JP2000307285A - Intermediate frame for circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an intermediate frame which can easily interconnect a plurality of circuit boards and, at the same time, can protect the circuit boards from electrical interference. SOLUTION: An intermediate frame 1 is composed of a nonconductive integrally molded article having a plurality of slots 6 on internal walls 2a and 4a. The slots 6 are formed substantially perpendicularly to circuit boards attached to the frame 1 and respectively fitted with double spring connectors 10, each of which interconnects a plurality of circuit boards. The bow-like contacts of the connectors 10 come into contact with the grounding metallic foil of the circuit boards.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an intermediate frame which provides a means for connecting a plurality of circuit boards separately at intervals and shielding components surrounded by the frame from electric radiation.

[0002]

2. Description of the Related Art The design of electrical equipment, and in particular, the design of portable telephones, generally tends to reduce the number of components and size without sacrificing performance. It has been established to use a frame mounted between a plurality of printed circuit boards (PCBs) to provide the necessary spacing between the circuit boards and to protect it from electromagnetic interference.

[0003] US Patent No. 5,271 to Pesola et al.
The shielding structure disclosed in Japanese Patent No. 056 uses, for example, a ground metal foil of a circuit board together with a conductive frame to which they are fixed for shielding. In such a configuration, interconnection between circuit boards separated by the frame becomes difficult. US Patent No. 5 to Halttunen et al.
The grounded intermediate frame disclosed in 253146 solves some of the difficulties associated with the interconnection between circuit boards.

[0004]

The circuit boards can be easily interconnected while protecting against the electrical interference generated.
There is still a need for an intermediate frame with a simple configuration.

[0005] It is an object of the present invention to provide a combined spacer, RF shield and board-to-board connector, whereby:
The object is to reduce the number of parts and the costs of manufacture and assembly over the prior art.

[0006]

SUMMARY OF THE INVENTION In accordance with the present invention, there is provided an integrally molded article having a plurality of slots on an inner surface of a side wall, the slots being substantially perpendicular to a circuit board mounted to the frame. Accepts and holds a double spring connector that provides interconnection between circuit boards attached to the
A non-conductive frame is obtained that is mounted between circuit boards.

[0007]

Embodiments of the present invention will be described below with reference to the drawings.

Referring to the drawings, an intermediate frame 1 for a circuit board is shown.
It is shown. The illustrated intermediate frame 1 is generally rectangular with end walls 2, 3 and side walls 4, 5. The intermediate frame 1 is manufactured from a non-conductive plastic material, for example, PC / ABS as an integrally molded product. One of the features of this molding is that a number of slots 6 are formed on the inner walls 2a, 3a.
a, 4a, 5a, and screw bosses 7, 8 having holes 7a, 8a, and overhangs 9 are provided on the side walls 4, 5. The purpose of the slot 6 is to enable the double spring connector 10 shown in FIG. 4 to be engaged.

The double spring connector 10 has a central portion 11 which engages the slot 6 and extends from said central portion, bends in the same axial direction, and has arcuate contacts 14, 1 at its distal end.
5 is formed as an integral piece of metal of uniform thickness, having two outer spring members having the same. The double spring connector 10 is made of a conductive material having properties suitable for a spring connector, for example, beryllium copper.
The arcuate contacts 14, 15 may be coated on the surface with gold or rhodium (may be covered with a thin film). Double spring connector 10 is symmetrical with respect to the axis Y-Y ', it can be fitted easily in any order that slot.

The overhangs 9 on the side walls 4, 5 are for receiving a circuit board on the upper surface of the frame. The screw bosses 7, 8 and the holes 7a, 8a allow the frame to be fixed to the upper and lower circuit boards so as to obtain good electrical connections at the correct intervals.

The double spring connector 10 is fitted (pushed) into the slot 6. The desired connection between the upper and lower circuit boards separated by the intermediate frame 1 is made by a double spring connector 10. A double-spring connector is further provided to sufficiently interconnect the circuits between the upper and lower circuit boards fixed to the intermediate frame. This additional double spring connector 10 is connected to the ground metal foil of the upper and lower circuit boards.

A double spring connector 10 is provided in every slot 6.
There is no need to attach. Therefore, most of the components in the intermediate frame 1 are shielded from interfering by the ground metal foils above and below the circuit board between which the intermediate frame is fixed.
This additional shielding is provided by the upper and lower dual spring connectors 10 such that the upper and lower dual spring connectors are grounded to both the upper and lower ground metal foils.

Experiments have shown that a double-spring connector connected to the grounded metal foil of the circuit board fixed to the intermediate frame, provided at every fifth slot, can provide a sufficient level of protection from the generated interference. did. The dimensions of the components used in the experiments are such that the double spring connector is connected to the ground metal foil of the circuit board fixed to the intermediate frame at least every 1 cm.

Referring to FIG. 5, which illustrates the inner wall of the intermediate frame, it can be seen that the lower portion of the slot 6 is wider than its upper portion. During the manufacture of the intermediate frame, the double spring connector 10 is
It can be pushed under the slot 6 until its movement is restrained. When the movement of the double spring connector 10 is restricted, the double spring connector is held in engagement with the slot 6 due to the elasticity of the synthetic resin forming the intermediate frame.

The use of the intermediate frame 1 can lead to problems with respect to mutual interference between components or signal conductors stored in or supported by the intermediate frame. However, it has been found that such problems can be adjusted relatively easily by layout design.

[Brief description of the drawings]

FIG. 1 is a diagram showing an intermediate frame.

FIG. 2 is a plan view of an intermediate frame.

FIG. 3 is a side view of the intermediate frame.

FIG. 4 is a diagram showing a double spring connector.

FIG. 5 is a diagram showing an inner wall portion of the intermediate frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Intermediate frame 2,3 End wall 4,5 Side wall 2a, 3a, 4a, 5a Inner wall 6 Slot 7,8 Screw boss 7a, 8a Hole 9 Overhanging part 10 Double spring connector 11 Central part 14,15 Bow-shaped contact

Claims (5)

[Claims] 1. An integrated molding having a plurality of slots on an inner surface of a side wall, wherein the slots are substantially perpendicular to a circuit board mounted on a frame, and wherein the slots are substantially perpendicular to each other. A non-conductive frame mounted between circuit boards that receives and holds the double spring connector making the connection. 2. The non-conductive frame of claim 1, wherein a number of double spring connectors are connected to grounded metal foils of the plurality of circuit boards mounted on the frame. 3. The non-conductive material according to claim 1, wherein a double-spring connector for every five consecutive slots is connected to a ground metal foil of the circuit board attached to the frame. Sex frame. 4. A double-spring connector having a central portion engaged with the slot and two outer springs extending from the central portion and having arcuate contacts at the distal end in the same axial direction. The non-conductive frame according to any one of claims 1 to 3, wherein the non-conductive frame is formed as an integral metal piece having a uniform thickness and a member. 5. The method according to claim 1, wherein each of the double spring connectors is symmetric with respect to a YY ′ axis which is one of its main axes.
5. The non-conductive frame according to any one of 4.