JPH0518372B2 - - Google Patents
Info
- Publication number
- JPH0518372B2 JPH0518372B2 JP61164207A JP16420786A JPH0518372B2 JP H0518372 B2 JPH0518372 B2 JP H0518372B2 JP 61164207 A JP61164207 A JP 61164207A JP 16420786 A JP16420786 A JP 16420786A JP H0518372 B2 JPH0518372 B2 JP H0518372B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- inspection
- standard
- inspected
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 108
- 238000012937 correction Methods 0.000 claims description 80
- 238000000034 method Methods 0.000 claims description 44
- 230000015654 memory Effects 0.000 claims description 34
- 230000007547 defect Effects 0.000 claims description 26
- 238000003384 imaging method Methods 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 description 18
- 238000012545 processing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164207A JPS6319541A (ja) | 1986-07-11 | 1986-07-11 | パタ−ン検査方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164207A JPS6319541A (ja) | 1986-07-11 | 1986-07-11 | パタ−ン検査方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6319541A JPS6319541A (ja) | 1988-01-27 |
| JPH0518372B2 true JPH0518372B2 (fr) | 1993-03-11 |
Family
ID=15788700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61164207A Granted JPS6319541A (ja) | 1986-07-11 | 1986-07-11 | パタ−ン検査方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6319541A (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2682073B2 (ja) * | 1988-10-31 | 1997-11-26 | 松下電器産業株式会社 | 厚膜印刷パターンの外観検査装置 |
| JP2007214388A (ja) * | 2006-02-09 | 2007-08-23 | Shimadzu Corp | 結晶化装置、および位置決めステージ |
| JP5162854B2 (ja) * | 2006-07-18 | 2013-03-13 | 富士電機株式会社 | 半導体装置の製造方法 |
| JP2009047458A (ja) * | 2007-08-14 | 2009-03-05 | Toray Ind Inc | 回路パターン検査装置および検査方法 |
| JP2009092954A (ja) * | 2007-10-09 | 2009-04-30 | Toshiba Corp | パターン評価方法 |
| JP2015059875A (ja) * | 2013-09-20 | 2015-03-30 | 日置電機株式会社 | 検査結果表示データ生成装置、検査結果表示装置、基板検査システムおよび検査結果表示データ生成方法 |
-
1986
- 1986-07-11 JP JP61164207A patent/JPS6319541A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6319541A (ja) | 1988-01-27 |
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