JPH05136288A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To prevent an integrated circuit from being damaged by removing and attaching the integrated circuit by reducing processes for removing and attaching the integrated circuit during wiring pattern modification wiring work between integrated circuits and for cutting a cover pattern. CONSTITUTION:A substrate 2 is provided to each end part on a case of an integrated circuit package 1 and a plurality of soldering pads 3 are arranged on the substrate 2. Thereby, when a cover pattern is under an integrated circuit package, wiring pattern modification wiring work between integrated circuits can be carried out effectively by using the soldering pad on the case.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an integrated circuit package, and more particularly to a flat-pack type integrated circuit package which is surface-mounted on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, in a flat-pack type integrated circuit, as shown in FIG. 6, a lead pad 13 of an integrated circuit package 12 is soldered to a soldering pad 7 provided on a printed circuit board 8 to be integrated. The circuit package 12 is surface-mounted on the printed board 8. The soldering pad 7 is connected to the through hole 5 through the cover pattern 6, and the through hole 5 is provided to electrically connect the integrated circuit package 12 to a lower layer pattern (not shown) of the printed circuit board 8. Has been.

The leads 13 of the integrated circuit package 12
When the number of leads increases and the distance between the leads 13 becomes finer, the cover pattern 6a for connecting the soldering pad 7 to the through hole 5a provided under the mounted integrated circuit package 12 is also integrated. Circuit package 12
Will be placed below.

In such a conventional flat pack type integrated circuit, the integrated circuit package in which the cover pattern 6a from the soldering pad 7 is mounted when the wiring pattern modification wiring work between the integrated circuit packages 12 is carried out. When it is arranged under 12, the integrated circuit package 12 is once removed from the printed circuit board 8 to cut the cover pattern 6a in accordance with the modified wiring work, the integrated circuit package 12 is printed again after cutting the cover pattern 6a. Since the step of mounting on the substrate 8 is required, there is a problem that if the distance between the leads 13 of the integrated circuit package 12 is small, it may cause damage to the integrated circuit.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the prior art, and reduces the steps of attaching / detaching an integrated circuit and cutting a cover pattern in a wiring pattern rewiring work between integrated circuits. It is an object of the present invention to provide an integrated circuit package capable of preventing damage to the integrated circuit due to attachment / detachment of the integrated circuit.

[0006]

The integrated circuit package according to the present invention is an integrated circuit package formed by housing an integrated circuit in a case, wherein soldering pads are provided on the case.

Another integrated circuit package according to the invention is
An integrated circuit package configured to house an integrated circuit in a case, wherein a soldering pad to which a signal line connected to an external terminal of the corresponding integrated circuit is connected corresponds to each external terminal. And is provided on the case.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention.
In the figure, the integrated circuit package 1 is surface-mounted on the printed circuit board 8 by soldering the leads 4 to the soldering pads 7 provided on the printed circuit board 8.

Soldering pad 7 on printed circuit board 8
Is connected to the through hole 5 through the cover pattern 6, and the through hole 5 is provided to electrically connect the integrated circuit package 1 to a lower layer pattern (not shown) of the printed circuit board 8.

A cover pattern 6a for connecting the soldering pad 7 to a through hole (not shown) provided under the mounted integrated circuit package 1 is arranged under the integrated circuit package 1. There is.

A board 2 is provided on each side of the case of the integrated circuit package 1, and a plurality of soldering pads 3 are arranged on the board 2.

FIG. 2 is a diagram showing a wiring pattern modification wiring work according to an embodiment of the present invention. In the figure, the wiring pattern modification wiring work between integrated circuits when the cover pattern 6a is under the integrated circuit package 1 is shown.

In this case, the leads 4 are removed from the soldering pads 7 and bent, and the leads 4 are soldered together with the wiring 9 to the soldering pads 3 on the case of the integrated circuit package 1.

As a result, the conventional integrated circuit package 1
Is no longer required to be removed from the printed circuit board 8, the cover pattern 6a is cut, and then the integrated circuit package 1 is remounted on the printed circuit board 8. Therefore, even when the cover pattern 6a is under the integrated circuit package 1,
Wiring work for modifying the wiring pattern between integrated circuits can be efficiently performed by using the soldering pad 3 on the case.

FIG. 3 is a perspective view of another embodiment of the present invention, and FIG. 4 is a sectional view of another embodiment of the present invention. In the figure, another embodiment of the present invention shows a solder pad 1 corresponding to each lead 4 on a case of an integrated circuit package 10.
The configuration is the same as that of the embodiment of the present invention except that 1 is provided, and the same components are designated by the same reference numerals.

The same signal as the signal connected to the corresponding lead 4 is connected to the soldering pad 11 provided on the case of the integrated circuit package 10 so as to correspond to each lead 4.

FIG. 5 is a view showing a wiring pattern modification wiring work according to another embodiment of the present invention. In the figure, the wiring pattern modification wiring work between integrated circuits when the cover pattern 6a is under the integrated circuit package 10 is shown.

In this case, the lead 4 is cut at the point A,
The wiring 9 is soldered to the soldering pads 11 on the case of the integrated circuit package 10 corresponding to the leads 4.

As a result, the conventional integrated circuit package 1
0 is removed from the printed circuit board 8 and the cover pattern 6a is cut, and then the integrated circuit package 10 is mounted on the printed circuit board 8
The step of re-mounting is unnecessary. Therefore, even when the cover pattern 6a is under the integrated circuit package 10, the wiring pattern modification wiring work between integrated circuits can be efficiently performed using the soldering pad 11 on the case.

Thus, the integrated circuit packages 1 and 10
By providing the soldering pads 3 and 11 on the case, it is possible to reduce the steps of attaching and detaching the integrated circuit packages 1 and 10 and cutting the cover pattern 6a in the wiring pattern modification wiring work between integrated circuits. Further, since it is not necessary to attach / detach the integrated circuit packages 1 and 10, it is possible to prevent the integrated circuit from being damaged due to the attachment / detachment of the integrated circuit packages 1 and 10, and it is possible to reduce the cost.

[0022]

As described above, according to the present invention, by providing the soldering pad on the case for accommodating the integrated circuit, the integrated circuit can be detached and covered in the wiring pattern modification wiring work between the integrated circuits. It is possible to reduce the step of cutting the pattern and prevent damage to the integrated circuit due to attachment / detachment of the integrated circuit.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a diagram showing a wiring pattern modification wiring work according to an embodiment of the present invention.

FIG. 3 is a perspective view of another embodiment of the present invention.

FIG. 4 is a sectional view of another embodiment of the present invention.

FIG. 5 is a diagram showing a wiring pattern modification wiring work according to an embodiment of the present invention.

FIG. 6 is a perspective view of a conventional example.

[Explanation of symbols]

 1, 10 integrated circuit package 2 substrate 3, 11 soldering pad 4 lead 5 through hole 6, 6a cover pattern 7 soldering pad 8 printed circuit board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/34 Z 9154-4E

Claims (2)

[Claims] 1. An integrated circuit package configured by housing an integrated circuit in a case, wherein soldering pads are provided on the case. 2. An integrated circuit package configured to house an integrated circuit in a case, the soldering pads connected to signal lines connected to external terminals of the corresponding integrated circuit, respectively. An integrated circuit package provided on the case corresponding to each terminal.