JPH05135812A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To miniaturize or high by integrate the area of a thick film resistant board, and rationalize the assembling work by using the same clip reeds. CONSTITUTION:In a hybrid integrated circuit device which includes two or more layers of thick film resistor boards 1 and 1, these thick film resistant boards have reed mounting lands for mounting clip reeds 7 in both side margins, and all of the clip reeds 7 are in the same dimensions, and besides each clip reed 7 has multistage of clamp parts 8 and 9 so as to clamping all thick resistant boards 1 whether it is connected to the reed mounting land or not.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device including two or more layers of thick film resistance substrates.

[0002]

5 to 7 are views showing a conventional hybrid integrated circuit device. FIG. 5 is an overall perspective view, FIG. 6 is a front view thereof, and FIG. 7 is shown in FIGS. FIG. 6 is a partially enlarged perspective view of a clip lead connected to one side edge of a thick film resistance substrate of the hybrid integrated circuit device. In these figures, 1 is a thick film resistance substrate, 2 is a heat sink made of metal such as aluminum, 3 is a silicon-based adhesive, 4 is a clip lead for electrical connection to the outside, 5 is a clip lead 4 by soldering. It is a lead mounting land to be fixed. The lead mounting land 5 is a printed conductor. Reference numeral 6 is a semiconductor element soldered to another land of the thick film resistance substrate 1.

In a hybrid integrated circuit device having a plurality of thick film resistance substrates 1 on which heat-generating semiconductor elements 6 and the like are mounted, two thick film resistance substrates 1 are suitable for a heat sink 2 in order to increase integration within the same projected area. Adhesive 3 is used to form a two-layer structure. The upper and lower thick film resistance substrates may have the same function or different functions. In any case, since the plurality of lead mounting lands 5 are formed along one side edge of the thick film resistance substrate 1, the upper and lower thick film resistance substrates are displaced from each other with respect to the heat sink 2 so that one side edge thereof is formed. And the clip lead 4 is attached.

[0004]

In the conventional hybrid integrated circuit device, the plurality of lead mounting lands 5 of the thick film resistance substrate 1 are collectively formed on one side. Therefore, the conductor pattern leading to them is formed on the thick film resistance substrate 1. When it was formed on the substrate, it crawled over the substrate, and the total area of the conductor pattern became large, which inevitably made the area of the thick film resistor substrate large. Further, since the two-layer thick-film resistance substrates are offset from each other with respect to the heat sink, there is a problem in that two types of clip lead sizes, large and small, must be prepared.

The present invention has been made in order to solve the above problems, and the area of the thick film resistance substrate is reduced or highly integrated, and the same clip lead is used to rationalize the assembling work. The purpose is to

[0006]

A hybrid integrated circuit device according to the present invention is a hybrid integrated circuit device including two or more layers of thick film resistance substrates, and a clip for electrically connecting the thick film resistance substrates to the outside. The lead mounting lands for mounting the leads are formed on both sides of the thick film resistance substrate, and the clip leads of the same size have the clamp portions in the plurality of steps corresponding to the number of the plurality of layers. It is characterized in that the membrane resistance substrate is clamped on both sides and connected to necessary lead mounting lands.

[0007]

According to the present invention, since the lead mounting lands are formed on both sides of the thick film resistance substrate, it is possible to reduce the area of the thick film resistance substrate or to achieve high integration with the same area. Further, by using the same clip lead having the multi-stage clamp portion, it is possible to clamp the multi-layer thick-film resistance substrate in one step, not in each step.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the hybrid integrated circuit device of the present invention will be described below with reference to FIGS. 1 is a perspective view showing an embodiment of the hybrid integrated circuit device of the present invention, and FIG.
Partial enlarged side view around the two-stage clip lead,
3 is a side sectional view of FIG. 2, and FIG. 4 is a partial perspective view of the two-stage clip lead.

In these figures, 1 is a thick film resistor substrate, 2 is
Is a heat sink, 3 is an adhesive, 5 is a lead mounting land, 6 is a semiconductor element, 7 is a two-stage clip lead, 8 is a clamp portion for an upper thick film resistor substrate, and 8 is a clamp for a lower thick film resistor substrate. It is a department.

It will be understood from FIG. 1 that the lead mounting lands 5 are provided on both sides of the thick film resistance substrate 1 in the present invention. For this reason, the length of the conductor pattern on the thick film resistance substrate 1 leading to each lead mounting land 5 is shortened, and the area of the entire thick film resistance substrate 1 is reduced. A semiconductor element 6 is mounted on each of the thick film resistance substrates 1 in the same manner as the conventional one. Two thick film resistance substrates 1 are adhered to the upper and lower surfaces of the heat sink 2 via an adhesive 3 in order to transfer the heat generated therefrom to the heat sink 2. These two thick film resistance substrates are vertically aligned and in the same projection position, and the two-stage clip lead 7 clamps both thick film resistance substrates at the same time by the upper and lower clamp portions 8 and 9. The dimensions of the two-stage clip leads on both sides of the thick film resistance substrate 1 are the same. In the next step, the two-stage clip lead 7 is soldered and fixed to an appropriate lead mounting land 5. The upper and lower clamp portions 8 and 9 of the two-stage clip lead 7 are not always connected to the lead mounting lands 5 of the upper and lower thick film resistance substrates 1 and 1, respectively. In some cases, one of the upper and lower clamp parts is connected to the corresponding lead mounting land 5 of the thick film resistance substrate. That is,
The lead mounting lands 5 do not always exist in each portion of the thick film resistance substrate clamped by each clamp portion of the two-stage clip lead 7. However, an open-end land that is not connected to an electric circuit on the thick film resistance substrate may be provided at that portion.

In the embodiment shown in FIGS. 1 to 4, the heat sink 2 is provided between the two layers of thick film resistance substrates 1 and 1. However, when the heat sink 2 is not required, the thick film resistance substrate is used. It is also possible to mount the two-stage clip leads 7 by surface mounting on both surfaces of the two and positioning them with a spacer that fixes the position between the two layers of thick film resistance substrates 1 and 1. Further, the thick film resistance substrate is not limited to two layers. Therefore, it becomes a multi-stage clip lead. However, the plurality of thick film resistance substrates are in the same projection position, and the multi-stage clip leads are all the same size.

[0012]

As described above, according to the present invention, by forming the clip lead into a multi-stage clip lead, the upper and lower thick film resistance substrates can be simultaneously clamped, and the lead mounting lands are formed on both sides of the thick film resistance substrate. This has the effect of reducing the area of the thick film resistance substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a hybrid integrated circuit device of the present invention.

FIG. 2 is a partially enlarged front view showing an enlarged part of FIG.

FIG. 3 is a partial sectional view showing a part of FIG. 1 in an enlarged manner.

FIG. 4 is an enlarged perspective view showing only one member taken out of FIG.

FIG. 5 is a perspective view showing a conventional hybrid integrated circuit device.

FIG. 6 is a side view of the device of FIG. 5 seen from the side.

FIG. 7 is an enlarged perspective view showing only one member taken out of FIG.

[Explanation of symbols]

 1 Thick Film Resistor Board 2 Heat Sink 3 Adhesive 5 Lead Mounting Land 6 Semiconductor Element 7 Two-stage Clip Lead 8 Upper Clamp 9 Lower Clamp

Claims (1)

[Claims] 1. A hybrid integrated circuit device including two or more layers of thick-film resistance substrate, wherein the thick-film resistance substrate has lead mounting lands on both sides for mounting clip leads for electrical connection to the outside, and The upper and lower thick film resistor boards are in the same projection position, the clip leads are all the same size, and each clip lead clamps the thick film resistor board of each layer regardless of whether it is connected to the lead mounting land or not. A hybrid integrated circuit device having a multi-stage clamp part, wherein the multi-layer thick-film resistance substrate is clamped on both sides by clip leads having the multi-stage clamp part.