JPS5988828A - Cleaning device - Google Patents
Cleaning deviceInfo
- Publication number
- JPS5988828A JPS5988828A JP19921682A JP19921682A JPS5988828A JP S5988828 A JPS5988828 A JP S5988828A JP 19921682 A JP19921682 A JP 19921682A JP 19921682 A JP19921682 A JP 19921682A JP S5988828 A JPS5988828 A JP S5988828A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- high pressure
- hole
- water droplets
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はノズル先端の開孔部より水流を噴射し洗浄を行
う洗浄装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cleaning device that performs cleaning by spraying a water stream from an opening at the tip of a nozzle.
従来例の構成とその問題点
現在の半導体基板の洗浄は、前記半導体基板上に形成し
た素子に影響を及ぼすことが無く効率の良い高速な洗浄
が可−目なジェットスクラバーによる洗浄方法が主流と
なっている。これはノズル先端の細一部（φ４００μｍ
）より高圧ポンプで数１ｏＯＫり／ ｃｒｒｉに加圧し
た洗浄水を噴射し洗浄を行なうもので、良好な洗浄効果
を得るにはノズル先端細孔部は耐層性にすぐれたザファ
イヤ等が用いられ常にシャープな超高圧水流を噴射する
ことが必要であった。Conventional configuration and problems The current mainstream method for cleaning semiconductor substrates is to use jet scrubbers, which do not affect the elements formed on the semiconductor substrate and can perform efficient and high-speed cleaning. It has become. This is a small part of the nozzle tip (φ400μm
) A high-pressure pump is used to spray water pressurized to several degrees or crri for cleaning, and in order to obtain a good cleaning effect, the pores at the nozzle tip are made of zaphire, etc., which has excellent layer resistance. It was necessary to constantly jet a sharp ultra-high pressure water stream.
以下に従来の問題点を図面を用いて説明する。The conventional problems will be explained below with reference to the drawings.
第１図Ａにおいて、１はノズル、２は先端細孔部、３は
加圧ポンプ、４は超高圧水流、６Ｃ１半導体基板、６は
真空チャックテーブル、７は水の微粒子である。In FIG. 1A, 1 is a nozzle, 2 is a tip pore, 3 is a pressure pump, 4 is an ultra-high pressure water stream, 6C1 semiconductor substrate, 6 is a vacuum chuck table, and 7 is water particles.
半導体基板５を真空チャックテーブル６に固定回転させ
加圧ポンプ３によってノズル１の先端＋ｆ：（Ｉｔ孔部
２から超高圧水流４を噴射し、半導体基板５の洗浄を行
う。この時、先端細孔部２から噴射した超高圧水流４で
半導体基板６を洗浄中水の微粒子７が発生する。同図Ｂ
に示すように水の微粒子７のためノズル１に水滴８が付
着しノズル１の先端細孔部２におおいかぶさった状態と
なり、シャープな超高圧水流が得られず広がった状態の
］！Ｉ（射４が行なわれ洗浄能力が著しく低下する。又
、ノズル１に付着した水滴８、洗浄時、半導体基板５３
７−１、
の表面に滴下し、洗浄効果を損うことがあった。The semiconductor substrate 5 is fixed and rotated on a vacuum chuck table 6, and the tip of the nozzle 1 +f:(It) is sprayed from the hole 2 with an ultra-high pressure water stream 4 to clean the semiconductor substrate 5. At this time, the tip of the nozzle 1 is While cleaning the semiconductor substrate 6 with the ultra-high pressure water stream 4 jetted from the hole 2, water particles 7 are generated.
As shown in the figure, water droplets 8 adhere to the nozzle 1 due to the water particles 7, and the tip pores 2 of the nozzle 1 are covered with a large amount, making it impossible to obtain a sharp ultra-high-pressure water flow and causing the water droplets to spread]! In addition, the water droplets 8 adhering to the nozzle 1 and the semiconductor substrate 53 are removed during cleaning.
7-1, it could drip onto the surface of the , impairing the cleaning effect.
発明の目的
本発明は上記従来の問題点を解消すべく洗浄の際ノズル
に付着する水滴で超高圧水流が妨げられることなく良好
な洗浄を行なう洗浄装置を提供するものである。OBJECTS OF THE INVENTION In order to solve the above-mentioned conventional problems, the present invention provides a cleaning device that performs good cleaning without the ultra-high pressure water flow being obstructed by water droplets adhering to the nozzle during cleaning.
発明の構成
本発明は水流を開孔部より噴射するノズルの前記開口部
周辺に吸引孔を設けることを特徴とするものである。Structure of the Invention The present invention is characterized in that a suction hole is provided around the opening of a nozzle that sprays a water stream from the opening.
実施例の説明 本発明の実施例を図面を用いて説明する。Description of examples Embodiments of the present invention will be described using the drawings.
第２図Ａで１１はノズル、１２は先端細孔部、１３は吸
引孔、１４は真空発生装置、１６は加圧ポンプ、１６は
超高圧水流、１７は半導体基板、１８は真空チャックテ
ーブル、１９は水の微粒子である。In FIG. 2A, 11 is a nozzle, 12 is a tip pore, 13 is a suction hole, 14 is a vacuum generator, 16 is a pressure pump, 16 is an ultra-high pressure water stream, 17 is a semiconductor substrate, 18 is a vacuum chuck table, 19 is a water particle.
半導体基板１７を真空チャックテーブル１８に固定９回
転させ、加圧ポンプ１６によってノズル１１の先端細孔
部１２から超高圧水流１６を噴射し、半導体基板１７の
洗浄を行う。この時、先端細孔部１２から鳴゛射した超
高圧水流１６で半導体基板１７の洗浄中水の微粒子が発
生し、同図Ｂに示すとおり、ノズル１１に水滴２０が付
着する。The semiconductor substrate 17 is fixed to the vacuum chuck table 18 and rotated nine times, and the pressure pump 16 sprays an ultra-high pressure water stream 16 from the tip pore 12 of the nozzle 11 to clean the semiconductor substrate 17. At this time, fine particles of water are generated during cleaning of the semiconductor substrate 17 by the ultra-high pressure water stream 16 emitted from the tip pore 12, and water droplets 20 adhere to the nozzle 11 as shown in FIG.
しかし、ノズル先端細孔部１２周辺には真空発生装置１
４により真空吸引された吸引孔１３が設けられており、
そこから先端細孔部１２におおいかぶさろうとする水滴
２０を吸い上げ除去する。そうすることにより、ノズル
１１の先端細孔部１２から噴射される超高圧水流１６を
妨げることなく良好な洗浄を行なうことが可能となる。However, the vacuum generator 1 is located around the nozzle tip pore 12.
4 is provided with a suction hole 13 for vacuum suction,
From there, water droplets 20 that try to cover the tip pore 12 are sucked up and removed. By doing so, it becomes possible to perform good cleaning without interfering with the ultra-high pressure water stream 16 jetted from the tip pore portion 12 of the nozzle 11.
なお吸引孔１３は図に示すごとく多孔質状のものとする
のが望ましい〇
発明の効果
以上の説明より明らかなとおり、本発明の洗浄装置は洗
浄時に発生する水の微粒子に」：る水滴がノズルに付着
しそれが前記ノズルの先端細部にかかり超高王水流の噴
射を妨げることが無く、良好な洗浄が行なえると共にノ
ズルに付着した水滴が半導体基板表面に滴下することが
無い。It is preferable that the suction hole 13 is porous as shown in the figure.Effects of the InventionAs is clear from the above explanation, the cleaning device of the present invention has the advantage that the water droplets generated during cleaning are It does not adhere to the nozzle and impede the jetting of the ultra-high aqua regia flow, and water droplets adhering to the nozzle do not drip onto the surface of the semiconductor substrate.
５ １、−・5 1, -・
第１図（Ａ） 、 （Ｂ）はそれぞれ従来の洗浄装置の
概略構成図、ノズル部の植略図、第２図ｆＡ） 、 （
Ｂ）はそれぞれ本発明の一実施例の洗浄装置の概略構成
図。
ノズル部の概略図である。
１１・・・・・・ノズル、１２・・・・・・先細孔部、
１３・・・・・・吸引孔、１４・・・・・・真空発生装
置、１６・・・・・・超高圧水流、１７・・・・・・半
導体基板、１９・・・・・・水の微粒子、２０・・・・
・・水滴。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第五
図
（Ａ）
（Ｂ）Figures 1 (A) and (B) are a schematic diagram of a conventional cleaning device, a schematic diagram of a nozzle section, and Figure 2 fA), (
B) is a schematic configuration diagram of a cleaning device according to an embodiment of the present invention. It is a schematic diagram of a nozzle part. 11...Nozzle, 12...Tapered hole part,
13...Suction hole, 14...Vacuum generator, 16...Ultra high pressure water stream, 17...Semiconductor substrate, 19...Water fine particles, 20...
...Water drops. Name of agent: Patent attorney Toshio Nakao and one other person Figure 5 (A) (B)
Claims (2)
辺に吸引孔を設けることを特徴とする洗浄装置。(1) A cleaning device characterized in that a suction hole is provided around the opening of a nozzle that sprays water from the opening.
範囲第１項記載の洗浄装置。(2) The cleaning device according to claim 1, wherein the suction holes are porous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19921682A JPS5988828A (en) | 1982-11-12 | 1982-11-12 | Cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19921682A JPS5988828A (en) | 1982-11-12 | 1982-11-12 | Cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5988828A true JPS5988828A (en) | 1984-05-22 |
Family
ID=16404062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19921682A Pending JPS5988828A (en) | 1982-11-12 | 1982-11-12 | Cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988828A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6467916A (en) * | 1987-09-08 | 1989-03-14 | Tokyo Electron Ltd | Resist discharge nozzle |
| US5785068A (en) * | 1995-05-11 | 1998-07-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin cleaning apparatus |
| WO2001040562A1 (en) * | 1999-12-01 | 2001-06-07 | Rieter Perfojet | Device for treating sheet material with water jets under pressure |
| EP1610363A1 (en) * | 2003-04-01 | 2005-12-28 | Tokyo Electron Limited | Method of heat treatment and heat treatment apparatus |
-
1982
- 1982-11-12 JP JP19921682A patent/JPS5988828A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6467916A (en) * | 1987-09-08 | 1989-03-14 | Tokyo Electron Ltd | Resist discharge nozzle |
| US5785068A (en) * | 1995-05-11 | 1998-07-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin cleaning apparatus |
| WO2001040562A1 (en) * | 1999-12-01 | 2001-06-07 | Rieter Perfojet | Device for treating sheet material with water jets under pressure |
| FR2801909A1 (en) * | 1999-12-01 | 2001-06-08 | Icbt Perfojet Sa | DEVICE FOR THE TREATMENT OF SHEET MATERIALS USING PRESSURE WATER JETS |
| EP1610363A1 (en) * | 2003-04-01 | 2005-12-28 | Tokyo Electron Limited | Method of heat treatment and heat treatment apparatus |
| EP1610363A4 (en) * | 2003-04-01 | 2008-05-14 | Tokyo Electron Ltd | Method of heat treatment and heat treatment apparatus |
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