JPH0512207Y2 - - Google Patents

Info

Publication number
JPH0512207Y2
JPH0512207Y2 JP1987179536U JP17953687U JPH0512207Y2 JP H0512207 Y2 JPH0512207 Y2 JP H0512207Y2 JP 1987179536 U JP1987179536 U JP 1987179536U JP 17953687 U JP17953687 U JP 17953687U JP H0512207 Y2 JPH0512207 Y2 JP H0512207Y2
Authority
JP
Japan
Prior art keywords
spool
container body
ridge
fitting ridge
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987179536U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0183769U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987179536U priority Critical patent/JPH0512207Y2/ja
Publication of JPH0183769U publication Critical patent/JPH0183769U/ja
Application granted granted Critical
Publication of JPH0512207Y2 publication Critical patent/JPH0512207Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1987179536U 1987-11-24 1987-11-24 Expired - Lifetime JPH0512207Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987179536U JPH0512207Y2 (fr) 1987-11-24 1987-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987179536U JPH0512207Y2 (fr) 1987-11-24 1987-11-24

Publications (2)

Publication Number Publication Date
JPH0183769U JPH0183769U (fr) 1989-06-05
JPH0512207Y2 true JPH0512207Y2 (fr) 1993-03-29

Family

ID=31471084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987179536U Expired - Lifetime JPH0512207Y2 (fr) 1987-11-24 1987-11-24

Country Status (1)

Country Link
JP (1) JPH0512207Y2 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6152674B2 (fr) * 1984-07-10 1986-11-14 Myoshi Yushi Kk

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6152674B2 (fr) * 1984-07-10 1986-11-14 Myoshi Yushi Kk

Also Published As

Publication number Publication date
JPH0183769U (fr) 1989-06-05

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