CN112058529B - Liquid processing apparatus, liquid processing method, and storage medium - Google Patents

Liquid processing apparatus, liquid processing method, and storage medium Download PDF

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Publication number
CN112058529B
CN112058529B CN202010500719.7A CN202010500719A CN112058529B CN 112058529 B CN112058529 B CN 112058529B CN 202010500719 A CN202010500719 A CN 202010500719A CN 112058529 B CN112058529 B CN 112058529B
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liquid
pumps
perform
pump
receiving
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CN112058529A (en
Inventor
若水信也
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0406—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material with several pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B05B12/04—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery for sequential operation or multiple outlets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a liquid processing apparatus, a liquid processing method and a storage medium which are effective for shortening the liquid feeding time of a processing liquid. The liquid treatment apparatus includes: at least three pumps for respectively performing a receiving operation for receiving the processing liquid and a discharging operation for discharging the received processing liquid to the same pipeline; a post pump for receiving the treatment liquid discharged to the same pipe line and discharging the received treatment liquid; and a liquid feeding control unit that repeatedly performs the following control: any two pumps among the three pumps are caused to perform the discharge operation, and the two pumps from which the treatment liquid is discharged are caused to sequentially perform the receiving operation.

Description

Liquid processing apparatus, liquid processing method, and storage medium
Technical Field
The present disclosure relates to a liquid processing apparatus, a liquid processing method, and a storage medium.
Background
Patent document 1 discloses a substrate processing apparatus including: a treatment container for storing a treatment liquid; an ejection pump that delivers a treatment liquid; and a feed pump for sucking the treatment liquid from the treatment container and feeding the sucked-out treatment liquid into the discharge pump.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2017-147369
Disclosure of Invention
Problems to be solved by the invention
The present disclosure provides a liquid processing apparatus, a liquid processing method, and a storage medium effective for shortening a liquid feeding time of a processing liquid.
Solution for solving the problem
The liquid treatment apparatus according to one aspect of the present disclosure includes: at least three pumps for respectively performing a receiving operation for receiving the processing liquid and a discharging operation for discharging the received processing liquid to the same pipeline; a post pump that performs a receiving operation for receiving the processing liquid discharged to the same line and a discharging operation for discharging the received processing liquid; and a liquid feeding control unit that repeatedly performs the following control: any two pumps among the three pumps are caused to perform the discharge operation, and the two pumps from which the treatment liquid is discharged are caused to sequentially perform the receiving operation.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present disclosure, a liquid processing apparatus, a liquid processing method, and a storage medium that are effective for shortening the liquid feeding time of a processing liquid can be provided.
Drawings
Fig. 1 is a schematic diagram illustrating a schematic configuration of a substrate liquid processing system.
Fig. 2 is a schematic diagram illustrating a schematic configuration of the liquid-discharge processing unit.
Fig. 3 is a block diagram illustrating a hardware configuration of the control section.
Fig. 4 is a flowchart illustrating the liquid discharge processing procedure.
Fig. 5 is a flowchart illustrating a liquid feeding control process of the auxiliary pump.
Fig. 6 is a flowchart illustrating a liquid feed control process of the main pump.
Fig. 7 is a flowchart illustrating a maintenance control process of the auxiliary pump.
Fig. 8 is a flowchart illustrating a maintenance control process of the main pump.
Description of the reference numerals
2: coating and developing apparatus (liquid processing apparatus); 38: a pipeline; 40: a main pump (a backing pump); 50. 50A,50B, 50C: auxiliary pumps (pumps); 111: a liquid feeding control unit; 112: a rear-stage liquid feeding control part; 113: and a post-maintenance control unit.
Detailed Description
The embodiments are described in detail below with reference to the drawings. In the description, the same elements or elements having the same functions are given the same reference numerals, and overlapping description is omitted.
[ substrate processing System ]
As shown in fig. 1, a substrate processing system 1 is a system that performs formation of a photosensitive film on a substrate, exposure of the photosensitive film, and development of the photosensitive film. The substrate to be processed is, for example, a semiconductor wafer W. The photosensitive coating is, for example, a resist film. The substrate processing system 1 includes a coating and developing apparatus 2 and an exposure apparatus 3. The exposure device 3 performs exposure processing on a resist film (photosensitive coating film) formed on a wafer W (substrate). Specifically, the exposure target portion of the resist film is irradiated with energy rays by a method such as liquid immersion exposure. The coating and developing apparatus 2 performs a process of forming a resist film on the surface of the wafer W (substrate) before the exposure process by the exposure apparatus 3, and performs a development process of the resist film after the exposure process.
[ coating treatment device ]
Hereinafter, the configuration of the coating and developing apparatus 2 will be described as an example of the liquid processing apparatus. The coating and developing apparatus 2 includes a carrier block 4, a process block 5, an interface block 6, and a control unit 100.
The carrier block 4 introduces the wafer W into the coating and developing apparatus 2 and removes the wafer W from the coating and developing apparatus 2. For example, the carrier block 4 can support a plurality of carriers C for the wafer W, and incorporates the transfer arm A1. The carrier C accommodates a plurality of round wafers W, for example. The transfer arm A1 takes out the wafer W from the carrier C, delivers it to the processing block 5, and receives the wafer W from the processing block 5 back into the carrier C.
The processing block 5 has a plurality of processing modules 11, 12, 13, 14. The processing modules 11, 12, 13 have built-in coating units U1, heat treatment units U2, and a transfer arm A3 for transferring the wafer W to these units.
The processing module 11 forms a lower film on the surface of the wafer W by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 11 applies a film forming liquid for forming a lower layer film onto the wafer W. The heat treatment unit U2 of the treatment module 11 performs various heat treatments accompanied with formation of the underlying film. Specific examples of the underlayer film include a Spin On Carbon (SOC) film and other so-called hard masks.
The processing module 12 forms a resist film on the underlying film by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 12 applies a film-forming liquid for forming a resist film onto the underlying film. The heat treatment unit U2 of the treatment module 12 performs various heat treatments accompanied with formation of a resist film.
The process module 13 forms an upper layer film on the resist film by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 13 applies a film forming liquid for forming an upper layer film onto the resist film. The heat treatment unit U2 of the treatment module 13 performs various heat treatments accompanied with formation of the upper layer film
The processing module 14 incorporates a developing unit U3, a heat treatment unit U4, and a transfer arm A3 for transferring the wafer W to these units. The processing module 14 performs a development process on the exposed resist film by the development unit U3 and the heat treatment unit U4. After the surface of the wafer W subjected to the exposure is coated with the developing solution, the developing unit U3 washes the surface of the wafer W with the rinse solution, thereby performing a development process of the resist film. The heat treatment unit U4 performs various heat treatments accompanied with the development treatment. Specific examples of the heat treatment include a heat treatment before development (PEB: post Exposure Bake, post baking) and a heat treatment after development (PB: post bak).
A rack unit U10 is provided in the processing block 5 on the side of the carrier block 4. The rack unit U10 is divided into a plurality of cells (cells) arranged in the up-down direction. A lift arm A7 is provided near the rack unit U10. The lift arm A7 lifts and lowers the wafer W between the cells of the rack unit U10.
A rack unit U11 is provided in the processing block 5 on the side of the interface block 6. The rack unit U11 is divided into a plurality of cells arranged in the up-down direction.
The interface block 6 transfers the wafer W between the interface block 6 and the exposure apparatus 3. For example, the interface block 6 has the transfer arm A8 built therein, and the interface block 6 is connected to the exposure device 3. The transfer arm A8 transfers the wafer W placed in the rack unit U11 to the exposure apparatus 3, and returns the wafer W from the exposure apparatus 3 to the rack unit U11.
The control section 100 controls, for example, the coating and developing apparatus 2 to perform a coating and developing process by the following procedure. First, the control unit 100 controls the transfer arm A1 to transfer the wafer W in the carrier C to the rack unit U10, and controls the lift arm A7 to dispose the wafer W in the chamber for the process module 11.
Next, the control unit 100 controls the transfer arm A3 to transfer the wafer W of the rack unit U10 to the coating unit U1 and the heat treatment unit U2 in the process module 11, and controls the coating unit U1 and the heat treatment unit U2 to form a lower layer film on the surface of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 to return the wafer W on which the lower film is formed to the rack unit U10, and controls the lift arm A7 to dispose the wafer W in the chamber for the process module 12.
Next, the control unit 100 controls the transfer arm A3 to transfer the wafer W of the rack unit U10 to the coating unit U1 and the heat treatment unit U2 in the process module 12, and controls the coating unit U1 and the heat treatment unit U2 to form a resist film on the lower film of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 to return the wafer W to the rack unit U10, and controls the lift arm A7 to dispose the wafer W in the chamber for the process module 13.
Next, the control unit 100 controls the transfer arm A3 to transfer the wafer W of the rack unit U10 to the coating unit U1 and the heat treatment unit U2 in the process module 13, and controls the coating unit U1 and the heat treatment unit U2 to form an upper layer film on the resist film of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 to transfer the wafer W to the rack unit U11.
Next, the control unit 100 controls the transfer arm A8 to send the wafer W of the rack unit U11 to the exposure apparatus 3. Thereafter, the control unit 100 controls the transfer arm A8 to receive the wafer W subjected to the exposure process from the exposure apparatus 3 and dispose the wafer W in the chamber for the process module 14 in the rack unit U11.
Next, the control unit 100 controls the transfer arm A3 to transfer the wafer W of the rack unit U11 to the developing unit U3 and the heat treatment unit U4 in the process module 14, and controls the developing unit U3 and the heat treatment unit U4 to perform a developing process on the resist film of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 to return the wafer W to the rack unit U10, and controls the lift arm A7 and the transfer arm A1 to return the wafer W to the carrier C. Through the above process, the coating and developing process is completed.
The specific structure of the substrate processing apparatus is not limited to the structure of the coating and developing apparatus 2 illustrated above. The substrate processing apparatus may be any apparatus if it includes the coating unit U1 and the control unit 100 capable of controlling these.
[ coating unit ]
Next, the structure of the coating unit U1 of the process module 12 will be specifically described. As shown in fig. 2, the coating unit U1 has a rotation holding portion 20 and a liquid supply portion 30.
The rotation holding unit 20 holds and rotates the wafer W from the back surface Wb side thereof. For example, the rotation holding portion 20 has a holding portion 21 and a rotation driving portion 22. The holding portion 21 holds the wafer W from a center portion (including a center portion) of the wafer W, which is horizontally arranged with the back Wb side support surface Wa of the wafer W facing upward, for example, by vacuum suction or the like. The rotation driving unit 22 rotates the holding unit 21 about a vertical axis passing through the center of the wafer W, using, for example, an electric motor or the like as a power source. Thereby also rotating the wafer W.
The liquid supply unit 30 supplies a processing liquid for forming a resist film to the surface Wa of the wafer W held by the holding unit 21. The liquid supply unit 30 includes a nozzle 31, a liquid source 32, a main pump 40, three auxiliary pumps 50, a reservoir tank 35, and a filter 36. The nozzle 31 is located above the rotation holding portion 20, and ejects the processing liquid onto the wafer W held by the rotation holding portion 20. The liquid source 32 accommodates a processing liquid to be supplied to the nozzle 31.
The main pump 40 (a subsequent pump) is connected to the nozzle 31 via a line 37, is connected to the liquid source 32 via a line 38, and pressurizes and feeds the treatment liquid from the liquid source 32 side to the nozzle 31 side. For example, the main pump 40 performs a receiving operation for receiving the processing liquid from the pipe 38 and a discharging operation for discharging the received processing liquid to the pipe 37.
As an example, the main pump 40 includes: a housing chamber 41 for pressurized conveyance of the processing liquid; valves 42, 43 which open and close the lines 37, 38, respectively. In the receiving operation, the main pump 40 expands the housing chamber 41 with the valve 43 opened and the valve 42 closed, and receives the processing liquid from the pipe 38 into the housing chamber 41. In the discharge operation, the main pump 40 reduces the housing chamber 41 with the valve 43 closed and the valve 42 opened, and discharges the processing liquid in the housing chamber 41 to the pipe 37. Specific examples of the main pump 40 include a bellows pump, a diaphragm pump, and a tube pump (japanese patent), for example.
The three auxiliary pumps 50 (pumps) are connected to the main pump 40 via a line 38, connected to the liquid source 32 via a line 39, and convey the treatment liquid under pressure from the liquid source 32 side to the main pump 40 side to assist the reception of the treatment liquid by the main pump 40. All the auxiliary pumps 50 perform a receiving operation for receiving the processing liquid from the same line 39 and a discharging operation for discharging the received processing liquid to the same line 38.
As an example, the auxiliary pump 50 includes: a housing chamber 51 for pressurized conveyance of the processing liquid; a valve 52 that opens and closes between the auxiliary pump 50 and the pipe 38; a valve 53 that opens and closes between the auxiliary pump 50 and the pipe 39. In the receiving operation, the auxiliary pump 50 expands the housing chamber 51 with the valve 53 opened and the valve 52 closed, and receives the processing liquid from the pipe 39 into the housing chamber 51. In the discharge operation, the auxiliary pump 50 reduces the housing chamber 51 with the valve 53 closed and the valve 52 opened, and discharges the processing liquid in the housing chamber 51 to the pipe 38. Specific examples of the auxiliary pump 50 include a bellows pump, a diaphragm pump, and a tube pump. In the following description, the three auxiliary pumps 50 are divided into the auxiliary pumps 50A,50B, and 50C as needed. The number of auxiliary pumps 50 included in the liquid supply unit 30 is not limited to three, as long as it is three or more. The liquid supply unit 30 may have four or more auxiliary pumps 50.
The reservoir tank 35 is provided in the pipe 39, and stores the processing liquid supplied from the liquid source 32 to the auxiliary pump 50 and removes bubbles in the processing liquid. The filter 36 is provided in the pipe 38, and removes particulates in the processing liquid fed from the auxiliary pump 50 to the main pump 40.
The coating unit U1 is controlled by the control unit 100. When controlling the coating unit U1, the control unit 100 is configured to execute liquid feeding control in which the following control is repeated: any two of the three auxiliary pumps 50 are caused to perform the discharge operation, and the two auxiliary pumps 50 from which the processing liquid is discharged are caused to sequentially perform the receiving operation. For example, as a functional configuration (hereinafter referred to as a "functional block"), the control unit 100 includes a liquid feeding control unit 111, a post-stage liquid feeding control unit 112, a post-stage maintenance control unit 113, and a rotation control unit 114.
The liquid feeding control unit 111 repeatedly performs the following control: any two of the three auxiliary pumps 50 are caused to perform the discharge operation, and the two auxiliary pumps 50 from which the treatment liquid is discharged are caused to sequentially perform the receiving operation (i.e., the above-described liquid feeding control is performed). In the liquid feeding control, the liquid feeding control unit 111 may cause the remaining one pump to perform the receiving operation while causing any two pumps among the three auxiliary pumps 50 to perform the discharging operation. In the liquid feeding control, the liquid feeding control unit 111 may sequentially change the two auxiliary pumps 50 for the discharge operation, and repeatedly perform the discharge operation of all combinations of the two auxiliary pumps 50.
In the liquid feeding control, the liquid feeding control unit 111 repeatedly executes a set of operations including, in order, a receiving operation, a discharging operation, a waiting for receiving operation of the other auxiliary pump 50, a receiving operation, a waiting for receiving operation of the other auxiliary pump 50, and a discharging operation, for each of the three auxiliary pumps 50.
As an example, the liquid feeding control unit 111 repeatedly performs the following 3 sets of operations in the liquid feeding control.
First group) causes the auxiliary pumps 50A,50B to sequentially perform the receiving operation after causing the auxiliary pumps 50A,50B to perform the ejecting operation.
Second group) causes the auxiliary pumps 50C,50A to sequentially perform the receiving operation after causing the auxiliary pumps 50C,50A to perform the ejecting operation.
Third group) causes the auxiliary pumps 50B,50C to sequentially perform the receiving operation after causing the auxiliary pumps 50B,50C to perform the ejecting operation.
In this repetition, the liquid feeding control unit 111 causes the auxiliary pump 50B to perform the receiving operation while causing the auxiliary pumps 50C and 50A to perform the ejecting operation while causing the last of the first group and the first of the second group to overlap. The liquid feeding control unit 111 overlaps the last of the second group and the first of the third group, and causes the auxiliary pump 50A to perform the receiving operation while causing the auxiliary pumps 50B and 50C to perform the ejecting operation. The liquid feeding control unit 111 causes the auxiliary pumps 50a and 50b to perform the discharge operation while causing the final third group and the first group to overlap each other and causes the auxiliary pump 50C to perform the receiving operation.
In accordance with the above operation rule, each auxiliary pump 50 repeatedly performs a set of operations including, in order, a receiving operation, a discharging operation, a waiting for receiving operation of another auxiliary pump 50, a receiving operation, a waiting for receiving operation of another auxiliary pump 50, and a discharging operation.
For example, the liquid feeding control unit 111 performs the liquid feeding control described above so as to assist the reception of the processing liquid by the main pump 40 by the discharge operation of the two assist pumps 50. Hereinafter, this liquid feeding control will be referred to as "normal liquid feeding control".
The liquid feeding control unit 111 may perform the liquid feeding control so that the processing liquid passes through the main pump 40 by the discharge operation of the two auxiliary pumps 50. Hereinafter, this liquid feeding control will be referred to as "maintenance liquid feeding control".
The post-stage liquid feeding control unit 112 repeatedly performs the following control: the main pump 40 is caused to perform a receiving operation of receiving the processing liquid discharged from any two pumps among the three auxiliary pumps 50, and the main pump 40 is caused to perform a discharging operation of discharging the received processing liquid. For example, the post-stage liquid feeding control unit 112 repeats the following control by the above-described normal liquid feeding control: the main pump 40 is caused to perform the receiving operation while any two of the three auxiliary pumps 50 perform the discharging operation, and the main pump 40 is caused to perform the discharging operation while the two auxiliary pumps 50 that have discharged the processing liquid sequentially perform the receiving operation.
For example, the post-stage liquid feeding control unit 112 causes the main pump 40 to perform the receiving operation while the auxiliary pumps 50A and 50B perform the discharging operation and while the auxiliary pump 50C performs the receiving operation, and thereafter causes the main pump 40 to perform the discharging operation while the auxiliary pump 50A performs the receiving operation.
The post-stage liquid feeding control unit 112 causes the main pump 40 to perform the receiving operation while the auxiliary pumps 50C and 50A perform the discharging operation and while the auxiliary pump 50B performs the receiving operation, and thereafter causes the main pump 40 to perform the discharging operation while the auxiliary pump 50C performs the receiving operation.
The post-stage liquid feeding control unit 112 causes the main pump 40 to perform the receiving operation while the auxiliary pumps 50B and 50C perform the discharging operation and while the auxiliary pump 50A performs the receiving operation, and thereafter causes the main pump 40 to perform the discharging operation while the auxiliary pump 50B performs the receiving operation.
The post-maintenance control unit 113 causes the processing liquid discharged from any two of the three auxiliary pumps 50 to pass through the main pump 40 while the discharge operation is being performed by the two auxiliary pumps 50. For example, the post-maintenance control unit 113 keeps the valves 42 and 43 of the main pump 40 in an open state at least while the discharge operation of the two auxiliary pumps 50 is repeated by the maintenance liquid feed control. The rotation control unit 114 holds the wafer W by the rotation holding unit 20 and rotates the wafer W.
Fig. 3 is a block diagram showing a hardware configuration of the control unit 100. The control unit 100 is composed of one or a plurality of control computers. As shown in fig. 3, the control unit 100 includes a circuit 120. The circuit 120 includes at least one processor 121, a memory 122, a storage device 123, and an input-output port 124. The storage device 123 has a storage medium readable by a computer, such as a hard disk. The storage device 123 stores a program for causing the control unit 100 to execute liquid feeding control and subsequent liquid feeding control, wherein the following control is repeated in the liquid feeding control: any two of the three auxiliary pumps 50 are caused to perform a discharge operation and the two auxiliary pumps 50 from which the processing liquid is discharged are caused to sequentially perform a receiving operation, and the following control is repeated in the post-stage liquid feeding control: the main pump 40 is caused to perform a receiving operation of receiving the processing liquid discharged from any two pumps among the three auxiliary pumps 50 and a discharging operation of discharging the received processing liquid.
The memory 122 temporarily stores the program loaded from the storage medium of the storage device 123 and the operation result generated by the processor 121. The processor 121 cooperates with the memory 122 to execute the above-described programs, thereby configuring the respective functional blocks described above. The input/output port 124 inputs/outputs electric signals between the rotation holding portion 20, the main pump 40, and the auxiliary pumps 50A,50B, and 50C in accordance with instructions from the processor 121.
The hardware configuration of the control unit 100 is not necessarily limited to the configuration of each functional block by a program. For example, at least a part of the functional blocks of the control unit 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit: application specific integrated circuit) in which dedicated logic circuits are integrated.
The structure of the liquid supply unit 30 described above is always an example. The liquid supply unit 30 may be appropriately modified by having at least three pumps for receiving the processing liquid and discharging the received processing liquid to the same line, and a pump for receiving the processing liquid discharged to the same line and discharging the received processing liquid.
[ liquid treatment Process ]
Next, as a specific example of the substrate liquid processing method, a substrate liquid processing process performed by the coating unit U1 is illustrated. As shown in fig. 4, the control unit 100 sequentially executes steps S01, S02, S03, S04, S05, S06, S07, and S08. In step S01, the rotation control unit 114 waits for the wafer W to be carried into the coating unit U1 by the carrying arm A3 and places the wafer W on the holding unit 21. In step S02, the rotation control unit 114 causes the holding unit 21 to hold the wafer W. In step S03, the rotation control unit 114 causes the rotation driving unit 22 to start rotation driving of the wafer W.
In step S04, the latter-stage liquid feed control unit 112 causes the main pump 40 to perform a discharge operation to discharge the processing liquid from the nozzle 31. The processing liquid discharged from the nozzle 31 reaches the surface Wa of the wafer W being rotated and then spreads by centrifugal force. Thereby, a liquid film of the treatment liquid is formed on the surface Wa. In step S05, the rotation control unit 114 waits for a predetermined drying time to elapse. The drying time is set in advance to a time for which the liquid film can be dried.
In step S06, the rotation control unit 114 stops the rotation driving unit 22 from rotationally driving the wafer W. In step S07, the rotation control unit 114 waits for the transfer arm A3 to reach the coating unit U1 and preparation for transferring the wafer W is completed. In step S08, the rotation control unit 114 releases the holding of the wafer W by the holding unit 21. Through the steps, the substrate liquid treatment process is completed.
Hereinafter, a control procedure of the liquid supply unit 30 performed by the control unit 100 in order to discharge the processing liquid from the nozzle 31 in step S04 will be described in detail. The control process includes a normal liquid feed control process, a post-stage liquid feed control process, a maintenance liquid feed control process, and a post-stage maintenance control process.
The normal liquid feeding control process is a process of the above-described normal liquid feeding control performed to assist the reception of the processing liquid by the main pump 40 by the discharge operation of the two assist pumps 50. The latter-stage liquid feeding control process is a process of the latter-stage liquid feeding control in which the following control is repeated: the main pump 40 is caused to perform the receiving operation while any two pumps among the three auxiliary pumps 50 are caused to perform the discharging operation by the above-described normal liquid feeding control, and the main pump 40 is caused to perform the discharging operation while the two auxiliary pumps 50 that have discharged the processing liquid sequentially perform the receiving operation.
The maintenance liquid feeding control process is a process of the maintenance liquid feeding control described above in order to cause the treatment liquid to pass through the main pump 40 by the discharge operation of the two auxiliary pumps 50. The post-maintenance control process is a process of causing the processing liquid discharged from any two of the three auxiliary pumps 50 to pass through the post-maintenance control of the main pump 40 while the discharge operation is performed by any two of the three auxiliary pumps 50. Hereinafter, each control procedure is illustrated in detail.
(liquid feeding control Process in general)
The flowchart shown in fig. 5 illustrates a normal liquid feeding process from a state where all the auxiliary pumps 50 are empty. The empty state is a state in which the processing liquid for the ejection operation is not replenished. As shown in fig. 5, the control unit 100 first executes steps S11, S12, S13, S14, and S15. In step S11, the liquid feeding control unit 111 causes the auxiliary pump 50A to perform the above-described receiving operation while causing the auxiliary pumps 50B and 50C to wait. In step S12, the liquid feeding control unit 111 causes the auxiliary pump 50B to perform the receiving operation while the auxiliary pumps 50A and 50C are waiting.
In step S13, the liquid feeding control unit 111 waits for the start of the receiving operation by the main pump 40. The liquid feeding control unit 111 may detect the start of the receiving operation by the main pump 40 based on the operation state of the main pump 40, or may detect the start of the receiving operation by the main pump 40 based on the elapsed time.
In step S14, the liquid feeding control unit 111 causes the auxiliary pumps 50A and 50B to perform the discharge operation, and causes the auxiliary pump 50C to perform the receiving operation. In step S15, the liquid feeding control unit 111 confirms whether or not the liquid processing is completed for all the wafers W to be processed.
When it is determined in step S15 that there is a wafer W to be processed for which the liquid processing is not completed, the control unit 100 executes steps S16, S17, S18, and S19. In step S16, the liquid feeding control unit 111 causes the auxiliary pump 50A to perform the receiving operation while the auxiliary pumps 50B and 50C are waiting. In step S17, the liquid feeding control unit 111 waits for the start of the receiving operation by the main pump 40 in the same manner as in step S13. In step S18, the liquid feeding control unit 111 causes the auxiliary pumps 50A and 50C to perform the discharge operation, and causes the auxiliary pump 50B to perform the receiving operation. In step S19, the liquid feeding control unit 111 confirms whether or not the liquid processing is completed for all the wafers W to be processed.
When it is determined in step S19 that there is a wafer W to be processed for which the liquid processing is not completed, the control unit 100 executes steps S21, S22, S23, and S24. In step S21, the liquid feeding control unit 111 causes the auxiliary pump 50C to perform the receiving operation while the auxiliary pumps 50A and 50B are waiting. In step S22, the liquid feeding control unit 111 waits for the start of the receiving operation by the main pump 40 in the same manner as in step S13. In step S23, the liquid feeding control unit 111 causes the auxiliary pumps 50B and 50C to perform the discharge operation, and causes the auxiliary pump 50A to perform the receiving operation. In step S24, the liquid feeding control unit 111 confirms whether or not the liquid processing is completed for all the wafers W to be processed.
When it is determined in step S24 that there is a wafer W to be processed for which the liquid processing is not completed, the control unit 100 returns the processing to step S12. Thereafter, until the liquid processing of all the wafers W is completed, the following control is repeated: the two auxiliary pumps 50 are caused to perform the discharge operation in accordance with the timing of the receiving operation of the main pump 40, and the two auxiliary pumps 50 are caused to sequentially perform the receiving operation.
When it is determined in step S15, step S19, and step S24 that the liquid processing is completed for all the wafers W to be processed, the control unit 100 completes the normal liquid feeding control.
(post-stage liquid feeding control Process)
As shown in fig. 6, the control unit 100 first executes steps S31, S32, S33, S34, and S35. In step S31, the rear-stage liquid-feeding control unit 112 waits for the completion of the auxiliary preparation for the receiving operation by the main pump 40 in the three auxiliary pumps 50. For example, the post-stage liquid feeding control unit 112 waits for completion of the receiving operation by the two auxiliary pumps 50. In step S32, the rear-stage hydraulic fluid supply control unit 112 causes the main pump 40 to perform the receiving operation.
In step S33, the subsequent liquid feeding control unit 112 waits for the discharge timing of the processing liquid in step S04. In step S34, the rear-stage liquid feed control unit 112 causes the main pump 40 to perform the discharge operation. In step S35, it is checked whether or not the liquid processing is completed for all the wafers W to be processed.
When it is determined in step S35 that there is a wafer W to be processed for which the liquid processing is not completed, the control unit 100 returns the processing to step S31. Thereafter, the discharge operation by the main pump 40 at the discharge timing is repeated until the liquid processing of all the wafers W is completed. When it is determined in step S35 that the liquid processing is completed for all the wafers W to be processed, the control unit 100 completes the post-stage liquid feeding control.
(maintenance liquid feeding control procedure)
The flowchart shown in fig. 7 illustrates a maintenance liquid feeding process starting from a state where all the auxiliary pumps 50 are empty. As shown in fig. 7, the control unit 100 first executes steps S41, S42, S43, S44, S45, S46, S47, S48, S49, and S51. In step S41, the liquid feeding control unit 111 waits for an execution instruction of maintenance. The maintenance execution instruction is input to the control unit 100 by a user, for example. In step S42, the liquid feeding control unit 111 waits for the valves 42 and 43 of the main pump 40 to open.
In step S43, the liquid feeding control unit 111 causes the auxiliary pump 50A to perform the above-described receiving operation while causing the auxiliary pumps 50B and 50C to wait. In step S44, the liquid feeding control unit 111 causes the auxiliary pump 50B to perform the receiving operation while the auxiliary pumps 50A and 50C are waiting. In step S45, the liquid feeding control unit 111 causes the auxiliary pumps 50A and 50B to perform the discharge operation, and causes the auxiliary pump 50C to perform the receiving operation.
In step S46, the liquid feeding control unit 111 causes the auxiliary pump 50A to perform the receiving operation while the auxiliary pumps 50B and 50C are waiting. In step S47, the liquid feeding control unit 111 causes the auxiliary pumps 50A and 50C to perform the discharge operation, and causes the auxiliary pump 50B to perform the receiving operation.
In step S48, the liquid feeding control unit 111 causes the auxiliary pump 50C to perform the receiving operation while the auxiliary pumps 50A and 50B are waiting. In step S49, the liquid feeding control unit 111 causes the auxiliary pumps 50B and 50C to perform the discharge operation, and causes the auxiliary pump 50A to perform the receiving operation. In step S51, the liquid feeding control unit 111 confirms whether or not the predetermined number of ejection operations for maintenance liquid feeding control are completed.
When it is determined in step S51 that the number of ejection operations has not reached the predetermined number, the control unit 100 returns the process to step S44. Thereafter, until the discharge operation is completed a predetermined number of times, the following control is repeated: the two auxiliary pumps 50 are caused to perform the ejecting operation, and the two auxiliary pumps 50 are caused to sequentially perform the receiving operation. When it is determined in step S51 that the predetermined number of ejection operations for maintenance liquid feeding control are completed, the control unit 100 completes the maintenance liquid feeding control.
(post-maintenance control procedure)
As shown in fig. 8, the control unit 100 sequentially executes steps S61, S62, S63, and S64. In step S61, the subsequent maintenance control unit 113 waits for the execution instruction of the maintenance described above. In step S62, the rear maintenance control unit 113 changes the valves 42 and 43 of the main pump 40 from the closed state to the open state.
In step S63, the subsequent maintenance control unit 113 waits for completion of the fluid delivery to the main pump 40. For example, the post-maintenance control unit 113 waits for completion of the discharge operation for the predetermined number of times in the maintenance liquid feed control process. In step S64, the post-maintenance control unit 113 changes the valves 42 and 43 of the main pump 40 from the open state to the closed state. Through the steps, the subsequent maintenance control process is completed.
[ Effect of the present embodiment ]
As described above, the coating and developing apparatus 2 includes: at least three auxiliary pumps 50 for receiving the processing liquid and discharging the received processing liquid to the same line 38, respectively; a main pump 40 that performs a receiving operation for receiving the processing liquid discharged to the same line 38 and a discharging operation for discharging the received processing liquid; and a liquid feeding control unit 111 that repeatedly performs the following control: any two of the three auxiliary pumps 50 are caused to perform the discharge operation, and the two auxiliary pumps 50 from which the processing liquid is discharged are caused to sequentially perform the receiving operation.
According to the coating and developing apparatus 2, the liquid feed amount can be increased by causing the two auxiliary pumps 50 to perform the discharge operation. Further, by overlapping the period during which the two auxiliary pumps 50 perform the discharge operation and the period during which the remaining one auxiliary pump 50 performs the receiving operation, the cycle time, which is the time during which the discharge operation of the two auxiliary pumps 50 and the receiving operation of the two auxiliary pumps 50 that have discharged the processing liquid are repeated, can be shortened. Therefore, it is effective to shorten the liquid feeding time.
The liquid feeding control unit 111 may cause the remaining one pump to perform the receiving operation while causing any two pumps among the three auxiliary pumps 50 to perform the discharging operation. In this case, the liquid feeding time can be shortened more reliably.
The liquid feeding control unit 111 may repeatedly perform a set of operations including, in order, a receiving operation, a discharging operation, a waiting for receiving operation of another auxiliary pump 50, a receiving operation, a waiting for receiving operation of another auxiliary pump 50, and a discharging operation, on each of the three auxiliary pumps 50. In this case, the uniformity of the operating frequencies of the three auxiliary pumps 50 can be improved.
The coating and developing apparatus 2 may further include a post-stage liquid feeding control unit 112, and the post-stage liquid feeding control unit 112 may repeat the following control: the main pump 40 is caused to perform the receiving operation while any two of the three auxiliary pumps 50 perform the discharging operation, and the main pump 40 is caused to perform the discharging operation while the two auxiliary pumps 50 that have discharged the processing liquid sequentially perform the receiving operation. In this case, the three auxiliary pumps 50 can be effectively used for shortening the cycle time of the main pump 40 for repeating the receiving operation and the discharging operation.
The coating and developing apparatus 2 may further include a post-maintenance control unit 113, and the post-maintenance control unit 113 may cause the processing liquid discharged from any two of the three auxiliary pumps 50 to pass through the main pump 40 while the discharge operation is performed by any two of the three auxiliary pumps 50. In this case, the three auxiliary pumps 50 can also be effectively used for shortening the maintenance period of the main pump 40 by the passage of the fluid.
The embodiments have been described above, but the present invention is not necessarily limited to the above embodiments, and various modifications can be made without departing from the gist thereof. For example, the structure illustrated above can also be applied to the coating unit U1 of the process module 11 and the coating unit U1 of the process module 13. The substrate to be processed is not limited to a semiconductor wafer, and may be, for example, a glass substrate, a mask substrate, an FPD (Flat Panel Display: flat panel display), or the like.

Claims (9)

1. A liquid treatment apparatus includes:
at least three pumps for respectively performing a receiving operation for receiving the processing liquid and a discharging operation for discharging the received processing liquid to the same pipeline;
a post pump that performs a receiving operation for receiving the treatment liquid discharged to the same line and a discharging operation for discharging the received treatment liquid; and
a liquid feeding control unit that repeatedly performs the following control: causing any two pumps of the three pumps to perform the ejecting operation, and causing the two pumps that ejected the processing liquid to sequentially perform the receiving operation,
the liquid feeding control unit causes the remaining one pump to perform the receiving operation while causing any two of the three pumps to perform the discharging operation.
2. The liquid treatment apparatus according to claim 1, wherein,
the liquid feeding control unit repeatedly executes a set of operations including, in order, the receiving operation, the ejecting operation, waiting for the receiving operation of the other pump, and the ejecting operation, for each of the three pumps.
3. A liquid treatment apparatus according to claim 1 or 2, wherein,
the liquid supply device further comprises a post-stage liquid supply control unit which repeatedly performs the following control: the post-pump is caused to perform the receiving operation during a period in which any two pumps among the three pumps perform the discharging operation, and is caused to perform the discharging operation during a period in which the two pumps that have discharged the processing liquid sequentially perform the receiving operation.
4. A liquid treatment apparatus according to claim 3, wherein,
the apparatus further includes a post-maintenance control unit that causes the treatment liquid discharged from any two of the three pumps to pass through the post-pump while the two pumps are performing the discharge operation.
5. A liquid treatment method comprises liquid feeding control and later-stage liquid feeding control,
wherein, in the liquid feeding control, the following control is repeatedly performed: any two pumps of at least three pumps which respectively perform a receiving operation of receiving a processing liquid and a discharging operation of discharging the received processing liquid to the same pipeline are caused to execute the discharging operation, and the two pumps which have discharged the processing liquid are caused to sequentially execute the receiving operation,
the following control is repeated in the latter-stage liquid feeding control: causing a subsequent pump to perform a receiving operation of receiving the treatment liquid discharged from any two of the three pumps, and causing the subsequent pump to perform a discharging operation of discharging the received treatment liquid,
the liquid feeding control comprises the following control steps: and causing the remaining one pump to perform the receiving action during a period in which any two pumps of the three pumps are caused to perform the ejecting action.
6. The liquid treatment method according to claim 5, wherein,
the liquid feeding control includes control for causing each of the three pumps to repeatedly execute a set of operations including, in order, the receiving operation, the ejecting operation, waiting for the receiving operation of the other pump, and the ejecting operation.
7. A liquid treatment method according to claim 5 or 6, wherein,
in the post-stage liquid feeding control, the post-stage pump is caused to perform the receiving operation while any two of the three pumps perform the discharging operation, and the post-stage pump is caused to perform the discharging operation while the two pumps that have discharged the processing liquid sequentially perform the receiving operation.
8. The method for treating a liquid according to claim 7, wherein,
further, the apparatus includes a post-maintenance control for causing the treatment liquid discharged from any two of the three pumps to pass through the post-pump during the discharge operation performed by the two pumps.
9. A computer-readable storage medium having a program code embodied therein,
a program for causing an apparatus to execute the liquid treatment method according to any one of claims 5 to 8 is stored.
CN202010500719.7A 2019-06-11 2020-06-04 Liquid processing apparatus, liquid processing method, and storage medium Active CN112058529B (en)

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