JPH0514519Y2 - - Google Patents

Info

Publication number
JPH0514519Y2
JPH0514519Y2 JP11473788U JP11473788U JPH0514519Y2 JP H0514519 Y2 JPH0514519 Y2 JP H0514519Y2 JP 11473788 U JP11473788 U JP 11473788U JP 11473788 U JP11473788 U JP 11473788U JP H0514519 Y2 JPH0514519 Y2 JP H0514519Y2
Authority
JP
Japan
Prior art keywords
electrode
ceramic substrate
gate electrode
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11473788U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0235453U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11473788U priority Critical patent/JPH0514519Y2/ja
Publication of JPH0235453U publication Critical patent/JPH0235453U/ja
Application granted granted Critical
Publication of JPH0514519Y2 publication Critical patent/JPH0514519Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP11473788U 1988-08-30 1988-08-30 Expired - Lifetime JPH0514519Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11473788U JPH0514519Y2 (fr) 1988-08-30 1988-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11473788U JPH0514519Y2 (fr) 1988-08-30 1988-08-30

Publications (2)

Publication Number Publication Date
JPH0235453U JPH0235453U (fr) 1990-03-07
JPH0514519Y2 true JPH0514519Y2 (fr) 1993-04-19

Family

ID=31355761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11473788U Expired - Lifetime JPH0514519Y2 (fr) 1988-08-30 1988-08-30

Country Status (1)

Country Link
JP (1) JPH0514519Y2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19950026B4 (de) * 1999-10-09 2010-11-11 Robert Bosch Gmbh Leistungshalbleitermodul
JP4626445B2 (ja) * 2004-08-24 2011-02-09 ソニー株式会社 半導体パッケージの製造方法
JP5239736B2 (ja) * 2008-10-22 2013-07-17 株式会社デンソー 電子装置
US9706643B2 (en) * 2014-06-19 2017-07-11 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing the same

Also Published As

Publication number Publication date
JPH0235453U (fr) 1990-03-07

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