JPH05102261A - Burn-in board - Google Patents

Abstract

PURPOSE:To enable the same burn-in boards to be applied to various kinds of ICs by using them in common, where the burn-in boards used in an IC manufacturing process are required to be separately formed when wirings are slightly different from each other even if the same IC socket and the mounting components are used. CONSTITUTION:A burn-in board is composed of a component board 1 mounted with an IC socket 3, mounted components 4, and a power supply GND terminal 5, and a wiring board 2 provided with a mounted component terminal receiving socket 6 and a wiring pattern 7, and the same component board 1 is combined with various kinds of the wiring board 2 of different wiring pattern to replace the other combined board used for a burn-in board, whereby the combined boards can be applied to various kinds of burn-in boards. By this setup, the same burn-in board can be used in common, which is conducive to the reduction of it in manufacturing cost, storage floor area, and manufacturing term.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board, and more particularly, to a general-purpose burn-in board which uses the same mounting parts and is compatible with various wiring patterns having different wirings in a burn-in board used in an IC manufacturing process.

[0002]

2. Description of the Related Art In an IC manufacturing process, a semi-finished product manufactured through a process such as diffusion and assembly is subjected to harsh environmental conditions such as voltage and heat, and an initial defect included in the semi-finished product lot is detected. There is a process called burn-in for the purpose of removing such defective ICs. In this process, a burn-in board and a burn-in dedicated furnace are used.

The burn-in furnace has a function of applying heat to the IC and a function of applying a voltage to the IC, but individual ICs cannot be directly mounted on the IC.

Here, a burn-in board is used to mount individual ICs and mount them in a burn-in furnace.

FIG. 3 is a wiring diagram of an example of a conventional burn-in board, and FIG. 5 is a side view showing its mounting state. FIG. 4 is a wiring diagram of another example of the conventional burn-in board, and FIG. 6 is a side view showing the mounted state of FIG.

5 and 6, the substrate 10 has an IC
The socket 3 and the mounting component 4 are mounted, and wiring is performed from the connector 9 for connecting to the burn-in furnace only via the wiring pattern 7 to realize the wiring shown in FIGS.
These are characterized in that the mounting component 4 and the wiring pattern 7 are mounted on the same substrate 10.

[0007]

In the above-described conventional burn-in board, if the wiring is slightly different even if the same IC socket 3 and mounting component 4 are used, it is necessary to manufacture another board. There are problems that the number of types and the number of boards increase, the manufacturing cost of boards increases, and the storage floor becomes large.

Further, since the manufacturing quantity is large, the manufacturing period becomes long, and it is difficult to obtain the product by a desired delivery date.

An object of the present invention is to provide a burn-in board which solves the above problems, has a small storage floor, and can be manufactured in a short period of time.

[0010]

According to the present invention, there is provided a burn-in board having a component board having an IC socket for mounting a semiconductor integrated circuit device and a mounting component for applying a voltage to a lead of the IC socket. Wiring for electrically connecting the leads of the IC socket and the leads of the mounted component are arranged not on the component substrate but on a wiring substrate provided separately, and the wiring socket to which the leads of the component substrate are attached / detached is wired. It is characterized in that it is provided on the substrate.

[0011]

1 is a side view of a general-purpose burn-in board according to an embodiment of the present invention, and FIG. 2 is a wiring diagram thereof.

1 and 2, in the present embodiment, an IC socket 3, a mounting component 4, and a power source / GND terminal 5 led from a connector 9 for a burn-in dedicated furnace are mounted on a component substrate 1. The mounting component lead 8 is projected to the back surface of the board for connection with the wiring board 2 below.

These correspond to the component board wiring area 1'of FIG. This is characterized in that each mounting component 4 is mounted electrically independently without wiring between the mounting components 4.

A terminal receiving socket 6 for a mounting component 4 is mounted on the wiring board 2, and a wiring pattern 7 for determining the wiring of the component board 1 is provided. This corresponds to the wiring board wiring region 2'of FIG.

The wiring of the component board 1 is determined by connecting the wiring board 2 to the component board 1 so that the mounted component leads 8 of the component board 1 fit into the mounted component terminal receiving sockets 6 of the wiring board 2. It

Also, by replacing the wiring board 2 of the same component board 1 with one having a different wiring pattern, the component board 1 can be a burn-in board with different wiring, and only by changing the wiring board 2. The component board 1 can be any kind of burn-in board within the range of using the same mounted components.

As described above, the general-purpose burn-in board of this embodiment has the component board 1 on which the IC socket 3 for mounting the IC and the mounting component 4 for applying a voltage to the IC socket 3 are mounted.
The component board 1 has a mounting component terminal receiving socket for receiving the leads of the mounting component 4, and the wiring substrate 2 having the pattern wiring 7 for determining the wiring between the mounting components 4 is independently provided and is the same. The component board 1 has a configuration in which various wiring boards 2 are used in combination.

[0018]

As described above, the present invention can be used as a plurality of types of burn-in boards having different wirings even though the same IC socket and mounting parts are used, so that the burn-in board can be shared. Therefore, it is possible to reduce the types and the number of burn-in boards, so that it is possible to reduce the board manufacturing cost and the storage floor, and it is possible to further shorten the manufacturing period.

[Brief description of drawings]

FIG. 1 is a side view showing a burn-in board according to an embodiment of the present invention.

FIG. 2 is a wiring diagram of FIG.

FIG. 3 is a wiring diagram of an example of a conventional burn-in board.

FIG. 4 is a wiring diagram of another example of a conventional burn-in board.

FIG. 5 is a side view showing the mounted state of FIG.

FIG. 6 is a side view showing a mounting state of FIG.

[Explanation of reference signs] 1 component board 1'component board wiring area 2 wiring board 2'wiring board wiring area 3 IC socket 4 mounting component 5 power supply GND terminal 6 mounting component terminal receiving socket 7 wiring pattern 8 mounting component lead 9 burn-in dedicated furnace Connector with 10 board

Claims (1)

[Claims] 1. A burn-in board having a component board having an IC socket for mounting a semiconductor integrated circuit device and a mounting component for applying a voltage to the lead of the IC socket, wherein the lead of the IC socket and the mounting component are mounted on the burn-in board. Wiring for electrically connecting the leads is arranged not on the component board but on a separately provided wiring board, and a wiring socket for attaching and detaching the leads of the component board is provided on the wiring board. board.