JPH05138913A - Thermal printing head and its inspection method - Google Patents
Thermal printing head and its inspection methodInfo
- Publication number
- JPH05138913A JPH05138913A JP3332717A JP33271791A JPH05138913A JP H05138913 A JPH05138913 A JP H05138913A JP 3332717 A JP3332717 A JP 3332717A JP 33271791 A JP33271791 A JP 33271791A JP H05138913 A JPH05138913 A JP H05138913A
- Authority
- JP
- Japan
- Prior art keywords
- head
- wiring board
- printed wiring
- head substrate
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 5
- 238000007689 inspection Methods 0.000 title abstract description 3
- 238000007651 thermal printing Methods 0.000 title abstract 2
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000002950 deficient Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、サーマルプリントヘッ
ド及びその検査方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal print head and its inspection method.
【０００２】[0002]
【従来の技術及びその問題点】従来、放熱板上にヘッド
基板とプリント配線板を搭載する際、放熱板上にヘッド
基板とプリント配線板とを両面テープ等で固定した後、
駆動ＩＣをプリント配線板上に搭載するか、ヘッド基板
上に搭載するものがある。2. Description of the Related Art Conventionally, when mounting a head substrate and a printed wiring board on a heat sink, after fixing the head substrate and the printed wiring board on the heat sink with double-sided tape or the like,
Some drive ICs are mounted on a printed wiring board or on a head substrate.
【０００３】前記のような構造の場合、放熱板上にヘッ
ド基板とプリント配線板を固定し、金ワイヤで接続した
後でなければ駆動ＩＣの動作による発熱体への通電確認
が不可能である。さらに、放熱板に固定した後不良判定
となった場合に各部品を再利用することは極めて困難で
ある。In the case of the above-mentioned structure, it is impossible to confirm the energization of the heating element by the operation of the driving IC unless the head substrate and the printed wiring board are fixed on the heat dissipation plate and connected by the gold wire. .. Furthermore, it is extremely difficult to reuse each component when a defect is determined after fixing to the heat sink.
【０００４】[0004]
【発明が解決しようとする課題】サーマルプリントヘッ
ドを構成する放熱板に配置した駆動ＩＣの通電確認を容
易にでき、製品の歩留まりの良好なサーマルプリントヘ
ッド及びその検査方法を提供する。To provide a thermal print head and a method for inspecting the thermal print head, which enables easy confirmation of energization of a drive IC arranged on a heat dissipation plate constituting the thermal print head and has a good product yield.
【０００５】[0005]
【課題を解決するための手段】本発明は、放熱板上にヘ
ッド基板とプリント配線板を固定してなるサーマルプリ
ントヘッドにおいて、前記ヘッド基板を構成する絶縁基
板上に発熱抵抗体及び駆動素子を配置し、該ヘッド基板
内に複数の同一信号ラインをまとめたパターン形成し、
前記各信号ラインと前記駆動素子をワイヤボンディング
により接続後、前記プリント配線板と前記ヘッド基板上
のパターンとをワイヤボンディングにより接続してサー
マルプリントヘッドを構成すると共に、該サーマルプリ
ントヘッドにおいて、前記ヘッド基板上の信号ラインを
まとめたパターンを前記駆動素子とワイヤボンディング
により接続した後、前記駆動素子の動作による前記発熱
抵抗体への通電試験を行い検査することを特徴とするも
のである。SUMMARY OF THE INVENTION The present invention is a thermal print head comprising a heat dissipation plate to which a head substrate and a printed wiring board are fixed, and a heating resistor and a driving element are provided on an insulating substrate constituting the head substrate. A plurality of identical signal lines are arranged in the head substrate to form a pattern,
After connecting each of the signal lines and the driving element by wire bonding, the printed wiring board and the pattern on the head substrate are connected by wire bonding to form a thermal print head, and in the thermal print head, the head is provided. After connecting a pattern in which signal lines on the substrate are combined to the drive element by wire bonding, an energization test to the heating resistor by the operation of the drive element is performed and inspected.
【０００６】[0006]
【実施例】図１は、本発明の１実施例の一部拡大平面図
（図３の点線で囲まれた部分）であって、ヘッド基板を
構成する絶縁基板２上に駆動ＩＣ６を搭載し、該ヘッド
基板２内で同一信号ラインＡ、Ｂ、Ｃ、Ｄをまとめてパ
ターン形成し、前記駆動ＩＣ６と金ワイヤ７で接続す
る。前記信号ラインの一部は駆動ＩＣ６の下側において
ヘッド基板２上に配線され、全体として蛇行して形成さ
れる。そして、前記蛇行して駆動ＩＣ６の下側に配線さ
れていない信号ライン部分と駆動ＩＣ６の各信号ライン
に対応するパッドとが金ワイヤ７で接続される。この状
態で、駆動ＩＣ６の動作による発熱体３（図２）への通
電試験を行ない、良品不良品の判定を行う。なお、図１
において、４は共通配線パターン、８はグランド配線パ
ターンである。1 is a partially enlarged plan view of a first embodiment of the present invention (a portion surrounded by a dotted line in FIG. 3) in which a drive IC 6 is mounted on an insulating substrate 2 which constitutes a head substrate. In the head substrate 2, the same signal lines A, B, C and D are collectively formed into a pattern and connected to the drive IC 6 by the gold wire 7. A part of the signal line is wired on the head substrate 2 below the drive IC 6, and is formed in a meandering shape as a whole. Then, the signal line portion which is not wired below the drive IC 6 meandering and the pad corresponding to each signal line of the drive IC 6 are connected by the gold wire 7. In this state, an energization test is performed on the heating element 3 (FIG. 2) by the operation of the drive IC 6 to determine a non-defective product or a defective product. Note that FIG.
In the figure, 4 is a common wiring pattern, and 8 is a ground wiring pattern.
【０００７】そして、図２の断面図及び図３の分解斜視
図に示すように、前記良品と判定されたヘッド基板１を
放熱板１０に接着材１２で固定し、コネクタピン１４ａ
を有するコネクタ１４を取り付けたプリント配線板１１
を、固定ネジ１６で固定ネジ用挿通穴１１ｂに螺合して
放熱板１０に固定する。さらに、ヘッド基板１上の前記
信号ラインパターンＡ乃至Ｄにワイヤボンディング部１
３となる共通端子４ａ，接続端子５、グランド端子８ａ
の櫛歯状端子部２ａを形成し、プリント配線板１１上の
櫛歯状端子部１１ａと金ワイヤ７でワイヤボンディング
する。その後再度プリント配線板１１から通電確認を行
ない、良品と判定されたものは接続部をレジン９でコー
トする。Then, as shown in the cross-sectional view of FIG. 2 and the exploded perspective view of FIG. 3, the head substrate 1 which is determined to be a non-defective product is fixed to the heat dissipation plate 10 with the adhesive material 12, and the connector pin 14a is formed.
Printed wiring board 11 with connector 14 having
Is fixed to the heat dissipation plate 10 by screwing it into the fixing screw insertion hole 11b with the fixing screw 16. Further, the wire bonding portion 1 is formed on the signal line patterns A to D on the head substrate 1.
3 common terminal 4a, connection terminal 5, ground terminal 8a
The comb-teeth-shaped terminal portion 2a is formed, and the comb-teeth-shaped terminal portion 11a on the printed wiring board 11 is wire-bonded with the gold wire 7. After that, the energization of the printed wiring board 11 is checked again, and if it is determined as a non-defective product, the connection portion is coated with the resin 9.
【０００８】前記両通電試験で良品と判定されたもの
は、樹脂カバー１５に形成した固定ピン１５ａを放熱板
１０に形成した１０ｂに挿入して固定する。If it is judged as a non-defective product by the above-mentioned both-energization test, the fixing pin 15a formed on the resin cover 15 is inserted into and fixed to the 10b formed on the heat dissipation plate 10.
【０００９】[0009]
【発明の効果】（１）従来のヘッド基板とプリント配線
板を使用する方法に比べ、放熱板にヘッド基板を固定す
る前にドライバーＩＣの動作による発熱体への通電確認
が可能なため、完成品としての歩留まりが向上する。 （２）ヘッド基板上で同一信号ラインをまとめるので、
プリント配線基板を小型化できる。 （３）金属性カバーを使用しないため、発熱による反り
が極めて少ない。(1) Compared with the conventional method using a head substrate and a printed wiring board, it is possible to confirm the energization of the heating element by the operation of the driver IC before fixing the head substrate to the heat dissipation plate. The yield as a product is improved. (2) Since the same signal lines are put together on the head substrate,
The printed wiring board can be miniaturized. (3) Since a metallic cover is not used, warpage due to heat generation is extremely small.
【図１】本発明の一部拡大平面図である。FIG. 1 is a partially enlarged plan view of the present invention.
【図２】本発明の断面図である。FIG. 2 is a sectional view of the present invention.
【図３】本発明の分解斜視図である。FIG. 3 is an exploded perspective view of the present invention.
１・・ヘッド基板 ２・・絶縁基板 ３・・発熱抵抗体
４・・共通配線パターン ５・・接続端子 ６・・駆
動用ＩＣ ７・・金ワイヤ ８・・グランド用配線パタ
ーン ９・・レジン １０・・放熱板 １１・・プリン
ト配線板 １２・・接着剤 １３・・ワイヤボンディン
グ部 １４・・コネクタ １５・・樹脂カバー1-. Head substrate 2-- Insulating substrate 3-- Heating resistor 4-- Common wiring pattern 5-- Connection terminal 6- Driving IC 7- Gold wire 8- Ground wiring pattern 9- Resin 10 ..Heat sink 11..Printed wiring board 12..Adhesive 13..Wire bonding part 14..Connector 15..Resin cover
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ４１Ｊ 29/46 Ｇ 8804−2Ｃ 9113−2Ｃ Ｂ４１Ｊ 3/20 １１４ Ｇ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location B41J 29/46 G 8804-2C 9113-2C B41J 3/20 114 G
Claims (2)
を固定してなるサーマルプリントヘッドにおいて、前記
ヘッド基板を構成する絶縁基板上に発熱抵抗体及び駆動
素子を配置し、該ヘッド基板内に複数の同一信号ライン
をまとめたパターンを形成し、前記各信号ラインと前記
駆動素子をワイヤボンディングにより接続後、前記プリ
ント配線板と前記ヘッド基板上のパターンとをワイヤボ
ンディングにより接続したことを特徴とするサーマルプ
リントヘッド。1. A thermal print head having a head substrate and a printed wiring board fixed on a heat dissipation plate, wherein a heating resistor and a driving element are arranged on an insulating substrate constituting the head substrate, and the head substrate is provided inside the head substrate. A pattern in which a plurality of identical signal lines are combined is formed, and after connecting each signal line and the drive element by wire bonding, the printed wiring board and the pattern on the head substrate are connected by wire bonding. Thermal print head.
いて、前記ヘッド基板上の信号ラインをまとめたパター
ンを前記駆動素子とワイヤボンディングにより接続した
後、前記駆動素子の動作による前記発熱抵抗体への通電
試験を行うことを特徴とするサーマルプリントヘッドの
検査方法。2. The thermal print head according to claim 1, wherein after connecting a pattern of signal lines on the head substrate to the driving element by wire bonding, the heating element is energized by the operation of the driving element. A method for inspecting a thermal print head, which comprises performing a test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3332717A JP2561590B2 (en) | 1991-11-22 | 1991-11-22 | Thermal print head inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3332717A JP2561590B2 (en) | 1991-11-22 | 1991-11-22 | Thermal print head inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05138913A true JPH05138913A (en) | 1993-06-08 |
| JP2561590B2 JP2561590B2 (en) | 1996-12-11 |
Family
ID=18258080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3332717A Expired - Fee Related JP2561590B2 (en) | 1991-11-22 | 1991-11-22 | Thermal print head inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561590B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021170984A (en) * | 2020-04-23 | 2021-11-01 | 株式会社シマノ | Fishing tackle |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146139U (en) * | 1983-03-22 | 1984-09-29 | セイコーインスツルメンツ株式会社 | Driver-IC mounted recording/display element |
| JPS61230961A (en) * | 1985-04-08 | 1986-10-15 | Nec Corp | Thin film thermal head |
| JPS62121070A (en) * | 1985-11-22 | 1987-06-02 | Hitachi Ltd | Thermal head |
| JPH023343A (en) * | 1988-06-17 | 1990-01-08 | Aisin Seiki Co Ltd | Thermal head |
| JPH02108561A (en) * | 1988-10-19 | 1990-04-20 | Rohm Co Ltd | Thermal head |
| JPH04126858U (en) * | 1991-05-13 | 1992-11-18 | 株式会社タムラ製作所 | Thick film thermal head |
-
1991
- 1991-11-22 JP JP3332717A patent/JP2561590B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146139U (en) * | 1983-03-22 | 1984-09-29 | セイコーインスツルメンツ株式会社 | Driver-IC mounted recording/display element |
| JPS61230961A (en) * | 1985-04-08 | 1986-10-15 | Nec Corp | Thin film thermal head |
| JPS62121070A (en) * | 1985-11-22 | 1987-06-02 | Hitachi Ltd | Thermal head |
| JPH023343A (en) * | 1988-06-17 | 1990-01-08 | Aisin Seiki Co Ltd | Thermal head |
| JPH02108561A (en) * | 1988-10-19 | 1990-04-20 | Rohm Co Ltd | Thermal head |
| JPH04126858U (en) * | 1991-05-13 | 1992-11-18 | 株式会社タムラ製作所 | Thick film thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021170984A (en) * | 2020-04-23 | 2021-11-01 | 株式会社シマノ | Fishing tackle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2561590B2 (en) | 1996-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |