JPH049842B2 - - Google Patents
Info
- Publication number
- JPH049842B2 JPH049842B2 JP15787A JP15787A JPH049842B2 JP H049842 B2 JPH049842 B2 JP H049842B2 JP 15787 A JP15787 A JP 15787A JP 15787 A JP15787 A JP 15787A JP H049842 B2 JPH049842 B2 JP H049842B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- layer
- alloy
- sintering
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 22
- 229910001080 W alloy Inorganic materials 0.000 claims description 17
- 238000005245 sintering Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 claims description 11
- 239000002648 laminated material Substances 0.000 claims description 11
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 9
- 238000005242 forging Methods 0.000 claims description 6
- 238000004663 powder metallurgy Methods 0.000 claims description 5
- 238000005336 cracking Methods 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、主としてX線管用ターゲツトの材料
として用いられるW又はW合金/Mo又はMo合
金張り合わせ材料の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a W or W alloy/Mo or Mo alloy laminate material, which is mainly used as a material for a target for an X-ray tube.
[従来の技術]
一般に、X線管用ターゲツトは、その特性とし
て、高負荷に耐え、且つ、高融点であることが要
求される。そこで、従来はRe−W/Moを張り合
わせ材料をX線管用ターゲツトとして用いてい
た。[Prior Art] In general, targets for X-ray tubes are required to withstand high loads and have a high melting point. Therefore, conventionally, a Re-W/Mo laminated material was used as a target for an X-ray tube.
ここで、第2図に示すとおり、Re−W/Mo張
り合わせ材料の製造方法を説明する。 Here, as shown in FIG. 2, a method for manufacturing the Re-W/Mo laminated material will be described.
まず、Mo粉末の層1上に厚さ約4mmの5%Re
−Wの粉末層2を設けてなる粉末体を得る為に、
3〜6ton/cm2の圧力のプレスを加える粉末プレス
工程a、これを1800〜2000℃の温度で焼結する焼
結工程b、焼結体をさらに、熱間鍛造率30〜50%
で鍛造する熱間鍛造工程c、鍛造した張り合わせ
材を図示するように成形する熱間成形工程d、最
後に、φ70〜100mm×t5〜10mmの寸法に切削して
製品とする製品切削工程eを経ることにより、
Mo層7及びRe−W合金層8からなるRe−W/
Mo張り合わせ材料を製造している。 First, 5% Re with a thickness of about 4 mm was placed on layer 1 of Mo powder.
- In order to obtain a powder body provided with a powder layer 2 of W,
Powder pressing step a which applies pressing at a pressure of 3 to 6 ton/cm 2 , sintering step b which sinters this at a temperature of 1800 to 2000°C, and the sintered body is further hot forged at a rate of 30 to 50%.
A hot forging step c in which the forged laminate is forged, a hot forming step d in which the forged laminate is formed as shown in the diagram, and finally a product cutting step e in which the product is cut into dimensions of φ70 to 100 mm x T5 to 10 mm. By going through
Re-W/ consisting of Mo layer 7 and Re-W alloy layer 8
Manufactures Mo laminate materials.
[発明が解決しようとする問題点]
ところで、近年、ターゲツトの特性を向上させ
るために、ターゲツト自身を大型化(大径化、厚
板化)して、ターゲツトの蓄熱容量を大きくする
方法が採用される傾向がある。[Problems to be solved by the invention] In recent years, in order to improve the characteristics of a target, a method has been adopted in which the target itself is made larger (larger diameter, thicker plate) to increase the heat storage capacity of the target. There is a tendency to
従来の製造方法では3ton/cm2のプレス圧力及
び、1800℃の焼結温度が塑性加工が可能な焼結体
を得る為の最低必要条件である。 In the conventional manufacturing method, a press pressure of 3 ton/cm 2 and a sintering temperature of 1800°C are the minimum requirements for obtaining a sintered body that can be plastically worked.
しかしながら、大径化、厚板化(φ120〜180mm
×t10〜20mm)されるに従い、粉末材料をプレス
する際に、プレス圧力の伝ぱんに不均一が生じ易
く、また、装置の大型化を招く等の不都合があつ
た。 However, larger diameter and thicker plates (φ120 to 180 mm)
xt10 to 20 mm), there were disadvantages such as non-uniformity in the spread of press pressure when pressing powder materials and an increase in the size of the apparatus.
しかも、このような圧力のばらつきに起因し
て、その後の工程である鍛造、圧延及び成形工程
において、材料割れ、特に、Re−W層に割れ等
の異常が生じ、歩留りが0〜70%と低いという欠
陥があつた。 Moreover, due to such pressure variations, abnormalities such as material cracking, especially cracking in the Re-W layer, occur in the subsequent forging, rolling, and forming processes, resulting in a yield rate of 0 to 70%. The flaw was that it was low.
また、焼結工程において、1800℃以上の高温で
焼結するため、W又はW合金層の表面が焼結炉の
炉材や高温不純物等の異物に汚染され、或いは、
表面の微小クラツクや、微小な異物の付着により
表面の結晶組織の異常を招き、結果的に割れの原
因ともなつている。 In addition, in the sintering process, since sintering is performed at a high temperature of 1800°C or higher, the surface of the W or W alloy layer may be contaminated with foreign substances such as the furnace material of the sintering furnace or high-temperature impurities, or
Microcracks on the surface and adhesion of microscopic foreign matter lead to abnormalities in the surface crystal structure, which eventually causes cracks.
そこで、本発明の目的は、上記欠点に鑑み、製
造装置を大型化することなく、材料割れ及び異物
汚染を除去し、材料の大型化及び厚板化の要請に
合致したW又はW合金/Mo又はMo合金張り合
わせ材料の製造方法を提供することである。 SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks, an object of the present invention is to eliminate material cracking and foreign matter contamination without increasing the size of manufacturing equipment, and to meet the demands for larger and thicker materials using W or W alloy/Mo Another object of the present invention is to provide a method for producing a Mo alloy laminated material.
[問題点を解決するための手段]
本発明によれば、Mo又はMo合金の粉末上に
W又はW合金の粉末を設けてなる粉末材料と、該
粉末材料上に設けてなるMo粉末とに対し、プレ
ス・焼結する粉末冶金工程を施すことにより、粉
末材料より生成される材料層と、Mo粉末より生
成される被覆層とを形成した後、材料層及び被覆
層に熱間鍛造及び熱間成形を施し、材料層を削除
するW又はW合金/Mo又はMo合金張り合わせ
材料の製造方法が得られる。[Means for Solving the Problems] According to the present invention, a powder material in which W or W alloy powder is provided on Mo or Mo alloy powder, and a Mo powder in which W or W alloy powder is provided on the powder material. On the other hand, by performing a powder metallurgy process of pressing and sintering, a material layer generated from the powder material and a coating layer generated from Mo powder are formed, and then the material layer and the coating layer are hot-forged and heated. A method for manufacturing a W or W alloy/Mo or Mo alloy laminate material is obtained in which interforming is performed and a material layer is deleted.
殊に、本発明は、難加工性材料であるW、W合
金(Re−W、ThO2−W、Ru−W、ZrO2−W等)
とMo、Mo合金(Hf−Mo、ZrO2−Mo、Al2O3
−Mo、C0−M0等)とからなる張り合わせ材料の
製造過程、特に鍛造、圧延等の塑性加工中におけ
る材料割れを防止するために、この張り合わせ材
料の出発原料であるW又はW合金/Mo又はMo
合金からなる粉末材料を、純Mo粉末で覆つたも
のに対し、プレス・焼結する粉末冶金工程を施す
ことで材料層及び被覆層を形成することを要件と
している。 In particular, the present invention is applicable to W and W alloys (Re-W, ThO 2 -W, Ru-W, ZrO 2 -W, etc.), which are difficult-to-process materials.
and Mo, Mo alloys (Hf−Mo, ZrO 2 −Mo, Al 2 O 3
-Mo, C 0 -M 0, etc.) In order to prevent material cracking during the manufacturing process of the laminate material, especially during plastic working such as forging and rolling, W or W alloy, which is the starting material of the laminate material, is Mo or Mo
The requirement is to form a material layer and a coating layer by applying a powder metallurgy process of pressing and sintering a powder material made of an alloy covered with pure Mo powder.
[実施例]
本発明のW又はW合金/Mo又はMo合金張り
合わせ材料の製造方法に関する実施例について図
面を参照して説明する。[Example] An example of the method for manufacturing a W or W alloy/Mo or Mo alloy laminate material of the present invention will be described with reference to the drawings.
まず、プレス後で層厚29.0mm、平均粒径3.8μm
のMo粉末層1上に、プレス後で層厚4.0mm、平均
粒径2.0μmの5%Re−W粉末層2を設けてなる
φ150mmの粉末材料3と、この粉末材料3上を被
覆するように設けられたプレス後で層厚2.0mm、
平均粒径3.8μmの純Mo粉末4とを準備する。 First, after pressing, the layer thickness is 29.0 mm, and the average grain size is 3.8 μm.
After pressing, a 5% Re-W powder layer 2 with a layer thickness of 4.0 mm and an average particle diameter of 2.0 μm was provided on a Mo powder layer 1 of Layer thickness 2.0mm after press provided in
Pure Mo powder 4 with an average particle size of 3.8 μm is prepared.
粉末プレス工程aにおいて、準備した粉末材料
3と純Mo粉末4とを同時にプレス圧力2ton/cm2
でプレスする。 In powder pressing step a, the prepared powder material 3 and pure Mo powder 4 are simultaneously pressed at a pressure of 2 ton/cm 2
Press with.
尚、材料粉末3を被覆する純Mo粉末4の粒径
は、Re−W粉末層2の粒径よりも大きなものを
用いるものとし、次工程の焼結時の収縮率が一致
する粉末粒径を選択するとが望ましい。焼結時の
Re−W粉末層2の剥離を回避するためである。 The particle size of the pure Mo powder 4 covering the material powder 3 shall be larger than that of the Re-W powder layer 2, and the particle size of the pure Mo powder 4 that matches the shrinkage rate during sintering in the next step shall be used. It is desirable to select . during sintering
This is to avoid peeling of the Re-W powder layer 2.
次に、焼結工程bにおいて、1800℃の焼結温度
で、粉末材料3を焼結し、Mo層7とRe−W合金
層8とを形成する材料層5と、同時に純Mo粉末
4を焼結してなる被覆層6とが形成される。 Next, in the sintering step b, the powder material 3 is sintered at a sintering temperature of 1800°C to form the material layer 5 that forms the Mo layer 7 and the Re-W alloy layer 8, and the pure Mo powder 4 at the same time. A sintered covering layer 6 is formed.
よつて、材料層5の表面は被覆層6に覆われる
ことから、焼結炉の炉材や高温不純物等により
Re−W合金層8の表面が異物汚染される心配は
なく、表面の微小クラツクや、微小な異物の付着
による表面の結晶組織の異常を防止し、結果的
に、割れの一原因を除去することになる。尚、粉
末プレス工程a及び焼結工程bは、集合的に粉末
冶金工程と呼ばれても良い。 Therefore, since the surface of the material layer 5 is covered with the coating layer 6, it will not be affected by the furnace material of the sintering furnace, high-temperature impurities, etc.
There is no fear that the surface of the Re-W alloy layer 8 will be contaminated by foreign matter, and it prevents microcracks on the surface and abnormalities in the surface crystal structure due to attachment of microscopic foreign matter, and as a result, one cause of cracking is eliminated. It turns out. Note that the powder pressing process a and the sintering process b may be collectively referred to as a powder metallurgy process.
次に、熱間鍛造工程c、熱間成形工程dを被覆
層6に残したまま行う。これは、純Moからなる
被覆層6自身は、加工性が高いものであることか
ら、プレス等の不均一な応力の影響を低減するこ
とができるため、下層部のRe−W合金層8に対
し、ばらつきの少ない応力を与えることができる
からである。 Next, a hot forging step c and a hot forming step d are performed with the coating layer 6 remaining. This is because the coating layer 6 made of pure Mo has high workability and can reduce the influence of uneven stress from pressing, etc. On the other hand, this is because it is possible to apply stress with less variation.
その結果、層厚8〜18mmのMo層7、層厚約2
mmのRe−W合金層8、層厚約1mmの被覆層6が
得られ、図示する通りの形状に加工することがで
き、割れ、クラツク等の異常は認められなかつ
た。 As a result, a Mo layer 7 with a layer thickness of 8 to 18 mm, a layer thickness of approx.
A Re-W alloy layer 8 with a thickness of about 1 mm and a coating layer 6 with a thickness of about 1 mm were obtained, which could be processed into the shape shown in the figure, and no abnormalities such as cracks or cracks were observed.
最後に、製品切削工程eにおいて、材料層5を
被覆している被覆層6を旋盤加工、研磨により切
削し、或いは適当な酸等により溶解して所望の形
状の合金張り合わせ材料を得た。 Finally, in the product cutting step e, the coating layer 6 covering the material layer 5 was cut by lathe processing, polishing, or dissolved with an appropriate acid to obtain an alloy laminate material in a desired shape.
[発明の効果]
以上の説明のとおり、本発明によれば、粉末材
料と、粉末材料上に設けたMo粉末とを同時にプ
レス・焼結する粉末冶金工程を施すことにより、
製造工程中の材料割れを防止することができるか
ら、歩留りの良い、高品質のW又はW合金/Mo
又はMo合金材料を提供することができる。[Effects of the Invention] As described above, according to the present invention, by performing a powder metallurgy process of simultaneously pressing and sintering a powder material and Mo powder provided on the powder material,
It is possible to prevent material cracking during the manufacturing process, so it is a high-quality W or W alloy/Mo with a good yield.
Or Mo alloy material can be provided.
第1図は本発明の実施例に係わる製造工程を示
す工程図、第2図は従来の製造工程を示す工程図
である。
1……Mo粉末層、2……Re−W粉末層、3…
…粉末材料、4……純Mo粉末、5……材料層、
6……被覆層、7……Mo層、8……Re−W合金
層、a……粉末プレス工程、b……焼結工程、c
……熱間鍛造工程、d……熱間成形工程、e……
製品切削工程。
FIG. 1 is a process diagram showing a manufacturing process according to an embodiment of the present invention, and FIG. 2 is a process diagram showing a conventional manufacturing process. 1...Mo powder layer, 2...Re-W powder layer, 3...
...Powder material, 4...Pure Mo powder, 5...Material layer,
6... Coating layer, 7... Mo layer, 8... Re-W alloy layer, a... Powder pressing process, b... Sintering process, c
... Hot forging process, d... Hot forming process, e...
Product cutting process.
Claims (1)
粉末を設けてなる粉末材料と、該粉末材料上に設
けてなるMo粉末とに対し、プレス・焼結する粉
末冶金工程を施すことにより、前記粉末材料より
生成される材料層と、前記Mo粉末より生成され
る被覆層とを形成した後、前記材料層及び被覆層
に熱間鍛造及び熱間成形を施し、前記材料層を削
除することを特徴とするW又はW合金/Mo又は
Mo合金張り合わせ材料の製造方法。1. By applying a powder metallurgy process of pressing and sintering to a powder material in which W or W alloy powder is provided on Mo or Mo alloy powder and Mo powder provided on the powder material, After forming a material layer produced from the powder material and a coating layer produced from the Mo powder, hot forging and hot forming are performed on the material layer and the coating layer, and the material layer is removed. W or W alloy/Mo or
Method for manufacturing Mo alloy laminate material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15787A JPS63169307A (en) | 1987-01-06 | 1987-01-06 | Production of w or w alloy/mo or mo alloy clad material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15787A JPS63169307A (en) | 1987-01-06 | 1987-01-06 | Production of w or w alloy/mo or mo alloy clad material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63169307A JPS63169307A (en) | 1988-07-13 |
JPH049842B2 true JPH049842B2 (en) | 1992-02-21 |
Family
ID=11466203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15787A Granted JPS63169307A (en) | 1987-01-06 | 1987-01-06 | Production of w or w alloy/mo or mo alloy clad material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63169307A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT4240U1 (en) * | 2000-11-20 | 2001-04-25 | Plansee Ag | METHOD FOR PRODUCING AN EVAPORATION SOURCE |
EP2119808B1 (en) | 2007-02-09 | 2014-09-17 | JX Nippon Mining & Metals Corporation | Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same |
JP6258040B2 (en) * | 2014-01-14 | 2018-01-10 | 株式会社アライドマテリアル | Crucible for growing sapphire single crystal, method for growing sapphire single crystal, and method for producing crucible for growing sapphire single crystal |
CN110293223B (en) * | 2019-07-23 | 2022-03-22 | 金堆城钼业股份有限公司 | Preparation method of butterfly-shaped molybdenum-tungsten bimetal composite rotary target |
CN114959596B (en) * | 2021-12-23 | 2023-12-05 | 常州苏晶电子材料有限公司 | Molybdenum alloy cladding thermoforming process |
-
1987
- 1987-01-06 JP JP15787A patent/JPS63169307A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63169307A (en) | 1988-07-13 |
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