JPH05206316A - 誘電体基板上に銅パターンを設ける方法 - Google Patents

誘電体基板上に銅パターンを設ける方法

Info

Publication number
JPH05206316A
JPH05206316A JP18528192A JP18528192A JPH05206316A JP H05206316 A JPH05206316 A JP H05206316A JP 18528192 A JP18528192 A JP 18528192A JP 18528192 A JP18528192 A JP 18528192A JP H05206316 A JPH05206316 A JP H05206316A
Authority
JP
Japan
Prior art keywords
pattern
copper
metal
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18528192A
Other languages
English (en)
Japanese (ja)
Inventor
Der Putten Andreas M T P Van
マルチヌス セオドラス パウラス ファン デル プッテン アンドレアス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPH05206316A publication Critical patent/JPH05206316A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP18528192A 1991-07-16 1992-07-13 誘電体基板上に銅パターンを設ける方法 Pending JPH05206316A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP91201870 1991-07-16
NL91201870:2 1991-07-16

Publications (1)

Publication Number Publication Date
JPH05206316A true JPH05206316A (ja) 1993-08-13

Family

ID=8207788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18528192A Pending JPH05206316A (ja) 1991-07-16 1992-07-13 誘電体基板上に銅パターンを設ける方法

Country Status (3)

Country Link
US (1) US5246732A (https=)
EP (1) EP0523791A2 (https=)
JP (1) JPH05206316A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100476702B1 (ko) * 2000-12-28 2005-03-16 주식회사 하이닉스반도체 반도체 소자의 구리 배선 형성 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733468A (en) * 1996-08-27 1998-03-31 Conway, Jr.; John W. Pattern plating method for fabricating printed circuit boards
US6819540B2 (en) * 2001-11-26 2004-11-16 Shipley Company, L.L.C. Dielectric structure
CN100495665C (zh) * 2006-08-18 2009-06-03 日月光半导体制造股份有限公司 电路板制造方法
KR102949585B1 (ko) 2021-08-09 2026-04-07 삼성디스플레이 주식회사 표시 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3485665A (en) * 1967-08-22 1969-12-23 Western Electric Co Selective chemical deposition of thin-film interconnections and contacts
US4328080A (en) * 1980-10-24 1982-05-04 General Electric Company Method of making a catalytic electrode
JPS59152664A (ja) * 1983-02-21 1984-08-31 Hitachi Ltd 半導体装置
NL8701184A (nl) * 1987-05-18 1988-12-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
US4946709A (en) * 1988-07-18 1990-08-07 Mitsubishi Denki Kabushiki Kaisha Method for fabricating hybrid integrated circuit
JP2808616B2 (ja) * 1988-10-25 1998-10-08 セイコーエプソン株式会社 半導体装置の製造方法
NL8900305A (nl) * 1989-02-08 1990-09-03 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100476702B1 (ko) * 2000-12-28 2005-03-16 주식회사 하이닉스반도체 반도체 소자의 구리 배선 형성 방법

Also Published As

Publication number Publication date
EP0523791A3 (https=) 1994-03-16
EP0523791A2 (en) 1993-01-20
US5246732A (en) 1993-09-21

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