JPH051367Y2 - - Google Patents
Info
- Publication number
- JPH051367Y2 JPH051367Y2 JP1593887U JP1593887U JPH051367Y2 JP H051367 Y2 JPH051367 Y2 JP H051367Y2 JP 1593887 U JP1593887 U JP 1593887U JP 1593887 U JP1593887 U JP 1593887U JP H051367 Y2 JPH051367 Y2 JP H051367Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- metal plating
- resin
- cooling water
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 12
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241001397809 Hakea leucoptera Species 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0011—Moulds or cores; Details thereof or accessories therefor thin-walled moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/307—Mould plates mounted on frames; Mounting the mould plates; Frame constructions therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1593887U JPH051367Y2 (US07923587-20110412-C00022.png) | 1987-02-05 | 1987-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1593887U JPH051367Y2 (US07923587-20110412-C00022.png) | 1987-02-05 | 1987-02-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63124108U JPS63124108U (US07923587-20110412-C00022.png) | 1988-08-12 |
| JPH051367Y2 true JPH051367Y2 (US07923587-20110412-C00022.png) | 1993-01-14 |
Family
ID=30807336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1593887U Expired - Lifetime JPH051367Y2 (US07923587-20110412-C00022.png) | 1987-02-05 | 1987-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH051367Y2 (US07923587-20110412-C00022.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007268999A (ja) * | 2006-03-30 | 2007-10-18 | Sakae Chuzosho:Kk | 金型及びその製造方法 |
| FR2941643B1 (fr) * | 2009-01-30 | 2012-03-23 | Arrk Tooling Sermo France | Moule comportant au moins une coque moulante pour le moulage par injection, compression ou techniques similaires, coque moulante equipant le moule, et procede de fabrication du moule. |
-
1987
- 1987-02-05 JP JP1593887U patent/JPH051367Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63124108U (US07923587-20110412-C00022.png) | 1988-08-12 |
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