wherein
Transferring a predetermined amount to a container, The space above the processing liquid level of the transferred container is kept for a predetermined time.
And / or after reducing the pressure to a predetermined pressure,
And performing a predetermined process by supplying the
Characteristic substrate processing method. 13. A container once containing a processing liquid,
A process of transferring to a container, Set the amount of processing solution in the transferred container to a predetermined amount.
Process After this, the space above the processing liquid level in the transferred container is
The processing solution after the pressure has been reduced to a predetermined pressure for a time and / or
Supplying the substrate to the substrate and performing a predetermined process.
And a substrate processing method. 14. A container for storing a processing solution, which is
A process of transferring to a container, The amount of the processing liquid in the transferred container is larger than a predetermined amount
If the processing liquid in the container is
Discharging the liquid until a predetermined amount is reached, After this, the space above the processing liquid level in the
The processing solution after the pressure has been reduced to a predetermined pressure for a time and / or
Supplying a predetermined process from the nozzle to the substrate.
A substrate processing method, comprising: 15. A container from which a processing liquid is stored to another container
High processing liquid level Supply until detected by detection sensor
Process and The amount of processing solution in another container is higher than the high level detection sensor
When the overflow sensor provided at the position detects
If the processing liquid in the container is
Discharging to the detection position of the high liquid level detection sensor, After this, the space above the processing liquid surface in the another container is
And / or after reducing the pressure to a predetermined pressure,
A process for supplying a processing liquid from a nozzle to a substrate to perform predetermined processing
About A substrate processing method, comprising: