JPH0521342B2 - - Google Patents

Info

Publication number
JPH0521342B2
JPH0521342B2 JP60273368A JP27336885A JPH0521342B2 JP H0521342 B2 JPH0521342 B2 JP H0521342B2 JP 60273368 A JP60273368 A JP 60273368A JP 27336885 A JP27336885 A JP 27336885A JP H0521342 B2 JPH0521342 B2 JP H0521342B2
Authority
JP
Japan
Prior art keywords
silicone resin
electronic component
wiring board
filled
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60273368A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62133741A (ja
Inventor
Yukio Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60273368A priority Critical patent/JPS62133741A/ja
Priority to US06/900,532 priority patent/US4709301A/en
Priority to DE86112244T priority patent/DE3688164T2/de
Priority to EP86112244A priority patent/EP0214621B1/en
Publication of JPS62133741A publication Critical patent/JPS62133741A/ja
Publication of JPH0521342B2 publication Critical patent/JPH0521342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/47—
    • H10W72/00—
    • H10W70/656—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60273368A 1985-09-05 1985-12-06 パツケ−ジ Granted JPS62133741A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60273368A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ
US06/900,532 US4709301A (en) 1985-09-05 1986-08-26 Package
DE86112244T DE3688164T2 (de) 1985-09-05 1986-09-04 Packung mit einem Substrat und mindestens einem elektronischen Bauelement.
EP86112244A EP0214621B1 (en) 1985-09-05 1986-09-04 A package comprising a substrate and at least one electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273368A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62133741A JPS62133741A (ja) 1987-06-16
JPH0521342B2 true JPH0521342B2 (cg-RX-API-DMAC10.html) 1993-03-24

Family

ID=17526925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273368A Granted JPS62133741A (ja) 1985-09-05 1985-12-06 パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS62133741A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990000814A1 (fr) * 1988-07-15 1990-01-25 Toray Silicone Co., Ltd. Dispositif a semi-conducteurs scelle par une resine et procede de production
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Also Published As

Publication number Publication date
JPS62133741A (ja) 1987-06-16

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