JPH0516172B2 - - Google Patents
Info
- Publication number
- JPH0516172B2 JPH0516172B2 JP1008384A JP1008384A JPH0516172B2 JP H0516172 B2 JPH0516172 B2 JP H0516172B2 JP 1008384 A JP1008384 A JP 1008384A JP 1008384 A JP1008384 A JP 1008384A JP H0516172 B2 JPH0516172 B2 JP H0516172B2
- Authority
- JP
- Japan
- Prior art keywords
- processed
- plasma
- air
- substrate
- core solenoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 34
- 230000004907 flux Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 230000005684 electric field Effects 0.000 claims description 13
- 238000003672 processing method Methods 0.000 claims description 5
- 230000002195 synergetic effect Effects 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 description 23
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008384A JPS60154620A (ja) | 1984-01-25 | 1984-01-25 | マイクロ波プラズマ処理方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008384A JPS60154620A (ja) | 1984-01-25 | 1984-01-25 | マイクロ波プラズマ処理方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60154620A JPS60154620A (ja) | 1985-08-14 |
| JPH0516172B2 true JPH0516172B2 (enrdf_load_stackoverflow) | 1993-03-03 |
Family
ID=11740450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1008384A Granted JPS60154620A (ja) | 1984-01-25 | 1984-01-25 | マイクロ波プラズマ処理方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60154620A (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2511433B2 (ja) * | 1986-12-12 | 1996-06-26 | 株式会社日立製作所 | マイクロ波プラズマ処理装置 |
| DE3774098D1 (de) * | 1986-12-29 | 1991-11-28 | Sumitomo Metal Ind | Plasmageraet. |
| JPS63207131A (ja) * | 1987-02-24 | 1988-08-26 | Japan Steel Works Ltd:The | プラズマ処理装置 |
| JP2656503B2 (ja) * | 1987-09-24 | 1997-09-24 | 株式会社日立製作所 | マイクロ波プラズマ処理方法 |
| JP2595640B2 (ja) * | 1988-03-30 | 1997-04-02 | 株式会社島津製作所 | プラズマ処理装置 |
| JPH0567586A (ja) * | 1991-09-09 | 1993-03-19 | Nec Corp | Ecrプラズマエツチング装置 |
| JP2781712B2 (ja) * | 1993-03-18 | 1998-07-30 | 株式会社日立製作所 | プラズマ処理方法 |
| JP3199957B2 (ja) | 1994-06-20 | 2001-08-20 | 株式会社日立製作所 | マイクロ波プラズマ処理方法 |
| JP2714547B2 (ja) * | 1995-12-13 | 1998-02-16 | 株式会社日立製作所 | マイクロ波プラズマ処理装置及び処理方法 |
-
1984
- 1984-01-25 JP JP1008384A patent/JPS60154620A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60154620A (ja) | 1985-08-14 |
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