JP2000319040A - Glass sheet for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the adhesion of chipping or cracking, etc., to a product without peeling from glass end faces in spite of the occurrence of the chipping or cracking, etc., in a glass sheet and to improve a product yield and to obtain the high-quality glass sheet by cutting out a prescribed size from a flat planar blank sheet of a large size, then providing the glass sheet with a film coating the lateral circumference to a U shape in cross section so as to cover the acute angled end face. SOLUTION: The film 3 is formed to the U shape in cross section so as to cover the entire part of the lateral circumference inclusive of the acute-angled end face 2 of the raw glass sheet 1 in a series of stages in succession preferably to a cutting stage. The film 3 is preferably formed of a UV curing resin, thermosetting resin or other coating materials in such a manner that the chipping or cracking, etc., are not liberated from the glass end face even if the chipping, etc., are generated. Low expansion glass, such as borosilicate glass, heat resisting glass, such as 'Pyroceram (R)' and glass blanks used for electronic parts are suitable as the glass blank. The need for chamfering of the end face 2 is eliminated, productivity is improved and a cost is drastically reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
Substrates for semiconductor integrated circuits such as SI, display devices such as light emitting diodes, photo sensors, CCDs, optical filters,
The present invention relates to a glass plate for electronic equipment used for electronic equipment, such as a transparent cover of a light receiving device.

[0002]

2. Description of the Related Art A substrate for a semiconductor integrated circuit such as an IC or an LSI, a display device of an electronic device such as a light emitting diode, a photo sensor, a CCD, and a transparent cover of a light receiving device constitute predetermined electronic devices. . These are used for parts requiring heat resistance as substrates for semiconductor integrated circuits such as ICs and LSIs, light-emitting diodes, photo sensors, CCDs, etc.
In the case of a display device of electronic equipment such as a transparent cover of a light receiving device, etc., or a fluorescent (liquid crystal) or LED etc. character (number)
And used to display images. In the latter case, a light-emitting plate (base glass) for emitting and displaying required characters by an electric signal is sealed inside.

Conventionally, when manufacturing the above-mentioned glass plate for electronic equipment, a large-sized raw material plate formed into a flat plate by a conventional method is cut into a required size as shown in FIG. 42 was chamfered as shown in FIG. 4A, and then the surface was polished to a predetermined thickness to obtain a glass plate 41 for an electronic device.

[0004] However, the conventional manufacturing method described above has the drawback that the chamfering of a large number of end faces 42 takes a great deal of time, greatly reducing productivity and increasing costs.

[0005] Further, there is a drawback that mist is generated at the time of attachment to other jigs for chamfering, thereby lowering the product yield and adversely affecting the working environment.

Further, the residual stress generated in the cutting process is
There is also a drawback that other processes are adversely affected.

[0007] In the conventional manufacturing method, when cutting a large material plate into a required size as shown in FIG.
Chipping and fine cracks have occurred on the cut end face,
Such chipping and cracking are not eliminated in the subsequent chamfering process, but rather increase. Then, there is a possibility that the small glass pieces due to the chipping or cracking may adversely affect the electronic devices incorporated therein.

Therefore, as shown in FIG. 4B, an etching process is performed on the sharp end surface 42 of the glass plate 41 for an electronic device, or a circle that eliminates the sharp end surface as shown in FIG. 4C. Forming processing for forming an arc-shaped cross section 43 is performed.

[0009]

However, FIG.
In order to etch the sharp end face 42 of the glass plate 41 for an electronic device as shown in FIG. 4 (b), it is necessary to pass through an etching bath, and to eliminate the sharp end face as shown in FIG. 4 (c). In order to perform the forming process to make the circular arc-shaped cross section 43,
It is necessary to store the material plate in a jig and apply heat and pressure.
It is very difficult to automate a molding or processing line, which has been a major cause of cost increase.

[0010] Further, the above-mentioned conventional means cannot suppress mist generated at the time of attaching to a jig for chamfering or other jigs, so that there is a problem that the yield of products is lowered and the working environment is adversely affected. Almost no solution.

The glass plate for electronic equipment of the present invention is intended to solve the above-mentioned drawbacks of the prior art, and employs a completely different processing method to improve the productivity and improve the product yield to reduce the cost and cost. An object of the present invention is to provide a glass plate for electronic equipment which can supply a glass plate for electronic equipment of high quality.

[0012]

That is, the glass plate for electronic equipment according to the present invention is cut out from a large-sized raw material plate formed into a flat plate into a required size, and is so formed as to cover the sharp end face thereof. The glass plate is provided with a coating covering the periphery of the side surface of the glass plate in a U-shaped cross section. Even if chipping or cracks occur in the glass plate, the glass plate is not released from the end surface of the glass plate and does not adhere to the product. .

The glass material used in the present invention includes:
Suitable are low-expansion glass such as borosilicate glass, heat-resistant glass such as Pyroceram (trade name), and other glass materials used for electronic components.

In the present invention, it is also characterized in that the coating that covers the periphery of the side surface of the glass base plate in a U-shape in cross section is selected from a UV-curable resin, a thermosetting resin, or another paint to form a coating. I have.

Since the glass plate for electronic equipment according to the present invention is constructed as described above, the end face is not required to be chamfered, the productivity is remarkably improved, and a significant cost reduction can be achieved.

In addition, no mist is generated by chamfering or the like, the occurrence of defective products is reduced, the yield of products is improved, and a favorable working environment can be always maintained.

[0017] It is possible to provide a high-quality glass plate for electronic equipment without occurrence of chipping or cracking as seen in the conventional manufacturing method.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the glass plate for electronic equipment of the present invention will be described below in detail with reference to the drawings.

1 and 2 show an embodiment of a glass plate for electronic equipment according to the present invention. FIG. 1 is a perspective view thereof, and FIG. 2 is an enlarged sectional view of an end face. FIG. 3 is a perspective view of the original glass sheet before a film is formed.

First, a required size (contour and thickness) is cut out from a large-sized raw material plate formed into a flat shape. Examples of the glass material include low-expansion glass such as borosilicate glass, heat-resistant glass such as Pyroceram (trade name),
Other glass materials used for electronic components are suitable.

The end face 2 of the original glass plate 1 is not subjected to any processing such as chamfering, etching, and forming into an arc-shaped cross section.

Preferably, in a series of steps subsequent to the cutting step, or in a separate step, the glass plate 1 is formed into a U-shaped cross section so as to cover the entire side circumference including the sharp end face 2. The coating 3 is formed.

The coating film 3 may be a UV-curable resin, a thermosetting resin, or another coating material. Even if chipping or cracking occurs due to the formation of a film having a predetermined thickness, the coating 3 is free from the end surface of the glass plate. It is desirable not to do so.

The coating 3 is formed in a U-shaped cross section as shown in FIG. An example of a means for forming the coating 3 will be described. The glass original plate 1 is mounted on a conveyor 4 and conveyed, and the application rollers 5 installed on both sides of the conveying path are brought into contact with the side surfaces of the glass original plate 1. . Since the solution of the coating 3 or the like is adhered to the coating roller 5, the coating 3 is applied to the side surface of the glass substrate 1 as the coating 3. At that time, the coating 3
The solution or the like of the end face 2
The coating 3 is formed in a U-shaped cross section as a result. After the formation of the coating 3 on the pair of longer opposing surfaces of the glass base plate 1, the glass base plate 1 is mounted on the conveyor 4 while being rotated by 90 ° and transported, while facing the both sides of the transport path. The coating roller 5 is set in contact with the shorter pair of opposite side surfaces of the glass plate 1, and the coating 3 is similarly formed in a U-shaped cross section. Using the above process,
The coating film 3 can be formed in a series of processing steps from the cutting step.

Of course, in addition to the above forming means, for example,
The portions where the coating 3 is not formed on both surfaces of the glass base plate 1 may be shielded using a jig, a cover sheet, a film, or the like, and the coating 3 may be formed on the portion by spraying or knife coating. Other measures include dip
Alternatively, a processing method such as printing may be used.

The point is that there is no occurrence of mist, chipping or cracking on the glass plate for electronic equipment, and it is a method for eliminating adverse effects in each process. Therefore, it is ready to be shipped as it is.

[0027]

As described above, the glass plate for electronic equipment of the present invention is constructed as described above, so that the end face is not required to be chamfered, the productivity is remarkably improved, and a significant cost reduction can be achieved.

Further, no mist is generated due to chamfering or the like, the occurrence of defective products is reduced, the yield of products is improved, and a favorable working environment can be always maintained.

It is possible to provide a high-quality glass plate for electronic equipment without causing chipping or cracking as seen in the conventional manufacturing method.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a glass plate for electronic equipment of the present invention.

FIG. 2 is an enlarged sectional view of the end face.

FIG. 3 is a perspective view of an original glass sheet.

4A is a schematic cross-sectional view of a conventional example in which an end surface of a glass plate for an electronic device is chamfered, FIG. 4B is a schematic cross-sectional view of a conventional example in which an end surface of the glass plate for an electronic device is etched. (C) is a schematic cross-sectional view of a conventional example in which an end surface of a glass plate for an electronic device is formed into an arc-shaped cross section.

FIG. 5 is a perspective view of a conventional glass plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Original glass plate 2 End surface 3 Coating 4 Conveyor 5 Application roller 11 Glass plate for electronic devices

Claims (2)

[Claims] 1. A method of cutting a large-sized raw material plate formed into a flat plate into a desired size, and then coating a side surface of the base glass plate with a U-shaped cross-section so as to cover an acute end face thereof. A glass sheet for electronic equipment, wherein the glass sheet is not released from an end face of the glass sheet even if chipping or cracks occur in the glass sheet and does not adhere to products. 2. A coating in which the periphery of a side surface of a glass base plate is coated in a U-shape in cross section is formed by forming a coating selected from a UV curable resin, a thermosetting resin, or another paint.
The glass plate for electronic equipment according to 1.