JPS5839424Y2 - Test printed board - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a printed board for testing semiconductor integrated circuits (hereinafter referred to as IC), and particularly relates to the structure of a printed board for burn-in testing.

There is a burn-in test in the IC manufacturing process, and in order to guarantee the reliability of the IC, a large number of ICs to be tested are placed in a thermostatic chamber kept at a specified temperature and tested under specified voltage conditions, etc. for a specified period of time. It is something to do.

At this time, the IC to be tested that is placed in the thermostatic chamber is generally a printed board for burn-in test (hereinafter referred to as BT printed board).
The test is carried out on a plurality of IC sockets mounted on the BT printed board, but since the circuit conditions and test conditions for this BT printed board vary depending on the type of IC to be tested, if prepared for each type, the number of BT printed boards varies from tens to hundreds of types. This incurs a large amount of manufacturing and management costs, which increases the production cost of the IC, which is extremely undesirable.

SUMMARY OF THE INVENTION In order to eliminate such drawbacks, it is an object of the present invention to provide a BT printed board in which the BT printed board is made as common as possible and the product type can be selected using a separately provided type switching adapter.

According to the present invention, in a burn-in test printed board on which an IC socket under test is mounted, a socket corresponding to the IC socket under test and a signal source supplied from the outside is mounted, and a pin is provided opposite to the socket pin. A burn-in test printed board is obtained which has a structure in which components can be arbitrarily connected between pins corresponding to the IC socket under test and pins corresponding to the power source, etc., in another printed board.

A detailed description will be given below with reference to the drawings.

FIG. 1 shows an example of a conventional BT circuit. In the same figure, a power supply lL12 and a ground 13 are connected to each pin of the ICs under test 10a to 10c. The other pins are connected to the power supply 12 through a resistor group 20. and is drawn out to the terminal on the printed circuit board.

FIG. 2 shows a perspective view of the BT printed board of the circuit example in FIG. , the pin groups of the IC socket are power supplies 11 and 1, respectively.
2. Wired to the ground 13 or wired to the resistor group 20.

FIG. 3 is a circuit diagram showing an embodiment of the present invention, in which each pin of the IC to be tested 10a to 10c is connected to a socket 50a to 50c with a contact corresponding to the pin.
Type switching adapter 60a-6 via 50e-50g
0b, while the input of the terminal on the IJF board is connected to the type switching adapter via sockets 50d and 50h.

FIG. 4 shows a perspective view of the printed board in FIG.
Each pin of IC sockets 40a to 40c is connected to socket 50a.
50c, 50e to 50g, and power supplies 11, 12 and ground 13 supplied from the terminals of the printed board are wired to the pins of sockets 50a and 50h.

FIG. 5 is a diagram for explaining the product type switching adapter 60a in detail.
Power supplies 11', 12' and ground 13' are wired to a component mounting terminal group 62 via pin groups 61 corresponding to pins 0a to 50d, and are supplied from terminals on the printed board 30.
is wired via a pin group 61 at a position opposite to the component attachment terminal, so that components can be easily attached.

This type switching adapter connects the power pin, ground pin and power supply 11', 12' of the IC under test depending on the type of IC under test.
and ground 13' via a jumper wire, and other pins are connected to a resistor group 20 mounted as required.

As explained above, the present invention is composed of a common printed board and a type switching adapter.

According to the present invention, the BT printed board has the same shape as the test object I.
C, no matter what circuit conditions and test conditions,
By replacing only the product type switching adapter, a BT printed board can be configured, which not only greatly reduces the number of BT printed boards produced for each product type, which was a problem in the past, but also makes management easier as the product type switching adapter is managed separately. It gets cheaper.

Also, if a BT printed board is left under high temperatures for a long time, the characteristics of the resistors used will deteriorate and break.
These inspections and parts replacements can be easily performed, which has extremely large effects.

[Brief explanation of the drawing]

FIG. 1 shows an example of a conventional BT circuit, and FIG. 2 shows a perspective view of a BT printed board constituting the circuit example of FIG. FIG. 3 shows an example of an implementation circuit of the present invention, FIG. 4 is a perspective view of the printed circuit board shown in FIG. 3, and FIG. 5 shows an example of a type switching adapter part. 10a~10c---IC under test, 40a~40c
...IC socket, 50a to 50h...
·socket.

Claims (1)

[Scope of utility model registration request] a first socket into which an IC under test can be inserted onto a printed board; a second socket having a plurality of pins each connected by wiring to each pin of the first socket; The pins of the first and second sockets are equipped with a third socket having a plurality of pins that are not connected by wiring, and by inserting a product switching adapter into the second and third sockets, different product types can be selected. A test printed board characterized by enabling testing.