JPH0817136B2 - Conductive composition for ceramic capacitor terminal electrodes - Google Patents
Conductive composition for ceramic capacitor terminal electrodesInfo
- Publication number
- JPH0817136B2 JPH0817136B2 JP18895688A JP18895688A JPH0817136B2 JP H0817136 B2 JPH0817136 B2 JP H0817136B2 JP 18895688 A JP18895688 A JP 18895688A JP 18895688 A JP18895688 A JP 18895688A JP H0817136 B2 JPH0817136 B2 JP H0817136B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- conductive composition
- parts
- ceramic capacitor
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、セラミックコンデンサの端子電極を形成す
るための導電性組成物であり、特にメッキ付着性が優
れ、電解メッキ処理した後の電極とコンデンサ素体間の
接合強度の劣化のない端子電極被膜を形成し得る導電性
組成物に関する。Description: TECHNICAL FIELD The present invention relates to a conductive composition for forming a terminal electrode of a ceramic capacitor, which is particularly excellent in plating adhesion and has an electrode and a capacitor element after electrolytic plating treatment. The present invention relates to a conductive composition capable of forming a terminal electrode coating film without deterioration in joint strength between bodies.
従来の技術 積層コンデンサ等チップ状セラミックコンデンサの端
子電極は、銀、パラジウム、金、白金、銅、ニッケル又
はこれらの混合物などの導電性粉末と、ガラス質フリッ
ト等の無機結合剤とを有機ビヒクルに分散させたペース
ト状の組成物をコンデンサ素体の端子部に塗布し、焼付
けすることによって形成される。2. Description of the Related Art The terminal electrode of a chip-shaped ceramic capacitor such as a multilayer capacitor has a conductive powder such as silver, palladium, gold, platinum, copper, nickel or a mixture thereof and an inorganic binder such as a glassy frit as an organic vehicle. It is formed by applying the dispersed paste composition to the terminal portion of the capacitor body and baking it.
コンデンサチップの回路基板への実装は、半田付けに
よって行うのが一般的であるが、電極の導電成分として
半田に溶解し易い貴金属を使用する場合、半田中への滲
出が大きく、極端な場合には電極が消失したり、回路と
の接続性が悪くなる。そこで電極表面に半田に溶解し難
いニッケル、銅などの金属の薄膜を電解メッキ等の手段
で形成し、次いでその上に半田付性の良い錫や錫−鉛合
金などを被覆し、その後半田付処理を行っている。Mounting of the capacitor chip on the circuit board is generally done by soldering.However, when a noble metal that is easily dissolved in the solder is used as the conductive component of the electrode, the exudation into the solder is large, and in extreme cases The electrode disappears and the connectivity with the circuit deteriorates. Therefore, a thin film of a metal such as nickel or copper that is difficult to dissolve in solder is formed on the electrode surface by means such as electrolytic plating, and then tin or tin-lead alloy with good solderability is coated on it, and then soldered. It is processing.
ところが、従来この種の導電性組成物は無機結合剤に
硼珪酸鉛系や硼珪酸ビスマス系のガラス質フリットを使
用するものであるが、焼成膜に電解メッキ処理を行う
と、端子とコンデンサ素体間の接合強度が大きく低下す
るという欠点があった。これは通常ニッケル、銅、錫な
どの電解メッキ液は酸性溶液であるため、メッキ作業中
に酸の作用によってガラス成分が変質したり溶解したり
し、ガラスの構造が破壊されて、その結果接合強度が低
下するものと考えられている。However, this type of conductive composition has conventionally used lead borosilicate-based or bismuth borosilicate-based glass frit as an inorganic binder. There is a drawback that the joint strength between the bodies is greatly reduced. This is because the electrolytic plating solution of nickel, copper, tin, etc. is usually an acidic solution, so the glass component is altered or dissolved by the action of acid during the plating process, the glass structure is destroyed, and as a result the bonding It is believed that the strength is reduced.
そこで耐酸性の酔いSiO2含量の多い硼珪酸鉛系や硼珪
酸亜鉛系のガラス質フリットを使用するなど、電極材
料、特にガラス質フリットの改良が種々なされている。
又特公昭60−37562号には、鉛を含有しないZnO−B2O3−
SiO2ガラスを使用したペーストを使用して酸処理、電解
メッキの可能な導体膜を形成することが記載されてお
り、特公昭62−1662号には、アルカリ金属及びアルカリ
土類金属を含有する特定の組成の硼珪酸亜鉛系ガラス質
フリットを用いた導電塗料が記載されている。しかし、
これらガラスを使用することによって、電解メッキによ
る密着強度の劣化はある程度改善されるものの、電極表
面にガラスが分布しており、メッキが均一に形成できな
い。そのため半田が一様に付着しなかったり、回路との
接合が不十分になるなどの大きな問題を生じる。Therefore, various improvements have been made on electrode materials, particularly glassy frits, such as using lead borosilicate-based or zinc borosilicate-based glassy frits having a large amount of acid resistant SiO 2 content.
Matatoku Publication No. 60-37562 is, ZnO-B does not contain lead 2 O 3 -
It is described that a paste using SiO 2 glass is used to form a conductor film that can be subjected to acid treatment and electrolytic plating. JP-B-62-1662 contains an alkali metal and an alkaline earth metal. A conductive paint using a zinc borosilicate-based glassy frit having a specific composition is described. But,
By using these glasses, the deterioration of the adhesion strength due to electrolytic plating is improved to some extent, but the glass is distributed on the electrode surface, and the plating cannot be formed uniformly. As a result, there are serious problems such as the solder not uniformly adhering to the circuit and insufficient connection with the circuit.
発明が解決しようとする課題 このため、酸性メッキ液でメッキ処理する際のガラス
の変質による端子とコンデンサ素体間の接合強度の劣化
がなく、かつ電極表面にメッキ付着性を阻害するガラス
がほとんど存在しない端子電極を形成することが要求さ
れている。SUMMARY OF THE INVENTION Therefore, most of the glass that does not deteriorate the bonding strength between the terminal and the capacitor element body due to the deterioration of the glass during the plating treatment with the acidic plating solution and inhibits the plating adhesion on the electrode surface. It is required to form a nonexistent terminal electrode.
課題を解決するための手段 本発明は、貴金属粉末100重量部と、ガラスを構成す
る各元素の合計が酸化物換算でそれぞれ B2O3 15〜40重量％ ZnO 20〜45重量％ BaO 20〜60重量％ SiO2 １〜15重量％ の比率となるような１種又は２種以上のガラス質フリッ
ト0.5〜20重量部とを、有機ビヒクルに分散させてなる
セラミックコンデンサ端子電極用導電性組成物である。Means for Solving the Problems The present invention is 100 parts by weight of a noble metal powder, and the total of each element constituting glass is B 2 O 3 15 to 40% by weight ZnO 20 to 45% by weight BaO 20 to A conductive composition for a ceramic capacitor terminal electrode, which is obtained by dispersing 0.5 to 20 parts by weight of one or more kinds of glassy frit having a ratio of 60% by weight SiO 2 to 1 to 15% by weight in an organic vehicle. Is.
作用 本発明の導電性組成物は、特定組成の硼珪酸バリウム
−亜鉛ガラスを無機結合剤として用いることを特徴とす
るものであり、この組成物を焼成して得られる端子はコ
ンデンサ素体との接合強度が極めて強く、電解メッキを
施してもガラスの変質による接合強度の劣化がない。又
電極表面にガラスの分布が極めて少ないため、予め酸処
理等を行う必要もなく、容易に均一な電解メッキが可能
であり、従って半田付性も優れた端子電極が形成され
る。Action The conductive composition of the present invention is characterized by using barium borosilicate-zinc glass having a specific composition as an inorganic binder, and a terminal obtained by firing this composition is a capacitor body. The bonding strength is extremely strong, and even if electrolytic plating is applied, the bonding strength does not deteriorate due to the deterioration of the glass. Further, since the distribution of glass on the electrode surface is extremely small, it is not necessary to perform acid treatment or the like in advance, and uniform electrolytic plating can be easily performed. Therefore, a terminal electrode excellent in solderability is formed.
ガラスの組成を限定した理由は、次の通りである。 The reason for limiting the composition of glass is as follows.
B2O3は15重量％未満ではガラス化が困難であり、40重
量％を越えると軟化温度が高くなり、又失透するので望
ましくない。If B 2 O 3 is less than 15% by weight, vitrification is difficult, and if it exceeds 40% by weight, the softening temperature becomes high and devitrification occurs, which is not desirable.
ZnOは20重量％より少ないと耐酸性が劣り、又45重量
％を越えるとガラス化が困難になる。If ZnO is less than 20% by weight, the acid resistance is poor, and if it exceeds 45% by weight, vitrification becomes difficult.
BaOは20重量％より少ないとガラス化が困難であり、6
0重量％を越えるとガラスの軟化温度が高くなりすぎ
る。特に25重量％以上の範囲が好ましい。If BaO is less than 20% by weight, vitrification is difficult.
If it exceeds 0% by weight, the softening temperature of the glass becomes too high. Particularly, the range of 25% by weight or more is preferable.
SiO2は、１重量％未満では十分な耐酸性が得られず、
又15重量％より多いと軟化温度が高くなりすぎて使用に
適さない。When SiO 2 is less than 1% by weight, sufficient acid resistance cannot be obtained,
If it is more than 15% by weight, the softening temperature becomes too high and it is not suitable for use.
尚ガラス質フリットとしては、単一のガラス質フリッ
トを使用してもよいが、２種以上のフリットの混合物
で、各成分酸化物の合計が前記の比率となるものを用い
ても効果は同一である。As the glassy frit, a single glassy frit may be used, but the same effect can be obtained even if a mixture of two or more kinds of frit and the sum of the component oxides is the above ratio. Is.
本発明にはガラス質フリットの他に、無機結合剤とし
て通常使用される酸化ビスマス、酸化銅、酸化亜鉛等の
添加剤を併用してもよい。In the present invention, in addition to the glassy frit, additives such as bismuth oxide, copper oxide, and zinc oxide which are commonly used as an inorganic binder may be used in combination.
導電性粉末としては銀、パラジウム、白金、金などの
貴金属やこれらの合金或いは混合物が使用される。As the conductive powder, a noble metal such as silver, palladium, platinum, gold, etc., or an alloy or mixture thereof is used.
有機ビヒクルは特に制限はなく、通常この種の導電性
組成物に使用されるものでよい。The organic vehicle is not particularly limited and may be one normally used in this type of conductive composition.
導電性粉末とガラス質フリットの比率は、導電性粉末
100重量部に対してガラス質フリット0.5〜20重量部程度
である。ガラス質フリットが20重量部を越えると、電極
の表層部に存在するガラスが多くなり、均一なメッキ被
膜が形成できなくなるので望ましくない。有機ビヒクル
は、導電性粉末100重量部に対して10〜40重量部程度使
用される。The ratio of conductive powder to vitreous frit is
The glass frit is about 0.5 to 20 parts by weight per 100 parts by weight. If the vitreous frit exceeds 20 parts by weight, the amount of glass present in the surface layer of the electrode increases and it is not possible to form a uniform plated coating, which is not desirable. The organic vehicle is used in an amount of 10 to 40 parts by weight based on 100 parts by weight of the conductive powder.
本発明の端子電極組成物は、BaTiO3系やTiO2系など種
々の誘電体セラミックに対して効果があり、又積層コン
デンサ、単板形チップコンデンサいずれにも適用でき
る。更に、メッキ処理を行わず直接半田付するタイプの
端子電極にも使用することができる。The terminal electrode composition of the present invention is effective for various dielectric ceramics such as BaTiO 3 type and TiO 2 type, and can be applied to both laminated capacitors and single plate type chip capacitors. Further, it can be used for a terminal electrode of a type that is directly soldered without performing a plating process.
実施例 実施例１ 銀粉末100重量部に対して下記組成のガラス質フリッ
ト６重量部、有機ビヒクルとしてエチルセルロースのテ
ルピネオール溶液30重量部を混合し、ペースト状の導電
性組成物を得た。Example 1 To 100 parts by weight of silver powder, 6 parts by weight of a glassy frit having the following composition and 30 parts by weight of a terpineol solution of ethyl cellulose as an organic vehicle were mixed to obtain a paste-like conductive composition.
B2O3 20重量％ ZnO 25重量％ BaO 54重量％ SiO2 １重量％ このペーストを、内部電極にパラジウムを用いたTiO2
系積層セラミックコンデンサ（層数30層）の端子部即ち
内部電極の露出した側面に塗布し、150℃で10分間乾燥
した後、最高温度800℃で焼成し、端子電極被膜を形成
した。B 2 O 3 20% by weight ZnO 25% by weight BaO 54% by weight SiO 2 1% by weight This paste was used for TiO 2 containing palladium as an internal electrode.
It was applied to the exposed side surface of the terminal portion, that is, the internal electrode of the system type monolithic ceramic capacitor (30 layers), dried at 150 ° C. for 10 minutes, and then baked at the maximum temperature of 800 ° C. to form a terminal electrode coating film.
次いで端子部にニッケル及び錫を順次電解メッキし
た。メッキ処理の前後で電極とセラミック素体間の接合
強度を測定したところ、それぞれ3.8kg、3.4kgであっ
た。Next, nickel and tin were sequentially electrolytically plated on the terminals. When the bonding strength between the electrode and the ceramic body was measured before and after the plating treatment, they were 3.8 kg and 3.4 kg, respectively.
又メッキ処理したコンデンサをの錫／鉛共晶半田浴に
浸漬し、半田の付着性を調べたところ極めて良好であっ
た。尚、メッキ前の電極膜の表面を電子顕微鏡で観察し
たところ、ガラスはほとんど存在していなかった。Further, when the plated capacitor was dipped in a tin / lead eutectic solder bath and the adhesion of the solder was examined, it was very good. When the surface of the electrode film before plating was observed with an electron microscope, almost no glass was present.
実施例２〜６ 表１に示した組成のガラス質フリットを使用する以外
は実施例と同様にして、積層セラミックコンデンサに端
子電極を形成した。同様にメッ前後の接合強度及び半田
付着性を調べ、結果を表１に併せて示した。Examples 2 to 6 Terminal electrodes were formed on the laminated ceramic capacitor in the same manner as in Examples except that the glass frit having the composition shown in Table 1 was used. Similarly, the bonding strength and solder adhesion before and after the measurement were examined, and the results are also shown in Table 1.
尚、表１において半田付性は試料10個中、半田がはじ
かれて均一に付着しなかったものの個数で示した。In Table 1, the solderability is shown by the number of 10 samples which were repelled and did not adhere uniformly.
比較例１〜５ 表１に示した組成のガラス質フリットを使用する以外
は実施例と同様にして端子電極を形成し、接合強度及び
半田付着性を調べた。結果を表１に併せて示した。Comparative Examples 1 to 5 A terminal electrode was formed in the same manner as in the example except that the glass frit having the composition shown in Table 1 was used, and the bonding strength and the solder adhesion were examined. The results are also shown in Table 1.
表１から明らかなように、本発明外の組成のガラスを
用いた場合、比較例１、２、５ではメッキ後の強度劣化
が大きい。又比較例３、４、５では半田濡れ性が悪い
が、これは電極膜にガラスが多く存在し、ニッケルメッ
キが均一に付着しなかったためと考えられる。 As is clear from Table 1, in the case of using the glass having the composition other than the present invention, in Comparative Examples 1, 2 and 5, the strength deterioration after plating is large. Further, in Comparative Examples 3, 4, and 5, the solder wettability is poor, but it is considered that this is because a large amount of glass was present in the electrode film and the nickel plating did not adhere uniformly.
実施例７ 銀粉末100重量部と、実施例４と同一の組成のガラス
質フリット１重量部及びエチルセルロースのテルピネオ
ール溶液30重量部を混合し、ペースト状の導電性組成物
を得た。実施例１と同様にして端子電極を形成し、接合
強度を調べたところ、メッキの前後でそれぞれ3.3kg、
3.1kgであった。又半田付性は極めて良好であった。Example 7 100 parts by weight of silver powder, 1 part by weight of a glass frit having the same composition as in Example 4 and 30 parts by weight of a terpineol solution of ethylcellulose were mixed to obtain a paste-like conductive composition. When a terminal electrode was formed in the same manner as in Example 1 and the bonding strength was examined, it was 3.3 kg before and after plating, respectively.
It was 3.1 kg. Also, the solderability was extremely good.
実施例８ 銀粉末80重量％とパラジウム粉末20重量％からなる混
合粉末100重量部と、実施例４と同一の組成のガラス質
フリット15重量部及びエチルセルロースのテルピネオー
ル溶液30重量部を混合し、ペースト状の導電性組成物を
得た。実施例１と同様にして端子電極を形成し、接合強
度を調べたところ、メッキの前後でそれぞれ3.9kg、3.6
kgであった。半田付性は極めて良好であった。Example 8 100 parts by weight of a mixed powder consisting of 80% by weight of silver powder and 20% by weight of palladium powder, 15 parts by weight of a glassy frit having the same composition as in Example 4 and 30 parts by weight of a terpineol solution of ethyl cellulose were mixed to form a paste. A conductive composition in the form of a strip was obtained. When a terminal electrode was formed in the same manner as in Example 1 and the bonding strength was examined, it was 3.9 kg and 3.6 before and after plating, respectively.
kg. The solderability was extremely good.
実施例９ 銀粉末100重量部と、実施例４と同一の組成のガラス
質フリット４重量部及びBi2O3粉末５重量部をエチルセ
ルロースのテルピネオール溶液30重量部に混合分散させ
て、ペースト状の導電性組成物を得た。このペーストを
BaTiO3系積層セラミックコンデンサの端子部に塗布し、
乾燥後、最高温度750℃で焼成して端子電極被膜を形成
した。メッキ処理せずに端子の接合強度を調べたとこ
ろ、5.0kgであり、優れた密着性を示した。半田付性も
極めて良好であった。Example 9 100 parts by weight of silver powder, 4 parts by weight of glassy frit having the same composition as in Example 4 and 5 parts by weight of Bi 2 O 3 powder were mixed and dispersed in 30 parts by weight of a terpineol solution of ethyl cellulose to prepare a paste form. A conductive composition was obtained. This paste
Apply to the terminal part of BaTiO 3 system multilayer ceramic capacitor,
After drying, it was baked at a maximum temperature of 750 ° C. to form a terminal electrode coating film. When the joint strength of the terminal was examined without plating, it was 5.0 kg, which showed excellent adhesion. The solderability was also very good.
発明の効果 本発明の導電性組成物を種々のコンデンサ素体に焼付
することにより、コンデンサ素体との接合強度が強く、
耐酸性が良好で電解メッキを施しても接合強度の劣化が
なく、かつ容易に均一な電解メッキが可能な、優れた端
子電極が形成される。従って極めて信頼性が高いコンデ
ンサを得ることができる。EFFECTS OF THE INVENTION By baking the conductive composition of the present invention on various capacitor bodies, the bonding strength with the capacitor body is high,
An excellent terminal electrode is formed which has good acid resistance, has no deterioration in bonding strength even when electrolytic plating is applied, and allows uniform electrolytic plating easily. Therefore, an extremely reliable capacitor can be obtained.
フロントページの続き (72)発明者 能勢 直樹 東京都青梅市末広町２丁目９番地３ 昭栄 化学工業株式会社内 (72)発明者 真島 浩 東京都青梅市末広町２丁目９番地３ 昭栄 化学工業株式会社内Front Page Continuation (72) Inventor Naoki Nose 2-9-3 Suehiro-cho, Ome-shi, Tokyo Within Shoei Chemical Industry Co., Ltd. (72) Inventor Hiroshi Mashima 2-9-3 Suehiro-cho, Ome-shi, Tokyo Shoei Chemical Industry Co., Ltd. In the company
Claims (2)
る各元素の合計が酸化物換算でそれぞれ下記比率となる
ような１種又は２種以上のガラス質フリット0.5〜20重
量部とを、有機ビヒクルに分散させてなるセラミックコ
ンデンサ端子電極用導電性組成物。 B2O3 15〜40重量％ ZnO 20〜45重量％ BaO 20〜60重量％ SiO2 １〜15重量％1. 100 parts by weight of noble metal powder and 0.5 to 20 parts by weight of one or more kinds of glassy frit such that the total of each element constituting glass has the following ratio in terms of oxide. A conductive composition for a ceramic capacitor terminal electrode, which is dispersed in an organic vehicle. B 2 O 3 15-40% by weight ZnO 20-45% by weight BaO 20-60% by weight SiO 2 1-15% by weight
記載のセラミックコンデンサ端子電極用導電性組成物。2. A bismuth oxide powder is further added.
A conductive composition for a ceramic capacitor terminal electrode as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18895688A JPH0817136B2 (en) | 1988-07-28 | 1988-07-28 | Conductive composition for ceramic capacitor terminal electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18895688A JPH0817136B2 (en) | 1988-07-28 | 1988-07-28 | Conductive composition for ceramic capacitor terminal electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0239408A JPH0239408A (en) | 1990-02-08 |
| JPH0817136B2 true JPH0817136B2 (en) | 1996-02-21 |
Family
ID=16232865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18895688A Expired - Lifetime JPH0817136B2 (en) | 1988-07-28 | 1988-07-28 | Conductive composition for ceramic capacitor terminal electrodes |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0817136B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0255256A (en) * | 1988-08-19 | 1990-02-23 | Murata Mfg Co Ltd | Reduction-preventing agent for dielectric ceramics |
| JP3152065B2 (en) * | 1994-06-20 | 2001-04-03 | 株式会社村田製作所 | Conductive paste and multilayer ceramic capacitors |
| US6982864B1 (en) * | 2004-06-09 | 2006-01-03 | Ferro Corporation | Copper termination inks containing lead free and cadmium free glasses for capacitors |
-
1988
- 1988-07-28 JP JP18895688A patent/JPH0817136B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239408A (en) | 1990-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05235497A (en) | Copper conductive paste | |
| JP3463320B2 (en) | Multilayer ceramic capacitors | |
| JPH0817140B2 (en) | Conductive composition for ceramic capacitor terminal electrodes | |
| JPH0423308A (en) | Ceramic capacitor | |
| JPH0834168B2 (en) | Conductive composition for ceramic capacitor terminal electrodes | |
| JPH0817136B2 (en) | Conductive composition for ceramic capacitor terminal electrodes | |
| JP3257036B2 (en) | Conductive paste for chip-type electronic components | |
| JP2973558B2 (en) | Conductive paste for chip-type electronic components | |
| JPH087645A (en) | Conductive paste and multilayer ceramic capacitor | |
| JP3291831B2 (en) | Conductive paste for chip-type electronic components | |
| JPS621662B2 (en) | ||
| JP2968316B2 (en) | Multilayer ceramic capacitors | |
| JP2589433B2 (en) | Plateable thick film copper conductor paste composition | |
| JPH0440803B2 (en) | ||
| JPH0817141B2 (en) | Conductive composition for ceramic capacitor terminal electrodes | |
| JPS6127003A (en) | Conductive paste composition | |
| JPS635842B2 (en) | ||
| JPH08298018A (en) | Conductive paste | |
| JP2931450B2 (en) | Conductor paste | |
| JPH10106346A (en) | Silver-based conductor paste | |
| JP3318299B2 (en) | Pb-free low-temperature firing type conductive paint | |
| JPH07211133A (en) | Conductive paste for forming terminal electrode of electronic part | |
| JPH05234415A (en) | Conductive paste | |
| JPH0437009A (en) | Conductive paste for forming terminal electrode of laminated type capacitor | |
| JPH09161539A (en) | Conductive compound and ceramic electronic parts using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080221 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 13 Free format text: PAYMENT UNTIL: 20090221 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 13 Free format text: PAYMENT UNTIL: 20090221 |