JPH05190762A - Microwave integrated circuit device - Google Patents

Abstract

PURPOSE:To readjust individual circuit constituent elements from the outside by a method wherein the individual circuit constituent elements which are not required to be sealed hermetically are arranged on the side of one face on a body base substrate. CONSTITUTION:Individual circuit constituent elements which are not required always to be sealed hermetically, in this case an input-side circuit pattern 12, circuit patterns 13 for matching use, an output-side circuit pattern 14 and the like, are arranged directly on the side of one face on a body base substrate 11. A semiconductor element 15 for matching use is set to a state that it is mounted in the circuit patterns 13 for matching use; the individual circuit constituent elements are kept exposed so that they can be adjusted form the outside by taking into consideration that they are readjusted from the outside after a device has been assembled. The individual circuit constituent elements which are required to be sealed hermetically, in this case only semiconductor chips 16 as active elements, are arranged on the side of the other face; they are sealed hermetically and sealed by using a sealing cover 18. Consequently, the individual circuit constituent elements can be readjusted from the outside after the device has been assembled, components can be replaced, and other circuit constituent elements can be added.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave integrated circuit device, and more particularly to improvement of a sealing structure in a microwave integrated circuit device.

[0002]

2. Description of the Related Art As a general microwave integrated circuit device of this type according to the prior art, in this case, for example, Japanese Patent Laid-Open No.
An apparatus configuration disclosed in Japanese Patent No. 163804 is shown in FIG.

In the structure of the conventional microwave integrated circuit device shown in FIG. 3, reference numeral 31 is a main body base substrate as a device substrate, and 32 is a carrier provided on the base substrate 31. Further, 33 is an input side circuit board mounted on one side of the surface of the carrier 32 to form an input circuit pattern 34, and 35 is similarly mounted on the other side of the surface of the carrier 32 and is an output circuit. Reference numeral 37 denotes an output side circuit board on which a pattern 36 is formed, and 37 denotes a semiconductor chip as an active element mounted on the surface of the carrier 32 between the input side and output side circuit boards 33, 35. ，
A connection wire 38 is connected to each of the output patterns 34 and 36. Further, 39 and 40 penetrate the front and back of the main body base substrate 31, and seal the penetrating portion to be taken out to the back surface side.
The input and output side terminals connected to the output circuit patterns 34 and 36 by connection wires 38,
Reference numeral 41 denotes a sealing cover which covers all of the above-mentioned circuit components and which is sealed on the front surface side of the main body base substrate 31 to cover them.

However, in the case of the conventional microwave integrated circuit device having the above-mentioned configuration, the radio wave input from the input side terminal 39 has the input circuit pattern 34 on the input side circuit board 33.
After reaching the semiconductor chip 37 which is an active element and various operations are performed by the semiconductor chip 37,
It propagates through the output circuit pattern 36 on the output side circuit board 35 and is output from the output side terminal 40.

[0005]

In the conventional microwave integrated circuit device configured as described above, the output circuit pattern 36 is used for matching in order to absorb variations in element characteristics of the semiconductor chip 37 as an active element. The chip surface is easily corroded when exposed to the outside air, and so-called EMI countermeasures are required. Therefore, it is necessary to hermetically seal the chip surface from the outside.

Therefore, when assembling the apparatus configuration,
The circuit characteristics of the entire device are adjusted by forming the matching circuit pattern, arranging a matching semiconductor element separately, or exchanging these, and then sealing and sealing by the sealing cover 41. Although it is stopped and shielded from the outside air, once it is sealed in this way, it is completely impossible to adjust even if the device characteristics change, and a new circuit component is added. There was an unfavorable problem that it could not be done.

The present invention has been made in order to solve such a conventional problem, and an object thereof is to keep the circuit itself even after the device structure is sealed by a sealing cover. It is an object of the present invention to provide a microwave integrated circuit device of this kind which can be repaired or replaced or a new circuit component can be added.

[0008]

In order to achieve the above-mentioned object, a microwave integrated circuit device according to the present invention is provided with each circuit that does not require sealing on one surface side of a main body base substrate as a device substrate. The components are arranged directly or via another circuit base substrate, and each circuit component requiring sealing only on the other surface side, in this case, the semiconductor chip which is an active element is arranged. In addition, the outside is hermetically sealed, and the corresponding circuit components of the both are connected through the through hole of the main body base substrate.

That is, according to the present invention, an input side circuit pattern, a matching circuit pattern including a matching semiconductor element, and an output side that do not necessarily need to be sealed are provided on one surface side of a main body base substrate as a device substrate. Each circuit component such as a circuit pattern is arranged, and, on the other surface side of the main body base substrate, each circuit component such as a semiconductor chip as an active element requiring sealing is arranged, This is hermetically sealed by a sealing cover, and the corresponding respective circuit components of the former and respective circuit components of the latter are connected through through holes of the main body base substrate. And a microwave integrated circuit device.

Further, according to the present invention, in the configuration of the microwave integrated circuit device, each of the input side circuit pattern, the matching circuit pattern including a matching semiconductor element, and the output side circuit pattern, which are not necessarily sealed, is used. After arranging the circuit component on another circuit base substrate, the circuit base substrate is mounted on one surface side of the base substrate, and each circuit component of the former and each of the latter. It is characterized in that the respective corresponding circuit components are connected to each other through the through hole of the main body base substrate and the circuit base substrate.

[0011]

Therefore, in the present invention, since each circuit component which does not necessarily need to be sealed is arranged on one surface side of the main body base substrate, readjustment, replacement,
Also, it becomes possible to add other circuit components,
Further, since only the circuit components that need to be sealed are arranged on the other surface side and sealed and sealed by the sealing cover, it is possible to take corrosion prevention and EMI countermeasures.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, another embodiment of the microwave integrated circuit device according to the present invention will be described in detail with reference to FIGS.

FIG. 1 is a sectional view schematically showing a schematic structure of a microwave integrated circuit device to which a first embodiment of the present invention is applied.

In the structure of the first embodiment shown in FIG. 1, the microwave integrated circuit device of this embodiment does not necessarily need to be sealed on one surface side of the main body base substrate 11 as a device substrate. Each circuit member as a circuit component not to be formed, that is, in this case, the input side circuit pattern 12, the matching circuit pattern 13, the output side circuit pattern 14, etc. are formed in the respective matching circuit pattern 13. A matching semiconductor element 15 is mounted as required. Further, on the other surface side, each circuit member as a circuit component that needs to be sealed, that is, each semiconductor chip 16 as an active element is mounted, and the input side circuit pattern 12 and the matching The circuit pattern 13 for output, the circuit pattern 14 on the output side, etc. are electrically connected to each other through the through holes 17, and the semiconductor chips 16 are isolated by the sealing cover 18 in order to shield them from the outside air. It is hermetically sealed.

That is, in the case of the device configuration according to the first embodiment, each circuit component which does not necessarily need to be sealed on one surface side of the main body base substrate 11 as the device substrate, Input side circuit pattern 12,
Matching circuit pattern 13 and output side circuit pattern 1
4 and the like are directly arranged, and if necessary, the matching semiconductor element 15 is provided in the matching circuit pattern 13.
In consideration of the readjustment from the outside after the device is assembled, each of these circuit components is left exposed so that it can be adjusted from the outside, and the other On the surface side, each circuit component requiring sealing, in this case, only the semiconductor chip 16 as an active element is arranged, and the sealing cover 18 is provided.
It is sealed and sealed by.

However, even in the case of the microwave integrated circuit device of the first embodiment having the above structure, the radio wave input to the input end of the input side circuit pattern 12 provided on the one surface side of the base substrate 11 is After propagating through the input side circuit pattern 12, through the through hole 17 to the semiconductor chip 16 which is an active element mounted on the other surface side, after various operations are performed, once through another through hole 17. A matching circuit pattern 13 provided on one surface side,
And, if necessary, matching is performed by each of the matching semiconductor elements 15 mounted in the matching circuit pattern 13, and again, another active element mounted on the other surface side through another through hole 17 again. The semiconductor chip 16 which is an element is reached, and the same operation is performed here, and after such an operation is sequentially repeated, finally, the output side circuit pattern 14 provided on one surface side. Is propagated and is output from the output terminal.

Therefore, in the device configuration of the first embodiment,
On one surface side of the main body base substrate 11 as the device substrate,
Input side circuit pattern 12, which does not necessarily require sealing,
A matching circuit pattern 13 including a matching semiconductor element 15,
Since the circuit components such as the output side circuit pattern 14 are directly arranged and exposed, the circuit components can be readjusted or partially replaced from the outside after the device is assembled. In addition, another circuit component can be newly added, and only each circuit component such as the semiconductor chip 16 as an active element requiring sealing is provided on the other surface side. Since it is arranged and sealed by the sealing cover 18, it is possible to take corrosion prevention, EMI countermeasures, etc. by shutting off from the outside by this sealing.

Next, FIG. 2 is a sectional view schematically showing a schematic structure of a microwave integrated circuit device to which the second embodiment of the present invention is applied.

In the device configuration of the second embodiment, a second circuit base substrate 21 is prepared in addition to the main body base substrate 11 as the device substrate, and the former circuit board 21 is provided on the former base substrate 11. In the same manner as in the above case, the semiconductor chip 1 on the other surface side as an active element that requires sealing
6 is mounted, and this is sealed with a sealing cover 18,
The input side circuit pattern 1 which is sealed and is on the second circuit base substrate 21 on the latter side, which is on the side corresponding to the one side and does not necessarily need to be sealed as described above.
2, matching circuit pattern 1 including matching semiconductor element 15
3, and each circuit component such as the output side circuit pattern 14 is provided on each of the former main body base substrate 11 and the latter second circuit base substrate 22 on the other face. The corresponding surface corresponding sides are mounted in contact with each other, and the corresponding circuit components of both are electrically connected through the through holes 17 of the respective base substrates 11 and 21.

Therefore, in the microwave integrated circuit device according to the second embodiment configured as described above, the same operation and effect as in the case of the device configuration according to the first embodiment can be obtained. In the case of the example configuration, in addition to effects such as readjustment and partial replacement of each circuit component from the outside after assembly of the device and addition of a new circuit component, the entire second circuit base board 22 is added. Exchange is possible.

[0021]

As described above in detail with reference to the embodiments,
According to the present invention, each circuit component that does not necessarily need to be sealed is arranged directly on one surface side of the main body base substrate as the device substrate, or via another circuit base substrate. After the assembly of the device, readjustment, partial replacement of each relevant circuit component from the outside,
Alternatively, it has the advantage that it can be easily replaced as a whole and that new circuit components can be easily added, and each circuit that requires sealing on the other side. Since only the constituent elements are arranged and sealed by the sealing cover, the circuit is cut off from the outside to effectively prevent corrosion of the corresponding circuit constituent elements and EMI countermeasures. It has excellent features such as being able to take classes.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a schematic configuration of a microwave integrated circuit device to which a first embodiment of the present invention is applied.

FIG. 2 is a sectional view schematically showing a schematic configuration of a microwave integrated circuit device to which a second embodiment of the present invention is applied.

FIG. 3 is a sectional view schematically showing a general configuration of a general microwave integrated circuit device according to a conventional example.

[Explanation of symbols]

 11 Main Body Base Board as Device Board 12 Input Circuit Pattern 13 Matching Circuit Pattern 14 Output Circuit Pattern 15 Matching Semiconductor Element 16 Semiconductor Chip as Active Element 17 Through Hole 18 Sealing Cover 21 Second Circuit Base Board

Claims (2)

[Claims] 1. An input side circuit pattern, a matching circuit pattern including a matching semiconductor element, and an output side circuit pattern which are not necessarily sealed to one surface side of a main body base substrate as a device substrate. Each circuit component is arranged, and on the other surface side of the main body base substrate, each circuit component such as a semiconductor chip as an active element requiring sealing is arranged and sealed. The microwave is characterized in that the circuit is hermetically sealed by a cover, and the corresponding circuit components of the former and circuit components of the latter are connected to each other through through holes in the main body base substrate. Integrated circuit device. 2. The circuit components such as the input side circuit pattern, the matching circuit pattern including a matching semiconductor element, and the output side circuit pattern, which are not necessarily sealed, are arranged on another circuit base substrate. In the above, the circuit base substrate is mounted on one surface side of the base substrate, and the main circuit board is connected between the corresponding circuit components of the former and circuit components of the latter. 2. The microwave integrated circuit device according to claim 1, wherein the microwave integrated circuit device is connected through through holes of the substrate and the circuit base substrate.