JPH049842B2 - - Google Patents
Info
- Publication number
- JPH049842B2 JPH049842B2 JP15787A JP15787A JPH049842B2 JP H049842 B2 JPH049842 B2 JP H049842B2 JP 15787 A JP15787 A JP 15787A JP 15787 A JP15787 A JP 15787A JP H049842 B2 JPH049842 B2 JP H049842B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- layer
- alloy
- sintering
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15787A JPS63169307A (ja) | 1987-01-06 | 1987-01-06 | W又はW合金/Mo又はMo合金張り合わせ材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15787A JPS63169307A (ja) | 1987-01-06 | 1987-01-06 | W又はW合金/Mo又はMo合金張り合わせ材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63169307A JPS63169307A (ja) | 1988-07-13 |
| JPH049842B2 true JPH049842B2 (OSRAM) | 1992-02-21 |
Family
ID=11466203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15787A Granted JPS63169307A (ja) | 1987-01-06 | 1987-01-06 | W又はW合金/Mo又はMo合金張り合わせ材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169307A (OSRAM) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT4240U1 (de) | 2000-11-20 | 2001-04-25 | Plansee Ag | Verfahren zur herstellung einer verdampfungsquelle |
| US9677170B2 (en) | 2007-02-09 | 2017-06-13 | Jx Nippon Mining & Metals Corporation | Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same |
| JP6258040B2 (ja) * | 2014-01-14 | 2018-01-10 | 株式会社アライドマテリアル | サファイア単結晶育成用坩堝、サファイア単結晶育成方法およびサファイア単結晶育成用坩堝の製造方法 |
| CN110293223B (zh) * | 2019-07-23 | 2022-03-22 | 金堆城钼业股份有限公司 | 一种蝶形钼钨双金属复合旋转靶的制备方法 |
| CN114959596B (zh) * | 2021-12-23 | 2023-12-05 | 常州苏晶电子材料有限公司 | 钼合金包覆热成型工艺 |
-
1987
- 1987-01-06 JP JP15787A patent/JPS63169307A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63169307A (ja) | 1988-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |