JPH05198701A - Package for semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a package with high heat-dissipation effect by arranging a metal base via adhesive in the lower part of a die pad and lead. CONSTITUTION:A die pad 4 fitted with a semiconductor device 1 is mounted on a metal base 11 via adhesive 12 and the top face of the pad is sealed by sealing resin 5. Also, the electrode and lead 3 of the semiconductor device 1 are bonded electrically and mechanically by a small-gage metal wire 2. Further, the rear face of the metal base 11 is provided with an insulating layer 13 to play the role of preventing the short of a substrate circuit when the bottom face of a package is mounted on a substrate but mounting of the insulating layer can be done freely. Moreover, the metal base 11 improved in the adhesion to the sealing resin 5 by provision of irregularity 14 in the top face is sealed by the resin 5 while a space is given to such a degree that it does not adhere to the die pad 4 and lead 3. When the metal base 11 is arranged in this manner, it is possible to heighten a heat dissipation effect.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for mounting a semiconductor device.

[0002]

2. Description of the Related Art FIG. 6 is a sectional view showing a conventional semiconductor device package. In the figure, 1 is a semiconductor element, 2 is a fine metal wire, 3 is a lead portion, 4 is a die pad portion, and 5 is a sealing resin. Is.

Next, the operation will be described. The semiconductor element 1 is joined to the die pad portion 4, and the electrode on the surface of the semiconductor element 1 and the lead portion 3 are electrically and mechanically connected by the thin metal wire 2. Finally, the semiconductor element 1 is sealed with a sealing resin 5 for protection.

[0004]

Since the conventional semiconductor device package is sealed with resin, there is a problem in that it is inefficient in radiating the heat generated by the semiconductor element.

The present invention has been made to solve the above problems, and an object thereof is to provide a package having an excellent heat dissipation effect.

[0006]

A semiconductor device package according to the present invention has a metal base provided on the bottom surface of the package.

[0007]

The semiconductor device package according to the present invention comprises:
The heat radiation effect of the heat generated by the semiconductor element via the metal base is enhanced.

[0008]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, the same parts as those in the prior art are designated by the same reference numerals. Reference numeral 11 is a metal base, 12 is an adhesive, and 13 is an insulating layer. The insulating layer 13 may be omitted if necessary.

Next, the operation will be described. Semiconductor element 1
The die pad portion 4 to which is attached is attached to the metal base 11 via the adhesive 12, and the upper surface thereof is sealed with the sealing resin 5. Further, the electrode of the semiconductor element 1 and the lead portion 3 are electrically and mechanically joined by a thin metal wire 2. Further, an insulating layer 13 is provided on the back surface of the metal base 11, and the bottom surface of the package has a role of preventing a short circuit of the board circuit when mounting on the board, but the mounting is free. By disposing the metal base 11 as described above, the heat dissipation effect can be enhanced.

Embodiment 2. A semiconductor device package according to the second embodiment will be described with reference to FIG. After the semiconductor element 1 is directly bonded to the metal base 11, it is sealed with the resin 5.

Embodiment 3. A semiconductor device package according to the third embodiment will be described with reference to FIG. A metal base 11 in which unevenness 14 is provided on the upper surface to improve adhesion with the sealing resin 5.
Are sealed with a resin 5 with a space such that they are not bonded to the die pad portion 4 and the lead portion 3.

Embodiment 4. A semiconductor device package according to the fourth embodiment will be described with reference to FIG. In the first embodiment, the die pad portion 4 and the lead portion 3 have the same height, but the die pad portion 4 is lowered downward by one step to make the wiring of the metal thin wires 2 easier. Therefore, the die pad portion 4
A depression 11a is provided on the upper surface of the metal base 11 in correspondence with the amount of downward movement of the metal base 11.

Embodiment 5. A semiconductor device package according to the fifth embodiment will be described with reference to FIG. The metal cap 15 is joined to the lead portion 3 via the adhesive 12 and sealed in a hollow state.

[0014]

As described above, according to the present invention, by providing the metal base on the lower surface of the semiconductor element, a package having a high heat dissipation effect can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor device package according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a semiconductor device package according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a semiconductor device package according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a semiconductor device package according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a semiconductor device package according to a fifth embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a conventional semiconductor device package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Metal thin wire 3 Lead part 4 Dice pad part 5 Sealing resin 11 Metal base 12 Adhesive 13 Insulating layer 14 Unevenness provided on the surface of metal base

Claims (6)

[Claims] 1. A semiconductor device package in which a semiconductor element is mounted on a die pad, the lead portion and the semiconductor element are joined by a fine metal wire, and the entire device is sealed with a resin. And a package for a semiconductor device in which a metal base is arranged below the lead portion via an adhesive. 2. A semiconductor element is directly mounted on a metal base, and a lead portion is placed on the outside thereof with an adhesive, the semiconductor element and the lead portion are joined with a metal thin wire, and the entire device is sealed with resin. A semiconductor device package characterized by being stopped. 3. A semiconductor device package in which a semiconductor element is mounted on a die pad portion, the lead portion and the semiconductor element are joined by a fine metal wire, and the entire device is sealed with a resin. A package for a semiconductor device, characterized in that a metal base having unevenness on the upper surface is attached to the lower part of the lead portion with a space therebetween. 4. The package for a semiconductor device according to claim 1, wherein the disposition of the die pad portion is lowered by one step below the lead portion, and a recess is provided in the metal base portion facing the die pad portion. 5. A metal base is disposed below the die pad and the lead via an adhesive agent, and a metal cap is placed above the lead via the adhesive agent to seal in a hollow state. Package for semiconductor device. 6. The package for a semiconductor device according to claim 1, wherein an insulating layer is provided below the metal base.