JPH05182514A - Conductive paste composition - Google Patents
Conductive paste compositionInfo
- Publication number
- JPH05182514A JPH05182514A JP35879991A JP35879991A JPH05182514A JP H05182514 A JPH05182514 A JP H05182514A JP 35879991 A JP35879991 A JP 35879991A JP 35879991 A JP35879991 A JP 35879991A JP H05182514 A JPH05182514 A JP H05182514A
- Authority
- JP
- Japan
- Prior art keywords
- side electrode
- layer side
- conductive paste
- concentration
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Ceramic Products (AREA)
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、導電ペースト組成物
に関し、詳しくは、ガラスフリットを含有する下層側電
極上に塗布、焼付けされて、半田濡れ性に優れた上層側
電極を形成する導電ペースト組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste composition, and more specifically, to a conductive paste which is applied and baked on a lower electrode containing glass frit to form an upper electrode having excellent solder wettability. It relates to a composition.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】例え
ば、セラミック電子部品素体上に電極（厚膜電極）を配
設してチップ型積層セラミックコンデンサなどのセラミ
ック電子部品を製造する場合、電極の半田濡れ性を向上
させるために、厚膜電極（同一組成で２層にすることも
ある）を下層側電極として、その上に、異なる組成を有
する上層側電極を形成する場合がある。2. Description of the Related Art For example, when a ceramic electronic component such as a chip type multilayer ceramic capacitor is manufactured by arranging an electrode (thick film electrode) on a ceramic electronic component element body, In order to improve the solder wettability, a thick film electrode (there may be two layers having the same composition) is used as a lower layer side electrode, and an upper layer side electrode having a different composition may be formed thereon.
【０００３】そして、例えば、チップ型積層セラミック
コンデンサの場合、半田耐熱性を向上させるために、下
層側電極として固形分比で（すなわち、ＡｇとＰｄの合
量に対して）１０〜３０重量％のＰｄを含むＡｇペース
ト（ガラスフリットを含有する）を塗布、焼付けすると
ともに、半田濡れ性を向上させるために、上層側電極と
してＡｇペーストを焼付けすることにより電極を形成す
る技術が、特開昭５７−１４８３３１号公報、特開昭５
７−１４８３３３号公報に開示されている。For example, in the case of a chip type monolithic ceramic capacitor, in order to improve soldering heat resistance, the lower layer side electrode has a solid content ratio (that is, relative to the total amount of Ag and Pd) of 10 to 30% by weight. In order to improve solder wettability, an Ag paste containing Pd (including glass frit) is applied and baked, and an electrode is formed by baking the Ag paste as an upper-layer side electrode. 57-148331, JP-A-5
No. 7-148333.
【０００４】しかし、上記従来の技術により形成された
電極においては、単に、下層側電極としてＡｇ−Ｐｄペ
ーストを塗布、焼付けした後、その上にＡｇペーストを
塗布、焼付けしているので、焼成中に下層側電極と上層
側電極との間のＰｄ濃度差により、両者の間でガラス、
Ａｇ、Ｐｄの相互拡散が生じ、下層側電極においては上
層側電極から拡散したＡｇにより焼結が促進され、下層
側電極中に含まれるガラスフリットが上層側電極の表面
にまで移動する（図３参照）。However, in the electrode formed by the above-mentioned conventional technique, since the Ag-Pd paste is simply applied and baked as the lower layer side electrode, the Ag paste is applied and baked on it, so that the baking is performed. In addition, due to the difference in Pd concentration between the lower layer side electrode and the upper layer side electrode, glass
Mutual diffusion of Ag and Pd occurs, and in the lower layer side electrode, sintering diffused by Ag diffused from the upper layer side electrode moves the glass frit contained in the lower layer side electrode to the surface of the upper layer side electrode (FIG. 3). reference).
【０００５】その結果、半田濡れ性に優れた材料からな
る銀ペーストなどの導電ペーストを用いて上層側電極を
形成しても、下層側電極中のガラス成分が溶出して上層
側電極表面のガラス成分量を増加させるため、上層側電
極の半田濡れ性が低下し、実装工程における半田付けの
信頼性が低下するという問題点がある。As a result, even when the upper layer side electrode is formed by using a conductive paste such as a silver paste made of a material having excellent solder wettability, the glass component in the lower layer side electrode is eluted and the glass on the surface of the upper layer side electrode is eluted. Since the amount of the component is increased, the solder wettability of the upper layer side electrode is deteriorated, and the reliability of soldering in the mounting process is deteriorated.
【０００６】この発明は、上記問題点を解決するもので
あり、ガラスフリットを含有する下層側電極上に塗布、
焼付けすることにより、電極の半田濡れ性を向上させる
ことが可能な導電ペースト組成物を提供することを目的
とする。The present invention solves the above-mentioned problems by applying it on the lower layer side electrode containing glass frit,
An object of the present invention is to provide a conductive paste composition capable of improving the solder wettability of electrodes by baking.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、発明者は種々の実験、検討を行い、Ｐｄを（例えば
５重量％）含有する導電ペースト組成物を、ガラスフリ
ットを含有するＡｇ−Ｐｄ系の下層側電極上に塗布、焼
付けした場合、下層側電極及び上層側電極のＰｄの濃度
分布が、図１に示すようにステップ状になることを知っ
た。このように、下層側電極と上層側電極においてＰｄ
の濃度差が保持されているということは、下層側電極と
上層側電極との間の相互拡散が抑制され、下層側電極か
ら上層側電極へのガラス成分の移動量も少ないことを意
味しており、上層側電極表面のガラス成分量が減少する
結果、上層側電極の半田濡れ性が向上する。発明者は上
記現象を見出し、さらに種々の実験、検討を行ってこの
発明を完成した。In order to achieve the above-mentioned object, the inventor has conducted various experiments and examinations, and conducted a conductive paste composition containing Pd (for example, 5% by weight) with Ag containing glass frit. It was found that the Pd concentration distribution of the lower layer side electrode and the upper layer side electrode becomes stepwise as shown in FIG. 1 when coated and baked on the Pd type lower layer side electrode. In this way, Pd in the lower layer side electrode and the upper layer side electrode
The fact that the concentration difference is maintained means that mutual diffusion between the lower layer side electrode and the upper layer side electrode is suppressed, and the amount of glass component transferred from the lower layer side electrode to the upper layer side electrode is small. As a result, the amount of glass component on the surface of the upper layer side electrode is reduced, and as a result, the solder wettability of the upper layer side electrode is improved. The inventor found the above phenomenon, and further conducted various experiments and studies to complete the present invention.
【０００８】すなわち、この発明の導電ペースト組成物
は、ガラスフリットを含有し、ＡｇとＰｄの合量中のＰ
ｄ濃度が５〜３０重量％のＡｇ−Ｐｄ系の下層側電極上
に塗布されて半田濡れ性に優れた上層側電極を形成する
導電ペースト組成物であって、主成分であるＡｇと、該
Ａｇとの合量中の濃度が前記下層側電極の前記Ｐｄ濃度
の２５〜７５％の範囲にあるＰｄと、有機ビヒクルとを
含有し、ガラスフリットを含有しないことを特徴として
いる。That is, the conductive paste composition of the present invention contains glass frit and contains P in the total amount of Ag and Pd.
A conductive paste composition for forming an upper layer side electrode having an excellent solder wettability by being applied onto an Ag-Pd type lower layer side electrode having a d concentration of 5 to 30% by weight, the main component being Ag; It is characterized by containing Pd whose concentration in the total amount with Ag is in the range of 25 to 75% of the Pd concentration of the lower layer side electrode, an organic vehicle, and not containing glass frit.
【０００９】[0009]
【作用】ガラスフリットを含有するＡｇ−Ｐｄ系の下層
側電極上に、Ａｇと、下層側電極中のＰｄ濃度の２５〜
７５％の濃度のＰｄと、有機ビヒクルとを含有し、ガラ
スフリットを含有しない導電ペースト組成物を塗布した
場合、下層側電極と上層側電極との間のガラス、Ａｇ、
Ｐｄなどの相互拡散が抑制され、上層側電極表面のガラ
ス成分量の増大を防止して半田濡れ性を向上させること
ができる。On the lower electrode of the Ag-Pd system containing the glass frit, Ag and the Pd concentration in the lower electrode of 25 to
When a conductive paste composition containing 75% concentration of Pd and an organic vehicle and containing no glass frit is applied, glass between the lower layer side electrode and the upper layer side electrode, Ag,
Mutual diffusion of Pd and the like is suppressed, and it is possible to prevent an increase in the amount of glass components on the surface of the upper layer side electrode and improve solder wettability.
【００１０】[0010]
【実施例】以下、この発明の実施例を比較例とともに示
してその特徴をさらに詳しく説明する。EXAMPLES Hereinafter, examples of the present invention will be shown together with comparative examples to further explain the features thereof.
【００１１】ＭｇＴｉＯ3−ＣａＴｉＯ3系セラミック板
上に、Ａｇ粉末９０重量部、Ｐｄ粉末１０重量部、ガラ
スフリット３重量部を配合し、これに有機ビヒクルを適
量（例えば、導電ペースト組成物全量に対して１０〜３
０重量％）添加したＡｇ−Ｐｄペーストをスクリーン印
刷法により直径１０mmの円形状に塗布し、これを８５０
℃で焼成して下層側電極を形成した。なお、ガラスフリ
ットは、ＰｂＯ（４０重量％），Ｂｉ2Ｏ3（２０重量
％），ＳｉＯ2（２０重量％），Ｂ2Ｏ3（２０重量％）
からなるガラスを平均粒径５μmに粉砕したものであ
る。90 parts by weight of Ag powder, 10 parts by weight of Pd powder, and 3 parts by weight of glass frit were mixed on a MgTiO 3 -CaTiO 3 system ceramic plate, and an appropriate amount of organic vehicle (for example, the total amount of the conductive paste composition was added thereto). To 10 to 3
0 wt%) added Ag-Pd paste was applied to a circular shape with a diameter of 10 mm by a screen printing method, and this was applied to 850
The lower layer side electrode was formed by firing at ℃. The glass frit is composed of PbO (40% by weight), Bi 2 O 3 (20% by weight), SiO 2 (20% by weight), B 2 O 3 (20% by weight).
It is a glass obtained by crushing glass having an average particle diameter of 5 μm.
【００１２】そして、上記のように形成した下層側電極
上に、主成分であるＡｇと、前記下層側電極中のＰｄ濃
度（Ｐｄ／（Ａｇ＋Ｐｄ））に対して、表１に示すよう
な割合のＰｄ（例えば、表１のＰｄの割合が５０％の場
合、Ｐｄ濃度は１０×０．５＝５重量％となる。）と、
エチルセルロースをα−テレピネオールで溶解した有機
ビヒクルの適量（例えば、導電ペースト組成物全量に対
して１０〜３０重量％）とを含有するＡｇペーストを塗
布し、８００℃で焼成することにより上層側電極を形成
した。Then, on the lower layer side electrode formed as described above, with respect to Ag as a main component and the Pd concentration (Pd / (Ag + Pd)) in the lower layer side electrode, the ratio as shown in Table 1 is obtained. Pd (for example, when the ratio of Pd in Table 1 is 50%, the Pd concentration is 10 × 0.5 = 5% by weight).
An Ag paste containing an appropriate amount of an organic vehicle obtained by dissolving ethyl cellulose with α-terpineol (for example, 10 to 30% by weight based on the total amount of the conductive paste composition) is applied, and the upper electrode is baked by firing at 800 ° C. Formed.
【００１３】[0013]
【表１】 [Table 1]
【００１４】表１において、実験番号に＊印を付したも
のは、この発明の範囲外の比較例についてのデータを示
している。In Table 1, the experimental numbers marked with * indicate data for comparative examples outside the scope of the present invention.
【００１５】この発明の実施例及び比較例の導電ペース
ト組成物を用いて形成した上記試料の半田濡れ性を調べ
た。その結果を表１に示す。The solder wettability of the above samples formed by using the conductive paste compositions of the examples and comparative examples of the present invention was examined. The results are shown in Table 1.
【００１６】なお、表１における「半田濡れ性」は、Ｊ
ＩＳ Ｈ６２Ａｇ２Ａ（Ｓｎ６２％，Ｐｂ３６％，Ａｇ
２％）の半田を用いた２３０℃の半田浴に、Ｒタイプ
（ロジン系，無ハロゲン）フラックスを付着させて２秒
間浸漬した後の半田付着面積を測定することにより評価
した。すなわち、図２に示すように、上層側電極１の全
面積に対して、半田が付着した部分２の面積が９０％以
上の場合には良好（○）、７０〜９０％の場合には普通
（△）、７０％以下の場合には不可（×）と評価した。The "solder wettability" in Table 1 is J
IS H62Ag2A (Sn62%, Pb36%, Ag
(2%) solder was used to deposit an R type (rosin-based, halogen-free) flux in a solder bath at 230 ° C., and the solder adhesion area after dipping for 2 seconds was measured to evaluate. That is, as shown in FIG. 2, good (∘) when the area of the solder-attached portion 2 is 90% or more of the total area of the upper-layer-side electrode 1, and is normal when 70-90%. (△), when it was 70% or less, it was evaluated as impossible (x).
【００１７】表１に示すように、上層側電極用の導電ペ
ースト組成物のＰｄ濃度が、下層側電極のＰｄ濃度に対
して、２５〜７５％の範囲にある場合に良好な半田濡れ
性が得られ、上記範囲外の場合、例えば、Ｐｄを含んで
いない場合やＰｄの割合が下層側電極のＰｄ濃度と同じ
（すなわち、割合が１００％）になった場合には、半田
濡れ性が低下していることがわかる。As shown in Table 1, good solder wettability is obtained when the Pd concentration of the conductive paste composition for the upper layer side electrode is in the range of 25 to 75% with respect to the Pd concentration of the lower layer side electrode. When the content is out of the above range, for example, when Pd is not contained or the Pd ratio is the same as the Pd concentration of the lower layer side electrode (that is, the ratio is 100%), the solder wettability is deteriorated. You can see that
【００１８】なお、この発明の導電ペースト組成物を用
いて、上層側電極を形成したセラミック電子部品は、下
層側電極が良好な半田耐熱性を有するとともに、上層側
電極が半田濡れ性に優れているため、実装工程における
半田付け不良が減少し、実装の信頼性が向上する。In the ceramic electronic component in which the upper layer side electrode is formed by using the conductive paste composition of the present invention, the lower layer side electrode has good solder heat resistance and the upper layer side electrode has excellent solder wettability. Therefore, defective soldering in the mounting process is reduced, and the reliability of mounting is improved.
【００１９】また、上記実施例においては、下層側電極
が一層構造の場合について説明したが、この発明は、下
層側電極が２層以上の多層構造を有する電極である場合
にも適用することが可能である。Further, although the case where the lower layer side electrode has a single layer structure has been described in the above embodiments, the present invention can be applied to the case where the lower layer side electrode has an electrode having a multi-layer structure of two or more layers. It is possible.
【００２０】[0020]
【発明の効果】上述のように、この発明の導電ペースト
組成物は、主成分であるＡｇと、該Ａｇとの合量中の濃
度が下層側電極のＰｄ濃度の２５〜７５％の範囲にある
Ｐｄと、有機ビヒクルとを含有し、ガラスフリットを含
有しない構成を有しているので、下層側電極と上層側電
極との間のガラス、Ａｇ、Ｐｄなどの相互拡散を抑制し
て、上層側電極表面のガラス成分量の増大を防止し、半
田濡れ性を向上させることができる。As described above, in the conductive paste composition of the present invention, the concentration of Ag as the main component and the total amount of Ag is within the range of 25 to 75% of the Pd concentration of the lower layer side electrode. Since the Pd and the organic vehicle are contained and the glass frit is not contained, the mutual diffusion of glass, Ag, Pd, etc. between the lower layer side electrode and the upper layer side electrode is suppressed, and the upper layer is formed. It is possible to prevent an increase in the glass component amount on the side electrode surface and improve solder wettability.
【００２１】すなわち、この発明の導電ペースト組成物
は、焼成後の半田濡れ性に優れていることから、良好な
半田濡れ性が要求される表面実装型のセラミック電子部
品の電極形成用材料として極めて有意義である。That is, since the conductive paste composition of the present invention has excellent solder wettability after firing, it is extremely useful as an electrode-forming material for surface-mounting ceramic electronic components that require good solder wettability. It is meaningful.
【図１】この発明の導電ペースト組成物を用いた場合
の、下層側電極と上層側電極のＰｄ濃度の分布を模式的
に示す図である。FIG. 1 is a diagram schematically showing a distribution of Pd concentrations of a lower layer side electrode and an upper layer side electrode when the conductive paste composition of the present invention is used.
【図２】電極の半田濡れ性を説明する図である。FIG. 2 is a diagram for explaining solder wettability of electrodes.
【図３】従来の導電ペースト組成物を用いた場合の、下
層側電極と上層側電極のＰｄ濃度の分布を模式的に示す
図である。FIG. 3 is a diagram schematically showing a distribution of Pd concentrations of a lower layer side electrode and an upper layer side electrode when a conventional conductive paste composition is used.
１ 上層側電極 ２ 半田が付着した部分 1 Upper layer side electrode 2 Solder adhered part
Claims (1)
合量中のＰｄ濃度が５〜３０重量％のＡｇ−Ｐｄ系の下
層側電極上に塗布されて半田濡れ性に優れた上層側電極
を形成する導電ペースト組成物であって、主成分である
Ａｇと、該Ａｇとの合量中の濃度が前記下層側電極の前
記Ｐｄ濃度の２５〜７５％の範囲にあるＰｄと、有機ビ
ヒクルとを含有し、ガラスフリットを含有しないことを
特徴とする導電ペースト組成物。1. An upper layer side electrode containing a glass frit and coated on a lower layer side electrode of Ag—Pd system having a Pd concentration of 5 to 30% by weight in the total amount of Ag and Pd and having excellent solder wettability. Which is a conductive paste composition which forms Ag, and Pd whose concentration in the total amount of Ag and Ag is in the range of 25 to 75% of the Pd concentration of the lower layer side electrode, and an organic vehicle. An electrically conductive paste composition comprising: and not containing a glass frit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35879991A JP2998379B2 (en) | 1991-12-28 | 1991-12-28 | Conductive paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35879991A JP2998379B2 (en) | 1991-12-28 | 1991-12-28 | Conductive paste composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05182514A true JPH05182514A (en) | 1993-07-23 |
| JP2998379B2 JP2998379B2 (en) | 2000-01-11 |
Family
ID=18461173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35879991A Expired - Lifetime JP2998379B2 (en) | 1991-12-28 | 1991-12-28 | Conductive paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2998379B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1083578A4 (en) * | 1999-03-30 | 2007-01-10 | Matsushita Electric Ind Co Ltd | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| JP2014038829A (en) * | 2012-04-17 | 2014-02-27 | Heraeus Precious Metals North America Conshohocken Llc | Conductive thick film paste for solar battery contact |
-
1991
- 1991-12-28 JP JP35879991A patent/JP2998379B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1083578A4 (en) * | 1999-03-30 | 2007-01-10 | Matsushita Electric Ind Co Ltd | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| JP2014038829A (en) * | 2012-04-17 | 2014-02-27 | Heraeus Precious Metals North America Conshohocken Llc | Conductive thick film paste for solar battery contact |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2998379B2 (en) | 2000-01-11 |
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