JPH05216215A - Mask panel for exposure - Google Patents

Abstract

PURPOSE:To provide a mask panel which a has high impact strength, and which is excellent in light transmissivity and heat-resistance. CONSTITUTION:The mask panel 10 is constituted of a mask plate 11 made of tempered glass and a reinforced frame 12 stuck to the peripheral part 110 of the mask plate 11. A photomask for exposure having a desired wiring pattern is stuck to the mask panel 10, so that a mask stuck plate is made. It is desirable that a hole 120 for a knob is provided on the mask panel 10. The hole 120 for the knob is provided by piercing the mask plate 11 and the reinforced frame 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask panel excellent in light transmission, heat resistance and impact resistance.

[0002]

2. Description of the Related Art In the process of manufacturing a printed circuit board,
There is a pattern forming step. In this pattern formation process,
As shown in FIG. 6, a mask adhering plate 9 in which a photomask 2 for exposure having a desired wiring pattern 21 is adhered to a mask panel 90 is used. Then, the mask attachment plate 9 is made to face the surface of the printed circuit board coated with the photosensitizer, and light is irradiated by the exposure device to expose it.

Next, the photosensitive material on the printed circuit board is developed,
Fix it. After that, an etching process is performed on the surface of the printed circuit board to dissolve and remove excess portions of the copper foil, leaving only desired wiring pattern portions. As the mask panel, an acrylic plate having a good light transmittance has been conventionally used. Since the mask panel directly faces the light source, it is strongly exposed to light.

[0004]

However, when an electrodeposition resist or the like is applied as a photosensitizer on a printed circuit board, the amount of light applied to the electrodeposition film may be increased more than usual.
In this case, the amount of heat released from the light source also increases. Therefore, the mask panel 90, which directly faces the light source, is constantly irradiated with the heat and heated. Therefore, the mask panel 90 is elongated by heat. At the same time, the photomask 2 attached to the mask panel 90 also extends. Therefore, the wiring pattern 21 drawn on the photomask 2 is deformed and cannot be used. In view of the above problems, the present invention aims to provide a mask panel having excellent light transmittance and heat resistance.

[0005]

The present invention is a mask panel for attaching an exposure photomask for forming a wiring pattern, the mask panel comprising a mask plate made of transparent tempered glass, and the mask plate. The exposure mask panel is characterized in that it comprises a reinforcing frame adhered to a peripheral portion of the exposure mask panel. What is most noticeable in the present invention is that tempered glass is used as the mask plate and a reinforcing frame is bonded to the peripheral portion thereof.

As the above-mentioned tempered glass, there is a transparent plate glass which is heat-treated. A material such as hard vinyl chloride resin is used for the reinforcing frame. A double-sided tape and an adhesive are used to bond the mask plate and the reinforcing frame. Further, the mask panel may be provided with a hole for a handle in its peripheral portion. This facilitates transportation and handling of the mask panel.

[0007]

In the present invention, tempered glass is used as the mask plate. Therefore, the light transmission,
Excellent heat resistance. In addition, a reinforcing frame is bonded to the peripheral portion of the mask plate made of tempered glass.
Therefore, the mechanical strength of the mask plate is reinforced.
In addition, if the mask plate is damaged, the reinforcing frame prevents the mask plate from scattering.

Further, tempered glass is used for the mask plate. Therefore, it is more resistant to shock than ordinary glass. Moreover, even if it is broken, the tempered glass is dispersed in rounded small particles. Therefore, the risk is low. Ordinary glass is highly dangerous because the fragments are sharp.
As described above, according to the present invention, it is possible to provide a mask panel excellent in light transmission, heat resistance and impact resistance.

[0009]

【Example】

Example 1 A mask panel according to an example of the present invention will be described with reference to FIGS. 1 to 5. The mask panel 10 of this example is
As shown in FIG. 1, a mask plate 11 made of tempered glass and a peripheral portion 11 of the mask plate 11 are formed.
It consists of a reinforcing frame 12 bonded to 0. The mask plate 11 is made of transparent tempered glass containing silica as a main component. The mask plate 11 has a thickness of 5 mm and a vertical length of 660 m.
m, width 750 mm. Handle holes 120 are provided at the corners of the peripheral portion 110 of the mask plate 11.

The reinforcing frame 12 has an opening 123,
Made of acrylic resin plate. The reinforcing frame 12 has a thickness of 3 mm and a frame width of 60 mm. In addition, the reinforcement frame 12
Has a handle hole 120 at the same position as the handle hole 120 of the mask plate 11. The reinforcing frame 12 is formed by using a double-sided tape, and the peripheral portion 11 of the mask plate 11 is
Paste it to 0 (Fig. 1C). In this way, the mask panel 10 described above is obtained.

Next, a method for forming a wiring pattern on a printed board using the mask panel 10 will be described. First, as shown in FIG.
The photomask 2 having a desired wiring pattern 21 is attached to the mask plate 11 side of the above, and the mask attaching plate 1 is prepared. At this time, the wiring pattern 21 is made to enter the inside of the opening 123 of the reinforcing frame 12.

Next, the mask attachment plate 1 is fixed to the exposure device 8 and exposed. That is, as shown in FIG. 3, the exposure apparatus 8 includes a substrate fixing portion 87, a mask fixing portion 81, an ultraviolet lamp 89 provided on the mask attaching portion 1 side of the mask fixing portion 81, and a printed circuit board 7. It has a measurement light source 88 and a CCD camera 85 for positioning. The exposure device 8 is provided with a front side 800 for exposing the front surface 71 side of the printed circuit board 7 and a rear side 801 for exposing the rear surface 72 side thereof. The front side 800 and the rear side 801 are symmetrically installed. A conveyor 5 for transporting the printed circuit board 7 is arranged beside the exposure device 8.

As shown in FIG. 4, the mask fixing portion 81 has guide rails 810 and 811 for fixing the lower and upper ends of the mask adhering plate 1, left and right frames 812, and
Stoppers 8 for fixing the left and right sides of the mask attachment plate 1
15 and a panel fixture 816. The panel fixture 816 is rotatably attached to one end of the guide rail 810. Then, the mask fixing portion 81
When fixing the mask adhering plate 1 to, the mask adhering plate 1 is inserted along the guide rails 810 and 811, and brought into contact with the stopper 815. After that, the panel fixing tool 816 is rotated, and the locking tool (not shown) provided on the panel fixing tool 816 is locked to the frame 812.

Next, as shown in FIG. 5, the board fixing portion 87 is provided with a board holder 70 and an expandable and contractible hollow packing 87 provided on the peripheral portion of the board holder 70.
Has 0 and. The printed circuit board 7 for performing the exposure process is fixed to the substrate holder 70. Board holder 7
0 has a small hole 876 connected to the vacuum pump. Further, the packing 870 is provided with a small hole 877 connected to the ejector. The packing 870 is configured such that air is sucked and sucked by the ejector through the small hole 877, contracts when sucking air, and expands when sucking air.

As shown in FIGS. 3 and 5, the printed circuit board 7 fixed in the substrate fixing portion 87 faces the photomask 2 in the mask fixing portion 81 when mounted on the exposure device 8. The substrate fixing portion 87 and the mask fixing portion 81
As described above, the measurement light source 88 for positioning the printed circuit board 7 and the CCD camera 85 are provided on both sides of the. The conveyor 5 has a centering bar 50 for positioning the printed circuit board 7 with respect to the substrate holder 70. The printed circuit board 7 on the conveyor 5 stands up to the conveyor 5 by 90 degrees and is fixed to the substrate holder 70.

When performing exposure for forming a wiring pattern on the front surface 71 and the back surface 72 of the printed circuit board 7 using the above-mentioned exposure apparatus, first, as shown in FIGS. Then, apply the photosensitizer,
The printed board 7 is conveyed by the conveyor 5 and is fixed to the board holder 70 at the board mounting station 51.

Next, the substrate holder 70 is slid laterally from the conveyor 5 to be inserted into the front side 800 of the exposure device 8 and positioned in front of the mask attaching plate 1 in the mask fixing portion 81. Next, as shown in FIG. 5, the substrate holder 70 is fixed to the substrate fixing portion 87. After that, the substrate fixing portion 87 is moved to bring the substrate holder 70 close to the mask fixing portion 81. Then, the packing 870 is brought into contact with the mask plate 11 of the mask attaching plate 1.

Next, the substrate holder 70 is vacuum pumped.
The air in the gap 827 between the mask fixing portion 81 and the mask fixing portion 81.
To vacuum. Further, the ejector sucks the air in the packing 870 through the small hole 877 to shrink the packing 870. At this time, the measurement light source 88
Using the CCD camera 85, the printed circuit board 7 is accurately positioned with respect to the photomask 2. Next, the reinforcing frame 12 of the mask fixing portion 81 is irradiated with ultraviolet rays from the ultraviolet lamp 89.
Irradiate from the side. Ultraviolet rays pass through the mask plate 11. Next, the surface 71 of the printed board 7 is exposed by the wiring pattern 21 formed on the photomask 2.

In this way, the surface 7 of the printed circuit board 7
After the exposure of the first side is completed, the substrate fixing portion 87 and the mask fixing portion 81
The vacuum in the gap 827 between and is released. By releasing the vacuum in the packing 870, the packing 870 is extended and the printed circuit board 7 is separated from the photomask 2. After that, the substrate holder 70 is slid toward the conveyor 5.

Next, the printed board 7 is mounted on the board holder 70.
The exposed surface 71, which has been removed from the apparatus, is placed facing the conveyor 5. In this state, the conveyor 5 moves the printed circuit board 7 from the front side 800 to the rear side 801.
Carry to. In the centering bar 50 on the rear side 801, the printed circuit board 7 has its rear surface 72 facing outward,
It is placed on the substrate holder 70.

After that, also on the rear side 801, the back surface 72 of the printed circuit board 7 is exposed in the same manner as in the case of the front side 800. As described above, the front surface 71 and the back surface 72 of the printed board 7 are continuously exposed.
This exposure apparatus uses an 8w ultraviolet lamp. Therefore, the mask panel 10 is irradiated with light that is stronger than the ultraviolet ray (6w) that is normally used. Therefore, the mask panel 10 is heated to about 30 ° C. Even in this case, since the mask plate is made of tempered glass, it does not stretch. Also, it does not deform. Therefore, it has excellent heat resistance. Further, the tempered glass can sufficiently transmit light.

Further, in the mask panel 10 of this embodiment, as shown in FIG. 1, the reinforcing frame 12 is bonded to the peripheral portion 110 of the mask plate 11. Therefore, the mask plate 1
The mechanical strength of 1 is reinforced. Further, if the mask plate 11 is damaged, the reinforcing frame 12 prevents the mask plate 11 from scattering. Further, tempered glass is used for the mask plate 11. Therefore, it is more resistant to shock than ordinary glass. Moreover, even if it is broken, the tempered glass is dispersed in rounded small particles. for that reason,
The risk is small. With ordinary glass, the fragments are sharply angled, so there is a great danger. Furthermore, the mask panel 10 of this example
Has a hole 120 for a handle in its peripheral portion 110. Therefore, the transportation and handling of the mask panel 10 becomes easy.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a manufacturing process of a mask panel of Example 1.

FIG. 2 is an explanatory view showing a manufacturing process of the mask sticking plate of Example 1.

FIG. 3 is a plan view of the exposure apparatus according to the first embodiment.

FIG. 4 is an explanatory view showing how the mask adhering plate is attached to the mask fixing portion according to the first embodiment.

FIG. 5 is a side view showing a contact state between a mask fixing portion and a substrate fixing portion in the exposure apparatus according to the first embodiment.

FIG. 6 is an explanatory view showing a manufacturing process of a conventional mask panel.

[Explanation of symbols]

 1,9. ． ． Mask sticking plate, 10, 90. ． ． Mask panel, 11. ． ． Mask plate, 110. ． ． Peripheral portion, 12. ． ． Reinforcement frame, 120. ． ． Hole for handle, 2. ． ． Photomask, 21. ． ． Wiring pattern,

Claims (1)

[Claims] 1. A mask panel for attaching an exposure photomask for forming a wiring pattern, wherein the mask panel is a mask plate made of transparent tempered glass, and is bonded to a peripheral portion of the mask plate. A mask panel for exposure, which comprises a reinforcing frame.