JPH0515698Y2 - - Google Patents
Info
- Publication number
- JPH0515698Y2 JPH0515698Y2 JP1986193567U JP19356786U JPH0515698Y2 JP H0515698 Y2 JPH0515698 Y2 JP H0515698Y2 JP 1986193567 U JP1986193567 U JP 1986193567U JP 19356786 U JP19356786 U JP 19356786U JP H0515698 Y2 JPH0515698 Y2 JP H0515698Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- melting point
- point metal
- low melting
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002844 melting Methods 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 230000004907 flux Effects 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Fuses (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986193567U JPH0515698Y2 (US08197722-20120612-C00042.png) | 1986-12-15 | 1986-12-15 | |
KR2019870008375U KR900004868Y1 (ko) | 1986-12-15 | 1987-05-28 | 기판형 온도 퓨즈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986193567U JPH0515698Y2 (US08197722-20120612-C00042.png) | 1986-12-15 | 1986-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6399643U JPS6399643U (US08197722-20120612-C00042.png) | 1988-06-28 |
JPH0515698Y2 true JPH0515698Y2 (US08197722-20120612-C00042.png) | 1993-04-26 |
Family
ID=31149708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986193567U Expired - Lifetime JPH0515698Y2 (US08197722-20120612-C00042.png) | 1986-12-15 | 1986-12-15 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0515698Y2 (US08197722-20120612-C00042.png) |
KR (1) | KR900004868Y1 (US08197722-20120612-C00042.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4290244B2 (ja) * | 1998-07-15 | 2009-07-01 | 内橋エステック株式会社 | 基板型温度ヒュ−ズの製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6369344U (US08197722-20120612-C00042.png) * | 1986-10-21 | 1988-05-10 |
-
1986
- 1986-12-15 JP JP1986193567U patent/JPH0515698Y2/ja not_active Expired - Lifetime
-
1987
- 1987-05-28 KR KR2019870008375U patent/KR900004868Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR880013611U (ko) | 1988-08-30 |
KR900004868Y1 (ko) | 1990-05-31 |
JPS6399643U (US08197722-20120612-C00042.png) | 1988-06-28 |
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