JPH0519955Y2 - - Google Patents
Info
- Publication number
- JPH0519955Y2 JPH0519955Y2 JP13433386U JP13433386U JPH0519955Y2 JP H0519955 Y2 JPH0519955 Y2 JP H0519955Y2 JP 13433386 U JP13433386 U JP 13433386U JP 13433386 U JP13433386 U JP 13433386U JP H0519955 Y2 JPH0519955 Y2 JP H0519955Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- receiving roller
- receiving
- sealing body
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000007723 transport mechanism Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13433386U JPH0519955Y2 (en:Method) | 1985-11-19 | 1986-09-03 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25783285 | 1985-11-19 | ||
| JP13433386U JPH0519955Y2 (en:Method) | 1985-11-19 | 1986-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147342U JPS62147342U (en:Method) | 1987-09-17 |
| JPH0519955Y2 true JPH0519955Y2 (en:Method) | 1993-05-25 |
Family
ID=31189735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13433386U Expired - Lifetime JPH0519955Y2 (en:Method) | 1985-11-19 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519955Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2550209Y2 (ja) * | 1992-06-24 | 1997-10-08 | 東芝硝子株式会社 | ホーニング装置 |
-
1986
- 1986-09-03 JP JP13433386U patent/JPH0519955Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62147342U (en:Method) | 1987-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3982627A (en) | Automatic wafer orienting apparatus | |
| JP2001050660A5 (en:Method) | ||
| CA2398928A1 (en) | Method and apparatus for locating and conveying sheet-like body | |
| JPH0519955Y2 (en:Method) | ||
| JP2003266560A (ja) | スパウト又はスパウト付き袋の供給装置 | |
| CN114451078B (zh) | 带馈送器以及盖带的剥离方法 | |
| KR100625648B1 (ko) | 캐리어 테이프의 실링 장치 | |
| JPH0248165U (en:Method) | ||
| JPH0484968A (ja) | 注射針製造方法およびそれに用いる装置 | |
| US4384907A (en) | Apparatus, method, and retrofit kit for applying a bonding agent to a cup | |
| JP3224206B2 (ja) | チップ部品搬送用ベルト及びその製造方法 | |
| JP3725226B2 (ja) | ウォータジェット樹脂バリ取り装置 | |
| JPS59228973A (ja) | 容器のコ−デイング装置 | |
| CA1120506A (en) | Slide fastener conveyor with revolving track section | |
| JP2616071B2 (ja) | 缶胴塗装方法 | |
| JP2638234B2 (ja) | 缶胴の底部塗装装置 | |
| JPH0739512Y2 (ja) | 回転式有核錠剤製造機における核錠整列付勢装置 | |
| CN116922791B (zh) | 一种穿刺针气动粘接设备 | |
| JPH0625999Y2 (ja) | 電子部品供給装置 | |
| JP3467976B2 (ja) | 樹脂バリ除去装置 | |
| CN211566082U (zh) | 一种高精度冲孔裁切装置的送料装置 | |
| JP3625537B2 (ja) | 缶胴体の搬送装置 | |
| JP4643986B2 (ja) | フラックス塗布方法 | |
| JPH0346860Y2 (en:Method) | ||
| JP4339735B2 (ja) | 電子部品の実装装置 |