JPH0513538B2 - - Google Patents
Info
- Publication number
- JPH0513538B2 JPH0513538B2 JP63082887A JP8288788A JPH0513538B2 JP H0513538 B2 JPH0513538 B2 JP H0513538B2 JP 63082887 A JP63082887 A JP 63082887A JP 8288788 A JP8288788 A JP 8288788A JP H0513538 B2 JPH0513538 B2 JP H0513538B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- sprocket
- tape
- holes
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63082887A JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
| US07/332,608 US4980219A (en) | 1988-04-06 | 1989-03-31 | Carrier tape for bonding IC devices and method of using the same |
| KR1019890004474A KR920005451B1 (ko) | 1988-04-06 | 1989-04-04 | Ic 데바이스를 본딩하기 위한 캐리어 테이프 및 그 사용 방법 |
| US07/580,262 US5019209A (en) | 1988-04-06 | 1990-09-10 | Method of manufacturing and using a carrier tape for bonding IC devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63082887A JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01256138A JPH01256138A (ja) | 1989-10-12 |
| JPH0513538B2 true JPH0513538B2 (enExample) | 1993-02-22 |
Family
ID=13786781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63082887A Granted JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01256138A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100556240B1 (ko) | 1998-07-28 | 2006-03-03 | 세이코 엡슨 가부시키가이샤 | 반도체 장치 제조방법 |
| JP2003282649A (ja) * | 2002-03-27 | 2003-10-03 | Shindo Denshi Kogyo Kk | テープキャリアおよびその製造方法、テープキャリアへの電子部品の実装方法、ならびにテープキャリアパッケージの製造方法 |
| JP4386929B2 (ja) | 2007-04-09 | 2009-12-16 | 日東電工株式会社 | Ｔａｂ用テープキャリアの製造方法 |
-
1988
- 1988-04-06 JP JP63082887A patent/JPH01256138A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01256138A (ja) | 1989-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090222 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090222 Year of fee payment: 16 |