JPH05211195A - Wire bonding apparatus - Google Patents

Abstract

PURPOSE:To enable a bonding wire to be fed smoothly, by providing a cleaner for cleaning a tool kept in the ready state capable of bonding operations, and by removing automatically the peeled pieces of the covering material of a covered wire, etc., generated in the tool by the bonding operations. CONSTITUTION:On a bonding head 2 provided on an X-Y table 1, a horn 3 at whose end a tool 4 is provided is mounted elevatably, and a bonding stage 6a is provided below the tool 4. On the bonding stage 6a, a cleaning vessel 7 filled with a cleaning liquid 8 and a drier 9 by which the tool 4 after cleaning is dried are provided respectively. When bondings are performed about fifty thousand times, the tool 4 is dipped in the cleaning liquid 8 of alcohol, etc., in the cleaning vessel 7, keeping the state intact, wherein a covered wire is passed through the tool 4 and its bonding is possible. Then, by applying ultrasonic vibration to the tool 4, peeled pieces, etc., left in the tool 4 are removed The tool 4 after cleaning is dried by the drier 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding device, and more particularly to a wire bonding device using a coated wire.

[0002]

2. Description of the Related Art Usually, a wire bonding apparatus is an apparatus for connecting a pad on a semiconductor chip and an external lead with a fine metal wire such as gold, aluminum or copper. Further, this wire bonding device includes a device for connecting a thin metal wire with a coated wire coated with an insulating material.

FIGS. 3A to 3C are diagrams showing an example of a conventional wire bonding apparatus in the order of operation. As shown in FIG. 3, this wire bonding apparatus includes an XY table 1 that moves in XY directions, a bonding head 2 that is placed on the XY table, and a bonding head 2.
A horn 3 extending further in one direction, a tool 4 attached to the tip of the horn 3, a bonding stage 6 below the tool 4 for mounting the semiconductor element 13 and the external leads 12, and a hole for the tool 4. Covered wire 14
There was a spool 16 around which the covered wire 14 was wound and a clamper 15 which fixedly holds the covered wire 14.

Next, the operation of this wire bonding apparatus will be described. First, as shown in FIG.
By the horizontal movement of the bonding head 2 on the table 1 and the vertical movement of the horn 3, the tool 4 and the covered wire 14 passed through the tool 4 are moved onto the semiconductor element 13 on the bonding stage 6. The connection method of the covered wire 14 is a thermocompression bonding method or an ultrasonic combined thermocompression bonding method. Next, as shown in FIG.
The tool 4 moves onto the outer lead 11 and the coated wire 1
4 and the external lead 11 are connected. During this movement, the covered wire 14 is paid out from the spool 16 and led out from the hole of the tool 4. Next, after connection, FIG.
As shown in FIG. 5, the covered wire 14 is fixedly held by the clamp 15 and is cut in the vicinity of the connection portion by the rising of the tool 4. Then the clamp 15 loosens the wire and the tool 4
By the processing described above, the covered wire 14 is kept in a state of protruding from the tool 4 by the length required for the connecting operation. As described above, the semiconductor element 13 and the external lead 11 were connected by the covered wire 14 by a series of operations.

[0005]

In this conventional wire bonding apparatus, when ultrasonic waves are applied to the coated wire 14 or when the coated wire 14 slides in the hole of the tool 4, the surface of the coated wire 14 is broken. The coating may peel off,
Alternatively, the peeled pieces adhere and accumulate inside the tool 4,
There is a problem that the smooth movement of the covered wire 14 is hindered and the bonding operation becomes difficult. Further, in order to prevent these problems, it is necessary to frequently clean the tool 4, but this cleaning work is performed after removing the covered wire 14 from the inside of the tool 4 and removing the tool 4 from the horn 3. Since it is performed by the operation of cleaning and reattaching,
There was a problem that required a lot of labor and time.

It is an object of the present invention to provide a wire bonding apparatus which eliminates the problem of operation by peeling off the wire coating in order to solve such a problem and enables a smooth connection operation.

[0007]

A wire bonding apparatus according to the present invention is a tool for bonding by pressing a bonding stage on which an object to be bonded is placed and a coated wire for coating a thin metal wire with an insulator to the object to be bonded. A bonding head for moving the tool in the vertical direction, an XY table for moving the bonding head in the horizontal direction, and a mechanism arranged on the bonding stage for cleaning the tool before starting the bonding operation of the tool. It has and.

[0008]

The present invention will be described below with reference to the drawings.

1 (a) to 1 (c) are views showing a wire bonding apparatus according to an embodiment of the present invention in order of operation. As shown in FIG. 1, this wire bonding apparatus is provided with a cleaning layer 7 placed on the bonding stage 6a and filled with a cleaning liquid 8 for cleaning the tool 4, and a drying device 9 for drying the tool 4 after cleaning. That is. Otherwise, it is the same as the conventional example. The operation of this wire bonding apparatus is performed by moving the tool 4 and the XY table 1 with respect to the object 5 to be bonded, which is composed of a semiconductor element and external leads (not shown), on the bonding stage 6 as in the conventional case.
Bonding is performed by moving. When the bonding is performed about 50,000 times, the tool 4 is moved by the horizontal movement of the bonding head 2 on the XY table 1 and the vertical movement of the horn 3, as shown in FIG.
Is immersed in a cleaning liquid 8 made of alcohol or the like in the cleaning layer 7 in a bondable state in which a covered wire (not shown) is passed inside. In this state, ultrasonic vibration is applied to the tool 4 to remove the peeling pieces and the like inside the tool 4. Next, as shown in FIG. 1C, the tool 4 is moved to the front of the drying device 9 in a bondable state in which a coating wire (not shown) is passed through the tool 4 by the same moving method as described above. Be guided. Here, the cleaning liquid 8 attached near the tool 4 is dried by the hot air sent from the drying device. Next, after drying, the tool 4 again moves to the position shown in FIG. 1A to perform bonding.

FIG. 2 is a diagram showing another embodiment of the wire bonding apparatus of the present invention. As shown in FIG. 2, this wire bonding device is provided with a spray nozzle 10 for spraying high-pressure dry air onto the tool 4, and a dust collecting device 11 for collecting debris blown off by the spray nozzle 10. Operation of this wire bonding device,
First, the bonding operation is continuously performed in the same manner as in the above-described embodiment, and when the usage amount of the covered wire reaches the specified value, the tool 4 is in a bondable state with the covered wire passed through the inside thereof, and the XY table 1 Upper bonding head 2
By moving the horn 3 in the horizontal direction and moving the horn 3 up and down. Here, for example, high-pressure dry air having a pressure of 3.5 kg / square cm and a flow rate of about 28 l / h is jetted from the jet nozzle 10 into the gap between the tool 3 and the covered wire passed through it, and ultrasonic vibration is applied to the tool 4. By being applied, the peeled pieces inside the tool 4 are removed. Then, these peeled pieces are collected by the dust collector 11 installed below the injection nozzle 10, and are prevented from scattering near the wire bonding device. After such a tool cleaning operation, the tool 4 is moved to the bonding stage 6 again by the operation of the bonding head 2 and the horn 3 to perform wire bonding.

[0011]

As described above, the present invention is provided with the device for cleaning the tool ready for the bonding operation, so that the stripping material or the like from the coated wire inside the tool generated by the bonding operation can be removed. There is an effect that a wire bonding device capable of automatically eliminating the wire feeding and smoothly feeding the wire can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing an operation sequence in an embodiment of a wire bonding apparatus of the present invention.

FIG. 2 is a diagram showing another embodiment of the wire bonding apparatus of the present invention.

FIG. 3 is a diagram showing an operation sequence in an example of a conventional wire bonding apparatus.

[Explanation of symbols]

 1 XY Table 2 Bonding Head 3 Horn 4 Tool 5 Object to be Bonded 6, 6a, 6b Bonding Stage 7 Cleaning Tank 8 Cleaning Liquid 9 Drying Device 10 Spray Nozzle 11 Dust Collecting Device 12 External Lead 13 Semiconductor Element 14 Coated Wire 15 Clamper 16 Spool

Claims (1)

[Claims] 1. A bonding stage on which an object to be bonded is placed, a tool for pressing and bonding the metal thin wire to the object to be bonded through a coated wire covering the thin metal wire with an insulator, and a bonding head for vertically moving the tool. A wire bonding apparatus comprising: an XY table for horizontally moving the bonding head; and a mechanism arranged on the bonding stage for cleaning the tool before starting a bonding operation of the tool.