JPH07202465A - High frequency appliance - Google Patents
High frequency applianceInfo
- Publication number
- JPH07202465A JPH07202465A JP33652693A JP33652693A JPH07202465A JP H07202465 A JPH07202465 A JP H07202465A JP 33652693 A JP33652693 A JP 33652693A JP 33652693 A JP33652693 A JP 33652693A JP H07202465 A JPH07202465 A JP H07202465A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- plate
- frame plate
- side frame
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はチューナ等の高周波機器
に関し、詳しくはその筐体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency device such as a tuner, and more particularly to a housing thereof.
【０００２】[0002]
【従来の技術】チューナ等の高周波機器の一例を図３を
参照して次に示すと、（１）はシールド用蓋板、（２）
は絶縁性プリント基板、（３）はシールド用側枠板、
（４）はシールド用底板である。上記蓋板（１）は金型
にて金属を折曲成形してなり、四辺に固定用屈曲片（1
a）…を設ける。プリント基板（２）は電子部品（５）
…が実装される。側枠板（３）は金属を矩形枠状に折曲
成形したものである。底板（４）は金型にて金属を折曲
成形してなり、四辺に固定用屈曲片（4a）…を設ける。2. Description of the Related Art An example of a high frequency device such as a tuner will be described below with reference to FIG.
Is an insulating printed circuit board, (3) is a side frame plate for shielding,
(4) is a bottom plate for shielding. The lid plate (1) is formed by bending a metal with a mold, and the fixing bending pieces (1
a) ... is provided. Printed circuit board (2) is electronic component (5)
... is implemented. The side frame plate (3) is formed by bending metal into a rectangular frame shape. The bottom plate (4) is formed by bending a metal with a mold, and the fixing bending pieces (4a) are provided on the four sides.
【０００３】上記構成において、上記プリント基板
（２）上にチューナ用電子部品（５）…を実装して側枠
板（３）内に収納し、その上下開口に蓋板（１）及び底
板（４）を被嵌して閉蓋し、更に各屈曲片（1a）（4a）
により弾圧的に固定してシールドする。In the above structure, electronic components (5) for a tuner are mounted on the printed circuit board (2) and housed in the side frame plate (3), and the lid plate (1) and the bottom plate ( 4) Fit and close the lid, and then bend each bent piece (1a) (4a)
It is elastically fixed and shielded by.
【０００４】[0004]
【発明が解決しようとする課題】解決しようとする課題
は、セット組み込み時に他の電子ブロックと干渉しない
ように高周波機器用電子部品（５）…を側枠板（３）内
に収納すると共に、上下開口に蓋板（１）及び底板
（４）を被嵌して全周囲をシールドしているため、部品
点数が多く、小型化及び軽量化し難く、セットの軽薄短
小化を妨げ、且つ、組み立ても困難となり、更に、成形
金型は高価で低価格化を妨げる点である。The problem to be solved is to house the high-frequency equipment electronic parts (5) in the side frame plate (3) so as not to interfere with other electronic blocks when the set is assembled. Since the lid plate (1) and the bottom plate (4) are fitted in the upper and lower openings to shield the entire circumference, the number of parts is large, and it is difficult to reduce the size and weight of the set. In addition, the molding die is expensive and hinders cost reduction.
【０００５】[0005]
【課題を解決するための手段】本発明は、表面にシール
ド用導電層を被着形成した蓋板用第１プリント基板と、
裏面にシールド用導電層を被着形成した底板用第２プリ
ント基板と、上下開口が上記第１、第２プリント基板に
より上記導電層を外方に向けて閉蓋及び固定された矩形
枠状導電板からなるシールド用側枠板とを具備し、第
１、第２プリント基板の各非シールド面の一方又は両方
に電子部品を実装して側枠板内部に上記電子部品を収納
したことを特徴とする。According to the present invention, there is provided a first printed circuit board for a cover plate, the surface of which is formed a conductive layer for shielding as a cover.
A second printed circuit board for bottom plate having a conductive layer for shield formed on the back surface thereof, and a rectangular frame-shaped conductive material whose upper and lower openings are closed and fixed by the first and second printed circuit boards with the conductive layer facing outward. A side frame plate for shielding made of a plate, wherein electronic components are mounted on one or both of the non-shielding surfaces of the first and second printed circuit boards and the electronic components are housed inside the side frame plate. And
【０００６】[0006]
【作用】上記技術的手段によれば、外表面にシールド用
導電層を形成した第１、第２プリント基板の各非シール
ド面の一方又は両方に電子部品を実装し、第１、第２プ
リント基板で導電層を外方に向けてシールド用側枠板の
上下開口を閉蓋して側枠板内に電子部品を収納し、上記
両プリント基板の各外表面を接地すると、両プリント基
板によってシールドされ、シールド用金属板が不要とな
る。According to the above technical means, the electronic component is mounted on one or both of the non-shielding surfaces of the first and second printed circuit boards having the conductive layer for shielding formed on the outer surface, and the first and second printed boards are mounted. With the board facing the conductive layer outward, the upper and lower openings of the shield side frame plate are closed to store the electronic components in the side frame plate, and the outer surfaces of the both printed circuit boards are grounded. Shielded, eliminating the need for a shield metal plate.
【０００７】[0007]
【実施例】本発明に係る高周波機器の実施例を図１及び
図２を参照して以下に説明する。まず図１において
（６）は蓋板用第１プリント基板、（７）は底板用第２
プリント基板、（８）は側枠板である。上記第１プリン
ト基板（６）は表面に銅箔を貼り付けることにより導電
薄膜を被着してシールド用導電層（９）を形成したもの
で、裏面にチューナ等の電子部品（５）…を実装する。
第２プリント基板（７）は裏面に銅箔を貼り付けてシー
ルド用導電層（10）を被着形成したもので、表面に電子
部品（５）…を実装する。この時、コイル調整用穴（図
示せず）を必要に応じて第１、第２各プリント基板
（６）（７）の所定位置に適宜、穿設しておく。側枠板
（８）は金属板を矩形枠状に折曲成形したもので、その
上下端面に所定数の固定用爪片（8a）…を形成する。或
いは、側枠板（８）を金属板に代えてモールド樹脂に多
量のシールド用導電粉末を外表面側に集中させて混入し
たものやプリント基板の外側に同じくシールド用銅箔を
貼り付けたもので形成しても良い。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a high frequency device according to the present invention will be described below with reference to FIGS. First, in FIG. 1, (6) is the first printed circuit board for the cover plate, and (7) is the second printed circuit board for the bottom plate.
A printed circuit board, (8) is a side frame plate. The first printed circuit board (6) has a conductive thin film deposited on the front surface by attaching a copper foil to form a conductive layer (9) for shielding, and has an electronic component (5) such as a tuner on the back surface. Implement.
The second printed circuit board (7) has a copper foil attached to the back surface of the second printed circuit board (7) and a conductive layer for shield (10) formed thereon, and the electronic components (5) ... Are mounted on the front surface thereof. At this time, coil adjusting holes (not shown) are appropriately formed at predetermined positions of the first and second printed circuit boards (6) and (7) as needed. The side frame plate (8) is formed by bending a metal plate into a rectangular frame shape, and has a predetermined number of fixing claw pieces (8a) formed on the upper and lower end surfaces thereof. Alternatively, the side frame plate (8) is replaced with a metal plate, and a large amount of conductive powder for shielding is mixed and mixed in the mold resin on the outer surface side, or the same copper foil for shielding is attached to the outside of the printed circuit board. You may form by.
【０００８】上記構成において、第１プリント基板
（６）の裏面及び第２プリント基板（７）の表面にそれ
ぞれ電子部品（５）…を実装すると、実装面を対向させ
て｛導電層（９）（10）を外方に向けて｝側枠板（８）
の上下開口を第１、第２プリント基板（６）（７）で閉
蓋した後、爪片（8a）…を折り曲げて半田付け固定する
ことができる。或いは、第１、第２各プリント基板
（６）（７）の各内面のそれぞれに機械的接続可能な凹
ピンと凸ピンを植設し、第１、第２各プリント基板
（６）（７）によって側枠板（８）を挟持しつつ、上記
凹凸ピンを嵌め合わせて機械的に接続・固定しても良
い。そして、側枠板（８）の内部に電子部品（５）…を
収納し、且つ、第１、第２プリント基板（６）（７）の
各シールド用導電層（９）（10）を接地してシールドす
る。又は、セット基板に機器ブロック毎、半田付けして
接地すると、固定強度及びシールド性が更に向上して高
周波特性が良くなる。In the above structure, when the electronic components (5) are mounted on the back surface of the first printed board (6) and the front surface of the second printed board (7) respectively, the mounting surfaces are opposed to each other {the conductive layer (9). (10) facing outward} Side frame plate (8)
After the upper and lower openings are closed by the first and second printed circuit boards (6) and (7), the claw pieces (8a) can be bent and fixed by soldering. Alternatively, a mechanically connectable concave pin and a convex pin are planted on each inner surface of each of the first and second printed circuit boards (6) (7), and the first and second printed circuit boards (6) (7) Alternatively, the side frame plate (8) may be sandwiched between the concave and convex pins to mechanically connect and fix them. Then, the electronic parts (5) are housed inside the side frame plate (8) and the shield conductive layers (9) and (10) of the first and second printed circuit boards (6) and (7) are grounded. And shield. Alternatively, if each device block is soldered to the set substrate and grounded, the fixing strength and the shielding property are further improved and the high frequency characteristics are improved.
【０００９】この時、側枠板（８）がモールド樹脂やプ
リント基板で形成され、その内面が非シールド面であれ
ば、その面に電子部品（５）…を実装しても良く、又、
図示しないが、第１、第２プリント基板（６）（７）の
間に各基板の電子部品間を電気的に離隔して短絡や干渉
を防止する絶縁シート、例えば紙又は耐熱性絶縁フィル
ム等を介在させても良い。又、第１、第２プリント基板
（６）（７）を機械的に接続・固定する上記凹凸ピンを
金属で形成したり、或いはコネクタケーブル（12）を内
側面に沿って這わせ、第１、第２プリント基板（６）
（７）の各電子部品間を電気的接続する。更に、側枠板
（８）が例えばプリント基板であれば、その内面の非導
電面に配線パターン（図示せず）を形成して第１、第２
プリント基板（６）（７）の各電子部品間を電気的接続
すれば良い。At this time, if the side frame plate (8) is formed of a molding resin or a printed circuit board and the inner surface is a non-shield surface, the electronic parts (5) may be mounted on that surface, or
Although not shown, an insulating sheet, such as paper or a heat-resistant insulating film, which electrically separates the electronic components of the respective boards between the first and second printed boards (6) and (7) to prevent short circuit or interference. May be interposed. In addition, the concave and convex pins for mechanically connecting and fixing the first and second printed circuit boards (6) and (7) may be formed of metal, or the connector cable (12) may be laid along the inner side surface. , Second printed circuit board (6)
(7) Each electronic component is electrically connected. Further, if the side frame plate (8) is, for example, a printed circuit board, a wiring pattern (not shown) is formed on the inner non-conductive surface of the side frame plate (8) to form the first and second wiring boards.
The electronic components of the printed circuit boards (6) and (7) may be electrically connected.
【００１０】次に、本発明の他の実施例を図２（ａ）
（ｂ）（ｃ）を参照して説明する。まず図２（ａ）にお
いて（13）は第１枠板、（14）は第２枠板で、第１枠板
（13）は例えば導電粉末を含有したモールド樹脂板を三
方開口のコ字状に形成してなり、その外表面に銅箔等を
貼り付けてシールド用導電層（15）を被着形成し、内面
に電子部品を実装する。第２枠板（14）は第１枠板（1
3）と同様、例えば導電粉末を含有したモールド樹脂板
を三方開口のコ字状に形成してなり、その外表面に銅箔
等を貼り付けてシールド用導電層（16）を被着形成す
る。Next, another embodiment of the present invention is shown in FIG.
This will be described with reference to (b) and (c). First, in FIG. 2A, (13) is a first frame plate, (14) is a second frame plate, and the first frame plate (13) is, for example, a mold resin plate containing conductive powder and has a three-sided U-shape. Then, a copper foil or the like is attached to the outer surface thereof to form a conductive layer for shielding (15) on the outer surface, and electronic components are mounted on the inner surface. The second frame plate (14) is the first frame plate (1
Similar to 3), for example, a mold resin plate containing conductive powder is formed into a U-shape with a three-way opening, and copper foil or the like is attached to the outer surface thereof to form the conductive layer for shielding (16). .
【００１１】そこで、上述したように、第１枠板（13）
の内面に電子部品を実装した後、その三方開口に第２枠
板（14）を嵌めて閉蓋して固定し、内部に電子部品を収
納すると、上記シールド用導電層を接地して全面シール
ドする。或いは、第１枠板（13）の開口近傍にスペーサ
用導電性支柱（17）を植設し、支柱（17）によって第
１、第２（13）（14）の各電子部品を電気的接続しつつ
第２枠板（14）に代えて三方開口に導電テープを巻き付
けて全面シールドしても良い。Therefore, as described above, the first frame plate (13)
After mounting the electronic parts on the inner surface of the, the second frame plate (14) is fitted into the three-sided opening to close and fix it, and when the electronic parts are housed inside, the conductive layer for shield is grounded and the whole surface is shielded. To do. Alternatively, spacer conductive columns (17) are planted near the opening of the first frame plate (13), and the columns (17) electrically connect the first and second (13) (14) electronic components. However, instead of the second frame plate (14), a conductive tape may be wound around the three-way opening to shield the entire surface.
【００１２】又、図２（ｂ）に示すように、外表面に銅
箔を貼り付けてシールド層を形成した絶縁性基板（18）
（19）の片方の各端面間を導電性フレキシブルシート
（20）で結合して閉口し、基板内面に電子部品を実装し
ても良い。この場合も上記同様、スペーサ用支柱（21）
を植設し、三方開口に導電テープを巻き付けて全面シー
ルドすれば良い。Further, as shown in FIG. 2 (b), an insulating substrate (18) having a shield layer formed by sticking a copper foil on the outer surface thereof.
It is also possible to mount the electronic parts on the inner surface of the substrate by connecting the end faces of one of (19) with a conductive flexible sheet (20) and closing the ends. In this case as well, the same as the above, the column for the spacer (21)
Should be planted, and conductive tape should be wrapped around the three-way openings to shield the entire surface.
【００１３】更に、図１に示すように、独立した異なる
高周波機器ブロックの側枠板（８）の外側面に機械的接
続可能な電気的接続端子板（22）、例えば一組の導電性
凹端子と凸端子、或いはピンとその挿通孔を各機器ブロ
ックのそれぞれに設け、図２（ｃ）に示すように、上記
機器ブロック同士、例えばテレビチューナ（23）とＢＳ
チューナ（24）とを電気的、且つ、機械的に接続・一体
化する。そうすると、それによって２つの独立した回路
ブロックに同時に給電出来、セット基板に這わせる配線
を一部省略出来る。又は、電気的接続端子板（22）に代
えてコネクタピン（11）を上記外側面に取り付けても良
い。Further, as shown in FIG. 1, an electrical connection terminal plate (22) capable of being mechanically connected to the outer side surface of the side frame plate (8) of a different high frequency equipment block, for example, a set of conductive recesses. A terminal and a convex terminal, or a pin and its insertion hole are provided in each of the device blocks, and as shown in FIG. 2C, the device blocks are connected to each other, for example, the TV tuner (23) and the BS.
The tuner (24) is connected and integrated electrically and mechanically. By doing so, it is possible to supply power to two independent circuit blocks at the same time, and it is possible to omit some wiring that runs along the set board. Alternatively, the connector pin (11) may be attached to the outer surface instead of the electrical connection terminal plate (22).
【００１４】[0014]
【発明の効果】本発明によれば、外表面にシールド用導
電層を形成した第１、第２プリント基板の各非シールド
面の一方又は両方に電子部品を実装し、第１、第２プリ
ント基板でシールド用側枠板の上下開口を導電層を外方
に向けて閉蓋し、上記両プリント基板の各外表面を接地
してシールドしたから、シールド用金属板が不要となっ
て部品点数が減少し、小型化、軽量化及び組立が容易と
なり、且つ、成形金型も不要になって低価格化が実現出
来る。According to the present invention, an electronic component is mounted on one or both of the non-shielding surfaces of the first and second printed circuit boards having the conductive layer for shielding formed on the outer surface, and the first and second printed boards are mounted. Since the upper and lower openings of the shield side frame plate are closed on the board with the conductive layers facing outward, and the outer surfaces of both printed boards are grounded and shielded, the shield metal plate is no longer needed. It is possible to reduce the size, reduce the size and weight, facilitate the assembling, and eliminate the need for a molding die to realize a low price.
【図１】本発明に係る高周波機器の実施例を示す分解斜
視図である。FIG. 1 is an exploded perspective view showing an embodiment of a high-frequency device according to the present invention.
【図２】（ａ）は本発明に係る高周波機器の他の実施例
を示す分解斜視図である。（ｂ）は本発明に係る高周波
機器の他の実施例を示す側面図である。（ｃ）は本発明
に係る高周波機器の他の実施例を示す斜視図である。FIG. 2A is an exploded perspective view showing another embodiment of the high-frequency device according to the present invention. (B) is a side view showing other examples of the high frequency equipment concerning the present invention. (C) is a perspective view showing another embodiment of the high-frequency device according to the present invention.
【図３】本発明に係る高周波機器の実施例を示す分解斜
視図である。FIG. 3 is an exploded perspective view showing an embodiment of the high-frequency device according to the present invention.
６ 第１プリント基板 ７ 第２プリント基板 ８ 側枠板 ９ 導電層 10 導電層 6 First Printed Circuit Board 7 Second Printed Circuit Board 8 Side Frame Board 9 Conductive Layer 10 Conductive Layer
Claims (3)
蓋板用第１プリント基板と、裏面にシールド用導電層を
被着形成した底板用第２プリント基板と、上下開口が上
記第１、第２プリント基板により上記導電層を外方に向
けて閉蓋及び固定された矩形枠状導電板からなるシール
ド用側枠板とを具備したことを特徴とする高周波機器。1. A first printed board for a lid plate having a conductive conductive layer for shield formed on the front surface thereof, a second printed circuit board for a bottom plate having a conductive conductive layer for shield formed on the rear surface thereof, and the upper and lower openings having the first opening. A high-frequency device comprising: a shield side frame plate having a rectangular frame-shaped conductive plate closed and fixed by a second printed circuit board with the conductive layer facing outward.
ルド面の一方又は両方に電子部品を実装してシールド用
側枠板内部に上記電子部品を収納したことを特徴とする
請求項１記載の高周波機器。2. The electronic component is mounted on one or both of the non-shielding surfaces of the first and second printed circuit boards, and the electronic component is housed inside the shield side frame plate. High frequency equipment as described.
樹脂、又は外表面にシールド用導電層を被着形成したプ
リント基板で側枠板を形成したことを特徴とする請求項
１又は２記載の高周波機器。3. The side frame plate according to claim 1, wherein the side frame plate is formed of a mold resin containing a metal or a conductive powder, or a printed circuit board having a conductive layer for shielding attached to the outer surface thereof. High frequency equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33652693A JPH07202465A (en) | 1993-12-28 | 1993-12-28 | High frequency appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33652693A JPH07202465A (en) | 1993-12-28 | 1993-12-28 | High frequency appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07202465A true JPH07202465A (en) | 1995-08-04 |
Family
ID=18300047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33652693A Pending JPH07202465A (en) | 1993-12-28 | 1993-12-28 | High frequency appliance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07202465A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353660A (en) * | 2001-05-28 | 2002-12-06 | Matsushita Electric Ind Co Ltd | Plasma display device |
| WO2006093039A1 (en) * | 2005-03-04 | 2006-09-08 | Murata Manufacturing Co., Ltd. | Irreversible circuit element and communication apparatus |
| JP2006245193A (en) * | 2005-03-02 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Board-to-board connector and mounting structure using board-to-board connector |
| JP2010198216A (en) * | 2009-02-24 | 2010-09-09 | Panasonic Electric Works Co Ltd | Electromagnetic shield for programmable controller |
-
1993
- 1993-12-28 JP JP33652693A patent/JPH07202465A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353660A (en) * | 2001-05-28 | 2002-12-06 | Matsushita Electric Ind Co Ltd | Plasma display device |
| JP2006245193A (en) * | 2005-03-02 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Board-to-board connector and mounting structure using board-to-board connector |
| JP4682646B2 (en) * | 2005-03-02 | 2011-05-11 | パナソニック株式会社 | Implementation body |
| WO2006093039A1 (en) * | 2005-03-04 | 2006-09-08 | Murata Manufacturing Co., Ltd. | Irreversible circuit element and communication apparatus |
| US7567141B2 (en) | 2005-03-04 | 2009-07-28 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication apparatus |
| JP2010198216A (en) * | 2009-02-24 | 2010-09-09 | Panasonic Electric Works Co Ltd | Electromagnetic shield for programmable controller |
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