JPH05145269A - Electronic apparatus - Google Patents

Electronic apparatus

Info

Publication number
JPH05145269A
JPH05145269A JP30220491A JP30220491A JPH05145269A JP H05145269 A JPH05145269 A JP H05145269A JP 30220491 A JP30220491 A JP 30220491A JP 30220491 A JP30220491 A JP 30220491A JP H05145269 A JPH05145269 A JP H05145269A
Authority
JP
Japan
Prior art keywords
circuit board
electric circuit
shield member
shield
mesh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30220491A
Other languages
Japanese (ja)
Inventor
Toshiaki Itazawa
敏明 板沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP30220491A priority Critical patent/JPH05145269A/en
Publication of JPH05145269A publication Critical patent/JPH05145269A/en
Pending legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To obtain a high shielding effect and a high heat-dissipation effect of a shielding member, together with reducing the formal size of a shielding system to a minimum. CONSTITUTION:An electric circuit board 2 is covered with a shielding member 1 comprising a mesh-like conductor which is so covered by an insulator as to leave the holes of its mesh intact, and the conductor of the shielding member 1 is connected with the earth part of the circuit board 2. Even though the shielding member 1 is contacted with the elements provided on the circuit board 2, there is no problem for it is covered with the insulator. Therefore, the shielding member 1 is used compactly in a lump, and the electronic apparatus using it can be made compact. Also, the high heat-dissipation effect of the shielding member 1 can be obtained by making its form mesh-like.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電波シールドを行なう
シールド部材で覆われた電気回路基板を有する電子機器
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having an electric circuit board covered with a shield member that shields radio waves.

【0002】[0002]

【従来の技術】従来、文書作成装置等の電子機器では、
該電子機器自体から発生する雑電波や外部からの電波等
により、自己の電子機器および他の電子機器を誤動作さ
せる等の電波障害が生ずる。そのため、電気回路基板を
シールド部材により囲み、該シールド部材を前記電気回
路基板のアース部に電気的に接続させて内部および外部
の電波を遮断する構造が採用されている。
2. Description of the Related Art Conventionally, in electronic equipment such as a document creation device,
Radio waves such as malfunction of own electronic device and other electronic devices occur due to miscellaneous radio waves generated from the electronic device itself, radio waves from the outside, and the like. Therefore, a structure is adopted in which the electric circuit board is surrounded by a shield member, and the shield member is electrically connected to the ground portion of the electric circuit board to block internal and external radio waves.

【0003】例えば、図3に示す文書作成装置10の筐
体5内の電気回路基板(図略)は図4および図5に示す
シールド部材により被包されている。図4および図5に
示すように、シールド部材はシールド材を板金成型加工
して形成される箱体状の上シールド板11および下シー
ルド板12からなり、それ等は電気回路基板2を挾んで
上下配置される。なお、上シールド板11および下シー
ルド板12はそれぞれの取り付けフランジ部13,14
を電気回路基板2のアースパターン(図略)に接触させ
て固定される。上シールド板11および下シールド板1
2で被包された電気回路基板2は図4に示すように上ケ
ース3aおよび下ケース4aからなる筐体5a内に収納
される。
For example, the electric circuit board (not shown) in the housing 5 of the document creating apparatus 10 shown in FIG. 3 is covered with the shield member shown in FIGS. 4 and 5. As shown in FIGS. 4 and 5, the shield member includes a box-shaped upper shield plate 11 and a lower shield plate 12 which are formed by sheet metal forming a shield material, and the shield member sandwiches the electric circuit board 2. They are placed one above the other. The upper shield plate 11 and the lower shield plate 12 are attached to their respective mounting flange portions 13 and 14
Is brought into contact with and fixed to a ground pattern (not shown) of the electric circuit board 2. Upper shield plate 11 and lower shield plate 1
The electric circuit board 2 encapsulated by 2 is housed in a housing 5a composed of an upper case 3a and a lower case 4a as shown in FIG.

【0004】なお、電気回路基板2をシールドする手段
として、前記したシールド部材とは別に、電気回路基板
2が収納されている筐体5a(図3)の内部を導電塗装
又は導電メッキしたものも採用されている。
As a means for shielding the electric circuit board 2, in addition to the above-mentioned shield member, a casing 5a (FIG. 3) in which the electric circuit board 2 is housed may be conductively painted or plated. Has been adopted.

【0005】[0005]

【発明が解決しようとする課題】図4および図5に示し
たシールド部材の場合には次のような問題点がある。す
なわち、電気回路基板2には各種の素子および素子足が
突出して配列される。そこで、これ等と上シールド板1
1および下シールド板12との接触を避けるために十分
なクリアランスをとる必要がある。そのため、上シール
ド板11および下シールド板12の容積が大となり、コ
ンパクトな筐体5a内に収納しにくくなる問題点が生ず
る。
The shield member shown in FIGS. 4 and 5 has the following problems. That is, various elements and element legs are arranged so as to project on the electric circuit board 2. Therefore, these and the upper shield plate 1
It is necessary to take sufficient clearance to avoid contact with the lower shield plate 1 and the lower shield plate 12. Therefore, the volumes of the upper shield plate 11 and the lower shield plate 12 become large, which causes a problem that it becomes difficult to store them in the compact housing 5a.

【0006】また、電気回路基板2はかなり高熱になる
ため、発生熱を逃がす必要がある。そのため上シールド
板11および下シールド板12に放熱孔を形成する必要
があるが、放熱孔の径の大きさに比例してシールド効果
が低下するため十分な大きさの放熱孔を設けることが出
来ない。
Further, since the electric circuit board 2 becomes extremely high in heat, it is necessary to release generated heat. Therefore, it is necessary to form a heat dissipation hole in the upper shield plate 11 and the lower shield plate 12. However, since the shield effect is reduced in proportion to the size of the diameter of the heat dissipation hole, it is possible to provide a heat dissipation hole of a sufficient size. Absent.

【0007】一方、筐体5aの内部を導電塗装又は導電
メッキ等の導電処理する手段の場合には、導電処理時に
おいて筐体5aの外観面と内部との間にマスキングが必
要となり、作業工程が複雑になり製作コストが高くなる
問題点がある。更に、筐体5aは通常2部品以上のもの
から構成されるため、その間を電気的に接続する手段が
必要となり、コスト高となる問題点が生ずる。
On the other hand, in the case of a means for conducting the inside of the casing 5a with conductive treatment such as conductive coating or conductive plating, masking is required between the outer surface of the casing 5a and the inside during the conducting treatment, and the work process However, there is a problem that it becomes complicated and the manufacturing cost becomes high. Further, since the housing 5a is usually composed of two or more parts, means for electrically connecting the parts is required, which causes a problem of high cost.

【0008】本発明は、以上の問題点を解決するもの
で、シールド性および放熱性が高く、かつコンパクトに
まとめられ省スペース化が図れる電子機器の構成を提供
することを課題とする。
An object of the present invention is to solve the above problems, and an object thereof is to provide a structure of an electronic device which has a high shielding property and a high heat dissipation property and can be compactly assembled to save space.

【0009】[0009]

【課題を解決するための手段】上記の課題を解決するた
め本発明によれば、電波シールドを行なうシールド部材
で覆われた電気回路基板を有する電子機器であって、前
記シールド部材はメッシュ状の導電体を絶縁体により前
記メッシュの穴を残すように被覆したものからなり、前
記導電体は前記基板のアース部に電気的に接続される構
成を採用した。
According to the present invention to solve the above problems, there is provided an electronic device having an electric circuit board covered with a shield member for shielding a radio wave, wherein the shield member has a mesh shape. The conductor was covered with an insulator so as to leave the holes of the mesh, and the conductor was electrically connected to the ground portion of the substrate.

【0010】[0010]

【作用】シールド部材はメッシュ状の導電体を絶縁体で
被覆したものからなるので、電子回路基板に接触して被
包しても特に問題がなく、コンパクトにまとめられる。
また、メッシュ状に形成されるため、空気流動性がよく
電気回路基板の熱を放熱することが出来る。
Since the shield member is made of a mesh-shaped conductor covered with an insulator, there is no particular problem even if the shield member comes into contact with the electronic circuit board to be encapsulated, and the shield member can be compactly assembled.
Further, since it is formed in a mesh shape, it has good air fluidity and can dissipate heat from the electric circuit board.

【0011】[0011]

【実施例】以下、本発明の一実施例を図面に基づき説明
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0012】第1実施例 図1は本発明の第1実施例による電子機器のシールド構
造を説明するものである。図1において符号1はシール
ド部材,符号2は電気回路基板,符号3は上ケース,符
号4は下ケースである。なお、上ケース3および下ケー
ス4で筐体5(図3)を形成する。
First Embodiment FIG. 1 illustrates a shield structure for an electronic device according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 is a shield member, reference numeral 2 is an electric circuit board, reference numeral 3 is an upper case, and reference numeral 4 is a lower case. The case 5 (FIG. 3) is formed by the upper case 3 and the lower case 4.

【0013】シールド部材1は袋状のものからなり、銅
メッシュを網目の穴を残した状態で絶縁体でラミネート
したものから形成される。なお袋状のシールド部材1は
電気回路基板2を完全に被包する。電気回路基板2には
多数の素子および素子足が配設されているがシールド部
材1は絶縁体のため、それ等に接触可能であり、コンパ
クトな形状に形成される。
The shield member 1 is in the form of a bag, and is formed by laminating a copper mesh with an insulator while leaving mesh holes. The bag-shaped shield member 1 completely encloses the electric circuit board 2. Although a large number of elements and element legs are arranged on the electric circuit board 2, since the shield member 1 is an insulator, it can come into contact therewith and is formed in a compact shape.

【0014】一方、図に明示されていないが、電気回路
基板2の下ケース4に固定される固定部6にはアースパ
ターンが形成され、それに重なるシールド部材1の取り
付け部7はラミネートの絶縁体を除去している。すなわ
ち、電気回路基板2をシールド部材1で被包し、取り付
け部7と固定部6にビス8を挿入し、下ケース4に締め
付けることによりシールド部材1は電気回路基板2の前
記アースパターンに圧接されて電気的に接続される。
On the other hand, although not shown in the drawing, a ground pattern is formed on the fixing portion 6 fixed to the lower case 4 of the electric circuit board 2, and the attaching portion 7 of the shield member 1 which overlaps with the earth pattern is made of a laminated insulator. Are being removed. That is, the electric circuit board 2 is covered with the shield member 1, the screws 8 are inserted into the mounting portion 7 and the fixed portion 6, and the lower case 4 is tightened, so that the shield member 1 is pressed against the earth pattern of the electric circuit board 2. And are electrically connected.

【0015】以上の構造により電気回路基板2はシール
ド部材1により囲まれ、電波シールドが可能となる。ま
た、シールド部材1はメッシュ状に形成されているた
め、空気流動性が高く、シールド部材1内の熱を外部に
放熱させ、熱の蓄積を最小限にすることが出来る。ま
た、シールド部材1は一枚の銅メッシュを袋状に形成し
たものからなり、従来技術のように複数(2個)のシー
ルド材を重ね合わしたもののようにシール材同士の接点
部の接触抵抗によるシールド効果の減衰等を最小限に抑
えることが出来、高いシールド効果を得ることが出来
る。
With the above structure, the electric circuit board 2 is surrounded by the shield member 1 and the radio wave can be shielded. Further, since the shield member 1 is formed in a mesh shape, it has a high air fluidity, so that the heat in the shield member 1 can be radiated to the outside and the heat accumulation can be minimized. Further, the shield member 1 is made of a single piece of copper mesh formed into a bag shape, and is different from the contact resistance of the contact portions between the seal materials as in the case of stacking a plurality of (two) shield materials as in the prior art. Attenuation of the shield effect can be minimized, and a high shield effect can be obtained.

【0016】第2実施例 上記第1実施例では、電気回路基板2のアースパターン
にシールド部材1の絶縁除去した取り付け部7を圧接し
てシールド部材1と電気回路基板2とを電気的に接続し
たが、第2実施例では図2に示す導電体部材9により両
者を電気的に接続する。
Second Embodiment In the first embodiment, the shield member 1 and the electric circuit board 2 are electrically connected to each other by pressing the insulation-removed mounting portion 7 of the shield member 1 against the ground pattern of the electric circuit board 2. However, in the second embodiment, the two are electrically connected by the conductor member 9 shown in FIG.

【0017】導電体部材9はクリップ状のものからな
り、シールド部材1の銅メッシュにリード線により接続
し、1個〜数個配設される。クリップ状の導電体部材9
を電気回路基板2のレジストを除去したアースパターン
に挾み込むことによりシールド部材と電気回路基板2と
は電気的に接続される。
The conductor member 9 is made of a clip and is connected to the copper mesh of the shield member 1 by a lead wire, and one to several conductor members 9 are provided. Clip-shaped conductor member 9
The shield member and the electric circuit board 2 are electrically connected to each other by sandwiching the resist pattern of the electric circuit board 2 into the ground pattern from which the resist has been removed.

【0018】このような第2実施例によれば第1実施例
のビス8による電気的接続に較べシールド部材1と電気
回路基板2との接続がより容易になる効果が上げられ
る。
According to the second embodiment, the effect of facilitating the connection between the shield member 1 and the electric circuit board 2 as compared with the electric connection by the screw 8 of the first embodiment is enhanced.

【0019】なお第1実施例では袋状のシールド部材1
を採用したが、電気回路基板2の上側又は下側のみをシ
ールドすればよい場合には、シート状のシールド部材を
電気回路基板2の上方又は下方に被せるか又は敷設し、
回路基板2のアース部に電気的に接続すればよい。この
場合、袋状のシールド部材1により電気回路基板2を覆
う場合に較べて、放熱効果が上り、かつ最小の大きさの
シールド系を構成することが可能となる。また、以上の
説明では銅メッシュでシールド部材1を構成するものと
したが、他のメッシュ状の導電体を用いても勿論構わな
い。
In the first embodiment, the bag-shaped shield member 1
However, when only the upper side or the lower side of the electric circuit board 2 needs to be shielded, a sheet-shaped shield member is covered or laid on the upper side or the lower side of the electric circuit board 2,
It may be electrically connected to the ground portion of the circuit board 2. In this case, as compared with the case where the bag-shaped shield member 1 covers the electric circuit board 2, it is possible to enhance the heat dissipation effect and configure a shield system having a minimum size. Further, in the above description, the shield member 1 is made of copper mesh, but other mesh-shaped conductors may of course be used.

【0020】[0020]

【発明の効果】以上に説明したように、本発明によれ
ば、シールド部材としてメッシュ状の導電体をメッシュ
の穴を残した形で絶縁体で被覆したものを用い、これを
袋状に又はシート状にして電気回路基板を覆って配設す
ることにより、最小限の大きさのシールド部材によって
大きなシールド効果を上げることが出来ると共に、放熱
効果を向上することが出来る。また、シールド部材は袋
状又はシート状のものから形成されるため、極力コンパ
クトにまとめられ、筐体のコンパクト化が可能となる。
また、複数部材を重ねたものと異なり、重ね合わせ部の
接触抵抗によるシールド効果の減衰もなく高いシールド
効果が得られる。
As described above, according to the present invention, as the shield member, a mesh-shaped conductor covered with an insulator in the form of a mesh hole is used, and the shield member is formed into a bag or By arranging the electric circuit board in the form of a sheet so as to cover the electric circuit board, a large shield effect can be achieved by a shield member having a minimum size and a heat dissipation effect can be improved. Further, since the shield member is formed of a bag-shaped or sheet-shaped member, it can be made as compact as possible and the housing can be made compact.
Further, unlike a case where a plurality of members are stacked, a high shield effect can be obtained without the attenuation of the shield effect due to the contact resistance of the overlapping portion.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.

【図2】他の実施例によるシールド部材と電気回路基板
との接続構造を示す要部の斜視図である。
FIG. 2 is a perspective view of a main part showing a connection structure between a shield member and an electric circuit board according to another embodiment.

【図3】本発明が適用される文書作成装置の外観を示す
斜視図である。
FIG. 3 is a perspective view showing an external appearance of a document creation device to which the present invention is applied.

【図4】従来のシールド構造を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional shield structure.

【図5】従来のシールド構造を示す斜視図である。FIG. 5 is a perspective view showing a conventional shield structure.

【符号の説明】[Explanation of symbols]

1 シールド部材 2 電気回路基板 3 上ケース 4 下ケース 5 筐体 6 固定部 7 取付け部 8 ビス 9 導電体部材 10 文書作成装置 DESCRIPTION OF SYMBOLS 1 shield member 2 electric circuit board 3 upper case 4 lower case 5 housing 6 fixing part 7 mounting part 8 screw 9 conductor member 10 document preparation device

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 電波シールドを行なうシールド部材で覆
われた電気回路基板を有する電子機器であって、前記シ
ールド部材はメッシュ状の導電体を絶縁体により前記メ
ッシュの穴を残すように被覆したものからなり、前記導
電体は前記基板のアース部に電気的に接続されることを
特徴とする電子機器。
1. An electronic device having an electric circuit board covered with a shield member for radio wave shielding, wherein the shield member is formed by covering a mesh-shaped conductor with an insulator so as to leave holes in the mesh. The electronic device is characterized in that the conductor is electrically connected to a ground portion of the substrate.
JP30220491A 1991-11-19 1991-11-19 Electronic apparatus Pending JPH05145269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30220491A JPH05145269A (en) 1991-11-19 1991-11-19 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30220491A JPH05145269A (en) 1991-11-19 1991-11-19 Electronic apparatus

Publications (1)

Publication Number Publication Date
JPH05145269A true JPH05145269A (en) 1993-06-11

Family

ID=17906200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30220491A Pending JPH05145269A (en) 1991-11-19 1991-11-19 Electronic apparatus

Country Status (1)

Country Link
JP (1) JPH05145269A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175634A (en) * 2010-01-27 2011-09-08 Huawei Device Co Ltd Data card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175634A (en) * 2010-01-27 2011-09-08 Huawei Device Co Ltd Data card
US8611079B2 (en) 2010-01-27 2013-12-17 Huawei Device Co., Ltd. Data card

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