JPH0519962Y2 - - Google Patents
Info
- Publication number
- JPH0519962Y2 JPH0519962Y2 JP4108886U JP4108886U JPH0519962Y2 JP H0519962 Y2 JPH0519962 Y2 JP H0519962Y2 JP 4108886 U JP4108886 U JP 4108886U JP 4108886 U JP4108886 U JP 4108886U JP H0519962 Y2 JPH0519962 Y2 JP H0519962Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- flat semiconductor
- molybdenum
- semiconductor device
- alumina
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 15
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 11
- 229910052750 molybdenum Inorganic materials 0.000 claims description 11
- 239000011733 molybdenum Substances 0.000 claims description 11
- 230000008646 thermal stress Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4108886U JPH0519962Y2 (cs) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4108886U JPH0519962Y2 (cs) | 1986-03-20 | 1986-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154656U JPS62154656U (cs) | 1987-10-01 |
| JPH0519962Y2 true JPH0519962Y2 (cs) | 1993-05-25 |
Family
ID=30855765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4108886U Expired - Lifetime JPH0519962Y2 (cs) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519962Y2 (cs) |
-
1986
- 1986-03-20 JP JP4108886U patent/JPH0519962Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62154656U (cs) | 1987-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3566958A (en) | Heat sink for electrical devices | |
| US8536439B2 (en) | Thermoelectric device | |
| US8824144B2 (en) | Base for power module | |
| US7078109B2 (en) | Heat spreading thermal interface structure | |
| US3208877A (en) | Thermoelectric panels | |
| JP2007019203A (ja) | 放熱装置 | |
| US3826957A (en) | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods | |
| JP7117516B2 (ja) | リアクトル装置 | |
| US6340927B1 (en) | High thermal efficiency power resistor | |
| JPH0519962Y2 (cs) | ||
| JP4775932B2 (ja) | 伝熱用クッションおよびこれを備える熱電変換モジュール | |
| JP2010129806A (ja) | 電力用半導体装置および製造方法 | |
| JP2001068607A (ja) | 電子部品の冷却構造 | |
| JPH04256397A (ja) | ヒートパイプ式半導体スタック | |
| CN211828744U (zh) | 一种电子设备 | |
| JPS60171751A (ja) | Icの放熱構造 | |
| JP2009266983A (ja) | 放熱構造及び該放熱構造の製造方法並びに該放熱構造を用いた放熱装置 | |
| JPH08204241A (ja) | 熱電気変換装置 | |
| JP3583019B2 (ja) | 放熱配線基板の接合構造 | |
| JP2001267481A (ja) | 半導体装置 | |
| JP2004296764A (ja) | 平型半導体素子用スタック及びそれを用いた電力変換装置 | |
| JP4193633B2 (ja) | 半導体冷却ユニット | |
| CN213186960U (zh) | 一种电路板装配结构 | |
| JPS6076179A (ja) | 熱電変換装置 | |
| WO2019106874A1 (ja) | 絶縁基板及び放熱装置 |